本研究主要以不同的超音波震盪之電流及能量作為銅打線製程的參數，並經由熱處理來觀察介面反應與介金屬化合物的相變化，以尋較好的條件使銅打線可擁有較好的可靠度。
研究當中指出，據有較高的USG PreBleed之打線製程的銅球會較為柔軟，並可減少鋁墊所受到的擠壓與損害，且對於介面所生成的介金屬化合物對照於較硬的銅球來的均勻及薄。
介金屬化合物的相變化在本研究也被探討，在150℃之不同時間的熱處理下，所產生的相包含有三種，分別為Cu9Al4 、CuAl及CuAl2，其結果於本論文最後說明之。

In this study, we used different current, power of ultrasonic vibration and heat treatments for copper wire bonding to investigate the interfacial reactions and phase transformations of intermetallic compounds for better reliability.
It was found that higher USG PreBleed of the wire bonding process led to softer copper balls and less extrusion and damage of aluminum pads, contributing to the more uniform and thinner intermetallic compounds.
At different stages of heat treatments at 150。C, the phase transformations of the IMC, including Cu9Al4, CuAl and CuAl2, were also studied. The results may be attributed to the kinetics and thermodynamics of the IMC.

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