| 研究生: |
郭威廷 Guo, Wei-Ting |
|---|---|
| 論文名稱: |
鋅錫銅高溫無鉛銲錫合金微結構與拉伸性質之研究 The Microstructure and Tensile Properties of Zn-25Sn-xCu High Temperature Pb-free Solder Alloys |
| 指導教授: |
林光隆
Lin, Kwang-Lung |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 材料科學及工程學系 Department of Materials Science and Engineering |
| 論文出版年: | 2017 |
| 畢業學年度: | 105 |
| 語文別: | 中文 |
| 論文頁數: | 123 |
| 中文關鍵詞: | 高溫無鉛銲錫 、鋅錫合金 、銅元素添加 、微結構 、拉伸性質 |
| 外文關鍵詞: | High temperature Pb-free solder, Zn-Sn alloy, Cu addition, Microstructure, Tensile properties |
| 相關次數: | 點閱:149 下載:1 |
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本研究探討銅元素的添加(0.1, 0.3, 0.5, 1, 1.5 wt%)對Zn-25Sn合金微結構、熱性質及機械性質之影響;微結構觀察結果顯示,合金中包含富鋅相(η-Zn)、富錫相(β-Sn)及針棒狀錫鋅共晶組織,所添加之銅元素大多散佈在富鋅相中,當銅元素添加量≦0.3 wt%時,具有使富鋅相尺寸細化的效果,當銅元素添加量≧0.5 wt%時,合金中會生成ε-CuZn5介金屬化合物;熱性質量測結果顯示,隨著銅元素添加量的增加,合金液相線溫度有上升的趨勢,但對於合金固相線溫度及過冷度並無太大的影響;硬度量測結果顯示,隨著銅元素添加量的增加,合金硬度有上升的趨勢,當銅元素添加量為1.5 wt%時,合金硬度達最大值60.1 Hv;常溫拉伸試驗結果顯示,隨著銅元素添加量的增加,合金強度有上升的趨勢,延展性則有下降的趨勢,當銅元素添加量為1 wt%時,合金強度達最大值72.5 MPa;高溫拉伸試驗結果顯示,當合金在高溫環境(100℃)下進行拉伸試驗時,與常溫拉伸性質相比較,合金強度皆下降,延展性則皆上升,而隨著銅元素添加量的增加,其趨勢與常溫拉伸試驗結果相同,當銅元素添加量為1 wt%時,合金強度達最大值38.9 MPa。
This study investigated the effect of different Cu addition on microstructure, thermal properties, and mechanical properties of Zn-25Sn solder alloys.
The microstructure observation shows that the alloys consist of η-Zn phase, β-Sn phase and eutectic structure. The Cu added distributed across the η-Zn phase. As the amount of Cu addition is less than or equal to 0.3 wt%, the size of η-Zn phase will decrease. As the amount of Cu addition is greater than or equal to 0.5 wt%, ε-CuZn5 intermetallic compounds were formed in alloys. The results of differential scanning calorimetry indicate that the liquidus temperature of alloys increase with increasing Cu addition. Nevertheless, the addition of Cu exhibits little effects on solidus temperature and undercooling of alloys. The measure of microhardness testing show that the microhardness of alloys increase with increasing Cu addition. The maximum microhardness (60.1 Hv) occurs with 1.5 wt% Cu addition. The results of tensile testing at room temperature indicate that the tensile strength of alloys increase with increasing Cu addition; on the other hand, the elongation of alloys decreases with increasing Cu addition. The maximum ultimate tensile strength (72.5 Mpa) occurs with 1 wt% Cu addition. The results of tensile testing at 100℃ indicate that the tensile strength of alloys increase with increasings Cu addition, while the elongation of alloys decreases with increasing Cu addition. The maximum ultimate tensile strength (38.9 MPa) occurs with 1 wt% Cu addition.
[1] R. Tummala, E. J. Rymaszewski, and A. G. Klopfenstein, Microelectronics Packaging Handbook: Technology Drivers, Springer Science & Business Media, p. 13, 2012.
