纖維強化高分子複合材料(Fiber-reinforced Polymer Composites)為目前重要的熱管理材料(Thermal management materials)之一，其優點是質輕易加工，但缺點則是由於纖維的存在導致熱傳導的異向性。鑑於此，本研究以物理氣相沈積法(PVD)將銅膜鍍於碳纖維/環氧樹脂複合基材表面，期望藉此改進基材之熱傳導性。

本實驗將銅膜濺鍍於不同碳纖維方向及不同厚度的複合基材上，以雷射閃光(Laser Flash)測量其熱傳導係數，並以理論公式計算出有效熱傳導係數(Keff)，作為比較。在偏壓為-90V的濺鍍條件下，銅膜有最佳的附著性質及較低的電阻係數，故以其為最佳濺鍍條件。

對於複合基材而言，碳纖維的方向對基材的熱傳導影響很大。碳纖維軸方向平行於熱傳遞方向之基材(S⊥)有較佳的熱傳導係數，且隨著鍍於表面的銅膜厚度越厚，熱傳導係數越高。若於厚度各為1mm及3mm的此種基材(碳纖維軸方向與熱傳遞方向平行)表面鍍上0.5、3、10、20、40μm的銅膜，則發現隨著銅膜厚度越厚，基材的熱傳導係數皆越高且兩基材整體的熱傳導係數相近，唯獨當膜厚為40μm時，1mm的基材整體之熱傳導係數較高，為5.5W/mk，比基材本身的熱傳導係數提高了54%，且達有效熱傳導係數之60%。因此，於複合材料表面鍍銅膜，對於幫助整體熱傳導值的提昇是有明顯助益的。

Carbon Fiber/epoxy composite is one of the important thermal management materials but its disadvantages are relatively low thermal conductivity. In order to resolve this problem, physical vapor deposition (PVD) process was used to deposit copper films on carbon fiber/epoxy composite in this work.

The substrates have different thickness and fiber direction, and copper film was deposited on them in different film thickness. The thermal conductivity (K) of the substrates and the as-deposited samples is measured by laser flash and compared with the theoretical effective thermal conductivity (Keff).

The experimental result revealed that copper films would have good adhesion with the substrate and lower electrical resistivity by sputtering with bias voltage of -90V, so, it was the best sputtering condition.

The results also showed that the thermal conductivity of the substrate with fiber axis paralleling to heat flow (S⊥) will be as good as 3.6W/mk. With film thickness up to 40μm , it would increase to 4.91 W/mk. When the thickness of S⊥ decrease to 1mm, the K value would become 5.5W/mk which was 60% of the Keff value and increase 54% of the thermal conductivity of S⊥ itself.

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