本實驗使用2,2-雙-4-胺基苯氧苯丙烷、1,3-雙-4-胺基苯氧苯和兩種不同當量的雙胺基聚矽氧烷等四種雙胺，並依不同比例與偏苯三酸酐反應成二醯亞胺基雙酸中間產物，再與二苯甲烷-4,4-二異氰酸酯直接聚縮合反應成各種組成的聚醯胺-醯亞胺。
合成出之聚醯胺-醯亞胺的固有黏度範圍在0.42～0.72dl/g。在熱性質方面，聚醯胺-醯亞胺的玻璃轉移溫度在181～288℃，在氮氣環境中5％的熱重損失溫度在440～533℃，銲錫爐中的耐熱溫度皆在250℃以上。整體來說，聚醯胺-醯亞胺的熱性質隨著含矽雙胺增加而變差，但溶解度隨著含矽雙胺的增加而增加。
合成出之聚醯胺-醯亞胺的應力介於18.3～88.7MPa，初始模數在0.2～2GPa之間，其應變量介於2.7～63％之間。聚醯胺-醯亞胺的機械性質隨著含矽雙胺增加而變得柔軟且具韌性。
聚醯胺-醯亞胺與Bis A環氧樹脂的交聯結構，可使聚醯胺-醯亞胺的玻璃轉移溫度提高10～40℃之間。

Four kinds of diamines : 2,2-Bis[4-(4-aminophenoxy) phenyl]
propane (BAPP) and 1,3-Bis(4-aminophenoxy)benzene (APB) and two poly(siloxane)diamines of different equivalent amine weight in various mole ratio were reacted with trimellitic anhydride (TMA) to form the diimide-dicarboxylic acid intermediates. The diimide-dicarboxylic acid intermediates were farther reacted with 4,4-diphenylmethane diisocyanate (MDI) by the direct polycondensation to yield a series of polyamide-imides.
The inherent viscosity of polyamide-imides were ranged from 0.42~0.72dl/g. The glass transition temperatures (Tg) were ranged from 181~288oC and the weight-loss temperatures (Td) in nitrogen gas were ranged from 440~533oC and the solder resistane temperatures were above 250oC.In general, the thermal properties of the polyamide-imides decreased with the increase in diaminopoly(siloxane)s content, while the solubilities increased.
For all polyamide-imides synthesized,the stress at break were in the range of 18.3～88.7MPa and the initial modulus were in the range of 0.2～2Gpa and the strain at break were in the range of 2.7～63％.The mechanical properties of the polyamide-imides became softer and tougher with the increase in diaminopoly(siloxane)s content.
Bisphenol A epoxy resin was cured with the polyamide-imides synthesized.The crosslinked structure of the cured products raised the Tgs of the polyamide-imide by 10~40 degree.

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