[2] M. Datta, T. Osaka, and J. W. Schultze, Microelectronic Packaging, CRC press, pp. 15-20, 2004.
[3] H. K. Charles Jr, "Microelectronic Packaging: Electrical Interconnections," in Encyclopedia of Materials: Science and Technology, R. W. Cahn, M. C. Flemings, B. Ilschner, E. J. Kramer, S. Mahajan, and P. Veyssière, Eds., pp. 5616-5635, 2001.
[4] R. K. Ulrich and W. D. Brown, Advanced Electronic Packaging, Wiley Hoboken, NJ, p. 7, 2006.
[5] N.-C. Lee, Reflow Soldering Processes, Elsevier, pp. 5-78, 2002.
[6] P. T. Vianco and D. R. Frear, "Issues in the Replacement of Lead-Bearing Solders," JOM Journal of the Minerals, Metals and Materials Society, vol. 45, pp. 14-19, 1993.
[7] M. Abtew and G. Selvaduray, "Lead-free Solders in Microelectronics," Materials Science and Engineering: R: Reports, vol. 27, pp. 95-141, 2000.
[8] K. Suganuma, "Advances in Lead-free Electronics Soldering," Current Opinion in Solid State and Materials Science, vol. 5, pp. 55-64, 2001.
[9] K. Zeng and K. N. Tu, "Six Cases of Reliability Study of Pb-free Solder Joints in Electronic Packaging Technology," Materials Science and Engineering: R: Reports, vol. 38, pp. 55-105, 2002.
[10] S. W. Yoon, J. R. Soh, H. M. Lee, and B.-J. Lee, "Thermodynamics-aided Alloy Design and Evaluation of Pb-free Solder, Snbiinzn System," Acta Materialia, vol. 45, pp. 951-960, 1997.
[11] H. Ma and J. C. Suhling, "A Review of Mechanical Properties of Lead-free Solders for Electronic Packaging," Journal of Materials Science, vol. 44, pp. 1141-1158, 2009.
[12] K. Suganuma, S.-J. Kim, and K.-S. Kim, "High-Temperature Lead-free Solders: Properties and Possibilities," JOM Journal of the Minerals, Metals and Materials Society, vol. 61, pp. 64-71, 2009.
[13] S. Menon, E. George, M. Osterman, and M. Pecht, "High Lead Solder (over 85%) Solder in the Electronics Industry: RoHS Exemptions and Alternatives," Journal of Materials Science: Materials in Electronics, vol. 26, pp. 4021-4030, 2015.
[14] V. Chidambaram, J. Hattel, and J. Hald, "High-Temperature Lead-free Solder Alternatives," Microelectronic Engineering, vol. 88, pp. 981-989, 2011.
[15] G. Zeng, S. McDonald, and K. Nogita, "Development of High-Temperature Solders: Review," Microelectronics Reliability, vol. 52, pp. 1306-1322, 2012.
[16] A. Haque, B. Lim, A. Haseeb, and H. Masjuki, "Die Attach Properties of Zn–Al–Mg–Ga Based High-Temperature Lead-free Solder on Cu Lead-Frame," Journal of Materials Science: Materials in Electronics, vol. 23, pp. 115-123, 2012.
[17] R. W. Johnson, J. L. Evans, P. Jacobsen, J. R. Thompson, and M. Christopher, "The Changing Automotive Environment: High-Temperature Electronics," IEEE Transactions on Electronics Packaging Manufacturing, vol. 27, pp. 164-176, 2004.
[18] V. R. Manikam and K. Y. Cheong, "Die Attach Materials for High Temperature Applications: a Review," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, pp. 457-478, 2011.
[19] P. Dreike, D. Fleetwood, D. King, D. Sprauer, and T. Zipperian, "An Overview of High-Temperature Electronic Device Technologies and Potential Applications," IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol. 17, pp. 594-609, 1994.
