本研究以陰離子聚合法(Anionic Living Polymerization，ALP)搭配正丁基鋰離子起始劑(n-BuLi Initiator)製備末端具側鏈雙鍵的聚異戊二烯-聚異戊二烯-聚苯乙烯(1,2-和3,4-addition PI-b-1,4-addition PI-b-PS，IIS)三嵌段團鏈共聚物。三嵌段團鏈共聚物根據1H NMR分析的結果顯示，IIS中PI鏈段結構的1,2-和3,4-addition (Vinyl group)結構含量在13.3% – 41.7%範圍內，其含量可通過調整反應溫度和四氫呋喃(THF)的添加量來控制。GPC量測IIS的Mn和PDI分別在11,000–13,000 Da和1.08–1.16之間。DSC熱性質分析曲線上存在著PI和PS相的兩個玻璃轉變溫度(Tg)點，其中，較低Tg的數值與嵌段共聚物中PI的Vinyl group含量有關；PI中的Vinyl group結構含量愈低Tg愈低， Tg值分別為–53 ℃至–20℃之間。進一步的應用於聚氧二甲苯(Polyphenylene ether, PPE)摻混改質方面，PPE與上述PI Vinyl group含量為40% – 45%的三嵌段團鏈共聚物IIS進行摻混，能有效降低摻混體的介電損耗 (Dissipation factor, Df)，並提升其與銅箔間的剝離強度，將PPE與IIS以特定配方摻混，剝離強度可提升至5.87 lb/in；另外，以PPE/IIS為80/20的重量比例進行摻混，介電損耗能從0.0027降低至0.0017，優於5G通訊硬體中的材料規格。

This study utilizes Anionic Living Polymerization (ALP) in conjunction with n-Butyllithium (n-BuLi) initiator to synthesize a triblock copolymer with pendant double bonds at the chain ends, consisting of polyisoprene-polyisoprene-polystyrene (1,2- and 3,4-addition PI-b-1,4-addition PI-b-PS, denoted as IIS). According to the results of 1H NMR analysis, the content of the 1,2- and 3,4-addition (Vinyl group) structures in the PI segments of IIS falls within the range of 13.3% to 41.7%. This content can be controlled by adjusting reaction temperature and the amount of tetrahydrofuran (THF) added.
Gel Permeation Chromatography (GPC) measurements reveal Mn and PDI of IIS in the ranges of 11,000–13,000 Da and 1.08–1.16, respectively. Differential Scanning Calorimetry (DSC) analysis displays two glass transition temperature (Tg) points corresponding to the PI and PS phases in the copolymer. The lower Tg values are correlated with the Vinyl group content in the block copolymer. A lower Vinyl group content in the PI segments results in lower Tg values, ranging from -53°C to -20°C.
Furthermore, when applied in the modification of Polyphenylene Ether (PPE) through blending, the triblock copolymer IIS with a Vinyl group content of 40%–45% effectively reduces the dissipation factor (Df) of the blend, enhancing peel strength between the blend and copper foil. By using a specific formulation of PPE and IIS, the peel strength can be elevated to 5.87 lb/in. Additionally, by blending PPE with IIS in a weight ratio of 80/20, the dissipation factor can be reduced from 0.0027 to 0.0017, surpassing material specifications for 5G communication hardware.

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