本研究旨在探討不同銦(In)含量(1, 2, 3 wt.%)添加於Sn-1.5Ag-0.7Cu-0.05Ni(SACN)低銀無鉛銲料對銲點性質的影響。實驗內容包含顯微結構分析、微硬度分析、剪切試驗(含破斷面分析)、疲勞試驗，以及150℃高溫熱儲存(100、225、625小時)前後之銲點界面層組織分析，並在最後選取性質較好的成分銲料與SAC157及SACN銲料進行比較，以綜合評估含In銲料的可靠度表現。實驗結果顯示，當In添加於SACN銲料後，In能以替換固溶的形式存在於基地β-Sn與析出物中而形成β-(Sn,In)、(Cu,Ni)6(Sn,In)5與Ag-Sn-In化合物，其中In主要固溶於Ag-Sn-In化合物，形貌上為條物狀，隨著In的添加量增加，Ag-Sn-In化合物轉變為尺寸較長的條狀化合物。機械性質方面，銲料硬度和剪切強度均隨著In添加量的增加而有所提升。疲勞試驗方面則是以SACN-1In擁有較佳的疲勞壽命，然而隨著In含量的增多，疲勞壽命逐漸減少，塑性變形量也有所回升，實驗結果顯示In的添加量為1 wt.%擁有較佳的性質表現。在銲點界面層組織方面，熱儲存前以SACN-1In擁有最小界面層，隨著In含量提高，其銲點界面層有增厚的趨勢。當完成625小時熱儲存，各成分銲料之界面層生長速率逐漸減緩，其中以較高的In含量擁有較顯著的Cu3Sn抑制效果。研究結果顯示所有含In銲料於時效前後之界面層厚度相較SAC157與SACN都來得薄，表明添加In能提升銲料的抗熱性。綜合上述各項試驗結果，本研究顯示In能提升SACN銲料性能，並評估以1 wt.%的In添加量擁有較好的銲點可靠度。

The purpose of this study is to investigate the effects of the addition of indium elements (1, 2, 3 wt.%) on the microstructure and the mechanical properties of low-silver lead-free solder Sn-1.5Ag-0.7Cu-0.05Ni (SACN). This study also examined the effect of In addition on interfacial layers (IMC layer) with the pre- and post-thermal aging test (150℃, 100hrs, 225hrs, 625hrs). Finally, the solder with better properties was compared with SAC157 and SACN to comprehensively evaluate the reliability of In-containing solders.The experimental results show that when Indium is added to SACN solder, Indium can be dissolved in base β-Sn, precipitates of Ag3Sn and (Cu,Ni)6Sn5, forming β-(Sn,In), Ag-Sn-In compounds, and (Cu,Ni)6(Sn,In)5. As Indium is mainly dissolved in Ag-Sn-In compounds with its morphology changing from short strip-like shape to longer strip-like shape, it is speculated that Ag-Sn-In compounds have significant influence on the mechanical properties of solder joints. In terms of mechanical properties of solder joints, both the hardness and shear strength increase as the amount of Indium increases. In the fatigue test, SACN with 1wt.% In addition shows the best fatigue life, while the solders with more indium have the poorer fatigue life, showing a larger plastic deformation. In terms of the IMC layer, SACN-1In has thickness of thinnest IMC thickness before thermal aging. As the indium content increases, the IMC layer tends to increase. When the 625-hour thermal aging is completed, the growth rate of IMC layer of each component solder is gradually slowed down. It is noted that the IMC layers in all In-containing solders are thinner than that of SAC157 and SACN. In addition, solders with higher indium content have more significant Cu3Sn suppression effect, which indicates that adding In to SACN can have good heat resistance. Based on the above test results, this study shows that In can improve the performance of SACN. The addition of In by 1 wt.% demonstrates better properties than other low-silver SACN lead-free solder with or without In addition.

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