[20] D. R. Frear, "Materials Issues in Area-Array Microelectronic Packaging," JOM Journal of the Minerals, Metals and Materials Society, vol. 51, p. 22, 1999.
[21] T. B. Massalski, H. Okamoto, P. R. Subramanian, and L. Kacprzak, "Binary Alloy Phase Diagrams," ASM, Metals Park, 1986.
[22] J.-E. Lee, K.-S. Kim, K. Suganuma, J. Takenaka, and K. Hagio, "Interfacial Properties of Zn–Sn Alloys as High Temperature Lead-free Solder on Cu Substrate," Materials Transactions, vol. 46, pp. 2413-2418, 2005.
[23] K. S. Kim, S. H. Huh, and K. Suganuma, "Effects of Fourth Alloying Additive on Microstructures and Tensile Properties of Sn–Ag–Cu Alloy and Joints with Cu," Microelectronics Reliability, vol. 43, pp. 259-267, 2003.
[24] S.-J. Kim, K.-S. Kim, S.-S. Kim, C.-Y. Kang, and K. Suganuma, "Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application," Materials Transactions, vol. 49, pp. 1531-1536, 2008.
[25] J.-M. Song, H.-Y. Chuang, and Z.-M. Wu, "Interfacial Reactions between Bi-Ag High-Temperature Solders and Metallic Substrates," Journal of Electronic Materials, vol. 35, pp. 1041-1049, 2006.
[26] N. Kang, H. S. Na, S. J. Kim, and C. Y. Kang, "Alloy Design of Zn–Al–Cu Solder for Ultra High Temperatures," Journal of Alloys and Compounds, vol. 467, pp. 246-250, 2009.
[27] V. Chidambaram, J. Hald, and J. Hattel, "Development of Gold Based Solder Candidates for Flip Chip Assembly," Microelectronics Reliability, vol. 49, pp. 323-330, 2009.
[28] Y. C. Liu, J. W. R. Teo, S. K. Tung, and K. H. Lam, "High-Temperature Creep and Hardness of Eutectic 80Au/20Sn Solder," Journal of Alloys and Compounds, vol. 448, pp. 340-343, 2008.
[29] V. Chidambaram, J. Hattel, and J. Hald, "Design of Lead-free Candidate Alloys for High-Temperature Soldering Based on the Au–Sn System," Materials & Design, vol. 31, pp. 4638-4645, 2010.
[30] R. R. Chromik, D. N. Wang, A. Shugar, L. Limata, M. R. Notis, and R. P. Vinci, "Mechanical Properties of Intermetallic Compounds in the Au–Sn System," Journal of Materials Research, vol. 20, pp. 2161-2172, 2011.
[31] D. Ivey, "Microstructural Characterization of Au/Sn Solder for Packaging in Optoelectronic Applications," Micron, vol. 29, pp. 281-287, 1998.
[32] J. H. Kim, S. W. Jeong, and H. M. Lee, "Thermodynamics-aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications," Materials Transactions, vol. 43, pp. 1873-1878, 2002.
[33] R. Koleňák and M. Chachula, "Characteristics and Properties of Bi-11Ag Solder," Soldering & Surface Mount Technology, vol. 25, pp. 68-75, 2013.
[34] J.-M. Song, H.-Y. Chuang, and T.-X. Wen, "Thermal and Tensile Properties of Bi-Ag Alloys," Metallurgical and Materials Transactions A, vol. 38, pp. 1371-1375, 2007.
[35] J. E. Spinelli, B. L. Silva, and A. Garcia, "Microstructure, Phases Morphologies and Hardness of a Bi–Ag Eutectic Alloy for High Temperature Soldering Applications," Materials & Design, vol. 58, pp. 482-490, 2014.
[36] J. N. Lalena, N. F. Dean, and M. W. Weiser, "Experimental Investigation of Ge-doped Bi-11Ag as a New Pb-free Solder Alloy for Power Die Attachment," Journal of Electronic Materials, vol. 31, pp. 1244-1249, 2002.
