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研究生: 魏燦富
wei, Tsan-fu
論文名稱: 雷射引發薄膜剝離機制研究
A study of the laser spallation on thin film substrate
指導教授: 林震銘
Lin, Jehnming
學位類別: 碩士
Master
系所名稱: 工學院 - 機械工程學系
Department of Mechanical Engineering
論文出版年: 2004
畢業學年度: 92
語文別: 中文
論文頁數: 112
中文關鍵詞: 雷射剝離技術雷射
外文關鍵詞: laser, laser spallation
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  •   本文主要以有限元素法模擬短脈衝雷射引發薄膜剝離技術,對於其作用機制做探討,研究模擬分為兩部分,第一部分為雷射回彈壓力導致薄膜剝離之分析,在此部分採用單純力學模式來計算電漿回彈壓力造成體波於試件中傳遞之現象,並計算出薄膜之剝離範圍。另一部分為雷射熱應力導致薄膜剝離分析,考慮隨時間變化之高斯分佈熱源照射於具熱彈塑性行為之材料表面,以熱-機非耦合分析(Uncoupled thermal-mechanical analysis)的模式來模擬熱應力造成之體波傳遞現象,進而求出薄膜剝離之範圍。在實驗中,本研究使用Nd-YAG雷射,加熱於施行單面電鍍之底材表面,且在底材表面加一玻璃作為覆蓋物質,使試件薄膜表面產生剝離之現象,且分別針對試件底材厚度與薄膜厚度等製程參數進行討論,並與模擬計算結果做比較。
      研究結果顯示,底材厚度愈小、薄膜厚度愈大其薄膜愈容易剝離,而底材厚度愈大、薄膜厚度愈大其薄膜剝離範圍愈大。

      The object of this thesis is to analyze the laser spallation on thin film substrate with the finite element method. The thesis was divided into two parts: the thin film spallation problem induced by plasma recoil pressure and thermal stress.

      Nd-YAG laser with Gaussian mode intensity was used as a pulse energy source to heat the 304 stainless steel plates electroplated with copper film. The laser beam was focused on steel surface to generate bulk wave to spall the copper film in this study. In the analysis of thin film spallation induced by plasma recoil pressure, the propagation of elastic-plastic stress wave was simulated numerically. The non-linear finite element method software, ABAQUS, was used to simulate the stress wave problem for a mechanical system in two-dimensional domain. The stress distribution, stress of thin film surface and interface during the laser spallation process were calculated.

      In the analysis of thin film spallation induced by thermal stress, the propagation of thermal stress wave was simulated numerically. The non-linear finite element method software, ABAQUS, was used to simulate the stress wave problem for an uncoupled thermal- mechanical system in two-dimensional domain. The stress distribution, stress of thin film surface and interface during the laser spallation process were also calculated. The process parameters affecting the thin film spallation were also investigated in both parts by FEM simulation.

      It was shown that the thinner substrate or the thicker film made the film spallation easier. The spallation diameter increases with the thickness of substrate and film.

    中文摘要……………………………………………………………….. Ⅰ 英文摘要……………………………………………………………….. Ⅱ 誌謝…………………………………………………………………….. Ⅲ 目錄…………………………………………………………………….. Ⅳ 表目錄………………………………………………………………….. Ⅷ 圖目錄………………………………………………………………….. Ⅸ 符號說明……………………………………………………………….. XⅤ 第一章 緒論………………..…………………………………………1 1.1 研究背景及目的……………………………………………… 1 1.2 文獻回顧………………….…………………………………2 1.3 本文架構………………….…………………………………7 第二章 物理方程式與數值分析理論…………………………………9 2.1體波傳遞概論與數學理論……………………………………. 9 2.2應力波於介面透射與反射理論………………………………. 13 2.3回彈壓力公式推導.…………………………………………… 15 2.4 有限元素分析理論…………………………………………… 18 2.4.1 熱傳模式………………………………………………. 18 2.4.1.1 基本假設……………………………………….. 18 2.4.1.2 熱能量平衡方程式…………………………….. 18 2.4.1.3 有限元素程式化……………………………….. 19 2.4.2 力學模式……………………………………………..... 21 2.4.2.1 基本假設……………………………………….. 21 2.4.2.2 應力應變增量關係…………………………….. 21 2.4.2.2.1 彈性應變增量…………………………… 22 2.4.2.2.2熱應變增量………………………………. 22 2.4.2.2.3 塑性應變增量…………………………… 23 2.4.2.3 運動方程式…………………………………….. 25 2.4.2.4 有限元素程式化……………………………….. 26 2.5分析軟體簡介…………………………………………………. 30 第三章 有限元素分析…………………………………………………. 32 3.1 雷射回彈壓力導致薄膜剝離之暫態分析…….……………... 33 3.1.1 ABAQUS 範例驗證…………………………………… 33 3.1.2 試件幾何尺寸與有限元素模型……………………..... 35 3.1.3 材料性質………………………………………………. 36 3.1.4 初始條件與邊界條件…………………………………. 37 3.1.5 分析過程………………………………………………. 38 3.1.6 雷射引發回彈壓力導致薄膜剝離之定性描述……..... 38 3.1.7 數值結果………………………………………………. 40 3.1.7.1薄膜厚度的影響………………………………… 40 3.1.7.2 底材厚度的影響……………………………….. 45 3.1.7.3應力影響區分析………………………………… 51 3.1.7.4應變率的影響…………………………………… 54 3.2 雷射熱應力導致薄膜剝離之熱-機非耦合分析…………….. 58 3.2.1 試件幾何尺寸與有限元素模型………………………. 58 3.2.2 材料性質………………………………………………. 60 3.2.3 入熱條件………………………………………………. 61 3.2.4 初始條件與邊界條件…………………………………. 63 3.2.5 分析過程………………………………………………. 65 3.2.6 雷射熱應力導致薄膜剝離之定性描述………………. 66 3.2.7 數值結果………………………………………………. 67 3.2.7.1 網格取法與溫度分佈………………………….. 67 3.2.7.2 薄膜厚度的影響……………………………….. 70 3.2.7.3 底材厚度的影響……………………………….. 76 3.2.7.4 應力影響區分析……………………………….. 81 3.2.7.5應變率的影響…………………………………… 82 3.3 熱-機非耦合與回彈壓力暫態分析之比較………………….. 85 第四章 雷射剝離試驗………………………………………………… 91 4.1 電鍍原理與實驗操作.……………………………………….. 91 4.2 雷射剝離實驗配置與步驟…………………………………… 93 4.3 雷射剝離實驗結果與討論…………………………………… 95 4.4 實驗與數值模擬結果比較…………………………………… 101 第五章 綜合討論與建議………………………………………………. 104 5.1 綜合討論…………………………………………………….. 104 5.2相關建議與未來發展……………………….……………….. 105 參考文獻……………………………………………………………….. 107 附錄A………………………………………………………………….. 110 自述…………………………………………………………………….. 112

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