[37] M. Rettenmayr, P. Lambracht, B. Kempf, and M. Graff, "High Melting Pb‐free Solder Alloys for Die‐Attach Applications," Advanced Engineering Materials, vol. 7, pp. 965-969, 2005.
[38] M. Shimoda, T. Yamakawa, K. Shiokawa, H. Nishikawa, and T. Takemoto, "Effects of Ag Content on the Mechanical Properties of Bi-Ag Alloys Substitutable for Pb Based Solder," Transactions of JWRI, vol. 41, pp. 51-54, 2012.
[39] P. Fima, W. Gąsior, A. Sypień, and Z. Moser, "Wetting of Cu by Bi–Ag Based Alloys with Sn and Zn Additions," Journal of Materials Science, vol. 45, pp. 4339-4344, 2010.
[40] Y. Shi, W. Fang, Z. Xia, Y. Lei, F. Guo, and X. Li, "Investigation of Rare Earth-doped BiAg High-Temperature Solders," Journal of Materials Science: Materials in Electronics, vol. 21, pp. 875-881, 2010.
[41] T. Shimizu, H. Ishikawa, I. Ohnuma, and K. Ishida, "Zn-Al-Mg-Ga Alloys as Pb-free Solder for Die-Attaching Use," Journal of Electronic Materials, vol. 28, pp. 1172-1175, 1999.
[42] M. Rettenmayr, P. Lambracht, B. Kempf, and C. Tschudin, "Zn-Al Based Alloys as Pb-free Solders for Die Attach," Journal of Electronic Materials, vol. 31, pp. 278-285, 2002.
[43] A. Haque, B. H. Lim, A. S. M. A. Haseeb, and H. H. Masjuki, "Die Attach Properties of Zn–Al–Mg–Ga Based High-Temperature Lead-free Solder on Cu Lead-Frame," Journal of Materials Science: Materials in Electronics, vol. 23, pp. 115-123, 2011.
[44] I. Kostolný and R. Koleňák, "Effect of In Addition to Zn-5Al Solder on Microstructure and Properties of Solder Joints," Key Engineering Materials, vol. 723, pp. 357-362, 2016.
[45] X. Yang, W. Hu, X. Yan, and Y. Lei, "Microstructure and Solderability of Zn-6Al-xSn Solders," Journal of Electronic Materials, vol. 44, pp. 1128-1133, 2015.
[46] T. Gancarz, J. Pstruś, P. Fima, and S. Mosińska, "Thermal Properties and Wetting Behavior of High Temperature Zn-Al-In Solders," Journal of Materials Engineering and Performance, vol. 21, pp. 599-605, 2012.
[47] A. Haque, Y. Won, A. Haseeb, and H. Masjuki, "Investigations on Zn-Al-Ge Alloys as High Temperature Die Attach Material," in 3rd Electronic System-Integration Technology Conference (ESTC), IEEE, pp. 1-5, 2010.
[48] W. Tsai, Y. Hwu, C. Chen, L. Chang, J. Je, H. Lin, and G. Margaritondo, "Grain Boundary Imaging, Gallium Diffusion and the Fracture Behavior of Al–Zn Alloy–An in Situ Study," Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, vol. 199, pp. 457-463, 2003.
[49] F. Cheng, F. Gao, Y. Wang, Y. Wu, Z. Ma, and J. Yang, "Sn Addition on the Tensile Properties of High Temperature Zn–4Al–3Mg Solder Alloys," Microelectronics Reliability, vol. 52, pp. 579-584, 2012.
[50] J.-E. Lee, K.-S. Kim, K. Suganuma, M. Inoue, and G. Izuta, "Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-free Solder," Materials Transactions, vol. 48, pp. 584-593, 2007.
[51] S. Kim, K.-S. Kim, S.-S. Kim, and K. Suganuma, "Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders," Journal of Electronic Materials, vol. 38, pp. 266-272, 2008.
[52] S. Kim, K.-S. Kim, K. Suganuma, and G. Izuta, "Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-free Solders on Cu Substrates," Journal of Electronic Materials, vol. 38, pp. 873-883, 2009.
[53] K.-I. Chen, C.-H. Cheng, S. Wu, Y.-L. Jiang, and T.-C. Cheng, "Effects of Ga Addition on the Wetting Properties and Tensile Properties of Sn-Zn-Ag Solder Alloys," NISCAIR-CSIR, pp. 621-627, 2014.
[54] K.-I. Chen and K.-L. Lin, "Effects of Gallium on Wettability, Microstructures and Mechanical Properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga Solder Alloys," Proceedings of the 4th International Symposium on Electronic Materials and Packaging, IEEE, pp. 49-54, 2002.
[55] S. C. Cheng and K. L. Lin, "The Thermal Property of Lead-free Sn-8.55 Zn-1Ag-xAl Solder Alloys and Their Wetting Interaction with Cu," Journal of Electronic Materials, vol. 31, pp. 940-945, 2002.
[56] K.-L. Lin and T.-P. Liu, "High-Temperature Oxidation of a Sn-Zn-Al Solder," Oxidation of Metals, vol. 50, pp. 255-267, 1998.
[57] S. Kim, K.-S. Kim, G. Izuta, and K. Suganuma, "Reliability of Die Attached ALN-DBC Module Using Zn-Sn High Temperature Lead-free Solders," in the 2nd Electronic System-Integration Technology Conference (ESTC), IEEE, pp. 411-416, 2008.
[58] R. Mahmudi and M. Eslami, "Shear Strength of the Zn–Sn High-Temperature Lead-free Solders," Journal of Materials Science: Materials in Electronics, vol. 22, pp. 1168-1172, 2010.
[59] K. Subramanian, Lead-free Solders: Materials Reliability for Electronics vol. 41, John Wiley & Sons, pp. 1-7, 2012.
[60] G.-Q. Zhang, W. Van Driel, and X. Fan, Mechanics of Microelectronics vol. 141, Springer Science & Business Media, pp. 95-97, 2006.
[61] F.-Y. Hung, T.-S. Lui, L.-H. Chen, and J.-G. You, "Vibration Fracture Behavior of Sn–9Zn–xCu Lead-free Solders," Journal of Materials Science, vol. 42, pp. 3865-3873, 2007.
[62] J. R. Davis, Tensile Testing, ASM International, pp. 13-18, 2004.
[63] F. P. Beer, E. Johnston, J. T. Dewolf, and D. Mazurek, Mechanics of Materials, New York, NY: McGraw-Hill, pp. 52-63, 2012.
[64] J. Pelleg, Mechanical Properties of Materials vol. 190, Springer Science & Business Media, pp. 1-30, 2012.
[65] W. D. Callister Jr, Fundamentals of Materials Science and Engineering, Wiley, pp. 147-212, 2001.
[66] M. A. Meyers and K. K. Chawla, Mechanical Behavior of Materials vol. 2, Cambridge University Press Cambridge, pp. 558-590, 2009.
[67] C. Carlton and P. Ferreira, "What Is Behind the Inverse Hall–Petch Effect in Nanocrystalline Materials?," Acta Materialia, vol. 55, pp. 3749-3756, 2007.
[68] M. A. El-Khair, A. Daoud, and A. Ismail, "Effect of Different Al Contents on the Microstructure, Tensile and Wear Properties of Zn-based Alloy," Materials Letters, vol. 58, pp. 1754-1760, 2004.
[69] L. Li, Y. Liu, H. Gao, and Z. Gao, "Phase Formation Sequence of High-Temperature Zn–4Al–3Mg Solder," Journal of Materials Science: Materials in Electronics, vol. 24, pp. 336-344, 2012.
[70] F. Xing, Y. Lu, C. Luo, Y. Ruan, and X. Qiu, "Coupling Modification of Microstructure for Improving the Mechanical Properties of Zn-Sn-Cu-Bi High-Temperature Solder," Materials Letters, vol. 181, pp. 42-46, 2016.
[71] H.-C. Tu and K.-L. Lin, "Mechanical Property and Fracture Behavior of High Temperature Pb-free Solder," presented at the TMS Annual Meeting, San Antonio, TX, 2013.
[72] X. Niu and K.-L. Lin, "The Microstructure and Mechanical Properties of Zn-25Sn-xAl (X= 0–0.09 Wt%) High Temperature Lead free Solder," Materials Science and Engineering: A, vol. 677, pp. 384-392, 2016.
[73] A. El-Daly, W. Desoky, A. Saad, N. Mansor, E. Lotfy, H. Abd-Elmoniem, and H. Hashem, "The Effect of Undercooling on the Microstructure and Tensile Properties of Hypoeutectic Sn–6.5Zn–xCu Pb-free Solders," Materials & Design, vol. 80, pp. 152-162, 2015.
[74] Y. Min, L. Xiuzhong, L. Xinghong, and D. Jiahui, "Development of Sn-Zn-Cu Lead free Solder," the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, pp. 784-788, 2010.
[75] D. Yu, H. Xie, and L. Wang, "Investigation of Interfacial Microstructure and Wetting Property of Newly Developed Sn–Zn–Cu Solders with Cu Substrate," Journal of Alloys and Compounds, vol. 385, pp. 119-125, 2004.
[76] J.-E. Lee, K.-S. Kim, M. Inoue, J. Jiang, and K. Suganuma, "Effects of Ag and Cu Addition on Microstructural Properties and Oxidation Resistance of Sn–Zn Eutectic Alloy," Journal of Alloys and Compounds, vol. 454, pp. 310-320, 2008.
[77] Z. Liu, F. Wang, D. Qiu, J. A. Taylor, and M. Zhang, "The Effect of Solute Elements on the Grain Refinement of Cast Zn," Metallurgical and Materials Transactions A, vol. 44, pp. 4025-4030, 2013.
[78] Z. Liu, D. Qiu, F. Wang, J. A. Taylor, and M. Zhang, "Crystallography of Grain Refinement in Cast Zinc–Copper Alloys," Journal of Applied Crystallography, vol. 48, pp. 890-900, 2015.
[79] E. Martinez, J. Montemayor-Aldrete, D. Munoz-Andrade, and G. Torres-Villaseñor, "Discussion of “Effects of Tensile Stress on Microstructural Change of Eutectoid Zn-Al Alloy”," Metallurgical and Materials Transactions A, vol. 27, pp. 3330-3332, 1996.
[80] J. M. Ji, H. H. Shao, G. C. Meng, and D. Q. Gu, "Organization and Performance of the Novel High Aluminum Zinc-based Alloy," in Advanced Materials Research, Trans Tech Publications, pp. 705-710, 2013.
[81] R. Abbaschian and R. E. Reed-Hill, Physical Metallurgy Principles, Cengage Learning, p. 342, 2008.
[82] C.-Y. Chou and S.-W. Chen, "Phase Equilibria of the Sn–Zn–Cu Ternary System," Acta Materialia, vol. 54, pp. 2393-2400, 2006.
[83] D. B. Williams and C. B. Carter, Transmission Electron Microscopy, Springer, p. 301, 1996.
[84] P. Partridge, "The Crystallography and Deformation Modes of Hexagonal Close-packed Metals," Metallurgical Reviews, vol. 12, pp. 169-194, 1967.
[85] T. Massalski and H. King, "The Lattice Spacing Relationships in Hcp ϵ and η Phases in the Systems Cu-Zn, Ag-Zn; Au-Zn and Ag-Cd," Acta Metallurgica, vol. 10, pp. 1171-1181, 1962.
[86] B. Predel, "Cu-Zn (Copper-Zinc)," in Cr-Cs–Cu-Zr, O. Madelung, Ed., Berlin, Heidelberg, Springer, pp. 1-11, 1994.
[87] H. Y. Lu, H. Balkan, and K. Simon, "Solid-Liquid Reactions: The Effect of Cu Content on Sn-Ag-Cu Interconnects," JOM Journal of the Minerals, Metals and Materials Society, vol. 57, pp. 30-35, 2005.
[88] J. F. Shackelford, Y.-H. Han, S. Kim, and S.-H. Kwon, CRC Materials Science and Engineering Handbook, CRC press, pp. 15-17, 2016.
[89] J. Campbell, Complete Casting Handbook: Metal Casting Processes, Metallurgy, Techniques and Design, Butterworth-Heinemann, pp. 341-346, 2015.
[90] D. R. Lide, CRC Handbook of Chemistry and Physics, 84th Edition, CRC Press, pp. 126-129, 219-220, 2003.
[91] J. Ballesteros, C. Gomez-Solis, L. Torres-Martinez, and I. Juárez-Ramírez, "Electrodeposition of Cu-Zn Intermetallic Compounds for Its Application as Electrocatalyst in the Hydrogen Evolution Reaction," International Journal of Electrochemical Science, vol. 10, pp. 2892-2903, 2015.
[92] Y. Kaygısız, S. Akbulut, Y. Ocak, K. Keşlioğlu, N. Maraşlı, E. Çadırlı, and H. Kaya, "Experimental Determination of Solid–Solid and Solid–Liquid Interfacial Energies of Solid ε (CuZn5) in the Zn–Cu Alloy," Journal of Alloys and Compounds, vol. 487, pp. 103-108, 2009.
[93] D. Stefanescu, J. Davis, and J. Destefani, "Metals Handbook: Casting," ASM International, vol. 15, p. 1739, 1988.
[94] T. Sakai, A. Belyakov, R. Kaibyshev, H. Miura, and J. J. Jonas, "Dynamic and Post-dynamic Recrystallization under Hot, Cold and Severe Plastic Deformation Conditions," Progress in Materials Science, vol. 60, pp. 130-207, 2014.
[95] R. Honeycombe and R. Pethen, "Dynamic Recrystallization," Journal of the Less Common Metals, vol. 28, pp. 201-212, 1972.
[96] G. E. Dieter and D. J. Bacon, Mechanical Metallurgy vol. 3, McGraw-Hill New York, pp. 256-258, 1986.
[97] Z. Haidong, I. Shohji, M. Shimoda, and H. Watanabe, "Effect of Strain Rate and Temperature on Tensile Properties of Bi-based Lead-free Solder," Materials Transactions, vol. 57, pp. 873-880, 2016.
[98] X. Shi, W. Zhou, H. Pang, and Z. Wang, "Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy," Journal of Electronic Packaging, vol. 121, pp. 179-185, 1999.
[99] X. Chen, J. Zhou, F. Xue, and Y. Yao, "Mechanical Deformation Behavior and Mechanism of Sn-58Bi Solder Alloys under Different Temperatures and Strain Rates," Materials Science and Engineering: A, vol. 662, pp. 251-257, 2016.
[100] I. Shohji, T. Yoshida, T. Takahashi, and S. Hioki, "Tensile Properties of Sn–Ag Based Lead-free Solders and Strain Rate Sensitivity," Materials Science and Engineering: A, vol. 366, pp. 50-55, 2004.
[101] F. Lang, H. Tanaka, O. Munegata, T. Taguchi, and T. Narita, "The Effect of Strain Rate and Temperature on the Tensile Properties of Sn–3.5 Ag Solder," Materials characterization, vol. 54, pp. 223-229, 2005.
[102] F. Che, W. Zhu, E. S. Poh, X. Zhang, and X. Zhang, "The Study of Mechanical Properties of Sn–Ag–Cu Lead-free Solders with Different Ag Contents and Ni Doping under Different Strain Rates and Temperatures," Journal of Alloys and Compounds, vol. 507, pp. 215-224, 2010.
[103] K. Mills, J. R. Davis, J. D. Destefani, D. A. Dieterich, H. J. Frissell, G. M. Crankovic, and D. M. Jenkins, "Metals Handbook: Fractography," ASM International, vol. 12, pp. 34-86, 1987.
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