本論文為研究一個三維堆疊之基板型球腳格狀陣列構裝(3D-Stacked BGA Package) 於構裝過程中所衍生之翹曲問題。利用ANSYS有限元素軟體進行模擬分析，以了解產品於構裝迴焊製程中，晶片厚度、基板厚度、膠體厚度以及製程溫度等因素對構裝體翹曲之影響，希望藉由數值模擬得到構裝製程改善之方向進而提高良率。

　　數值模擬分析結果發現,，採用2D model的構裝體翹曲值與3D model者差異約為1.5%，2D結果與實際產品翹曲度之值差異約為10%，屬於可接受之範圍內。故此構裝體採用2D model 作翹曲度之數值模擬。合併分析降低基板厚度以及增加膠體厚度之結果，得到一組建議參數值，可以令翹曲值由5mils降為4 mils，但因安全係數考量之關係，最後再將迴焊溫度由230℃降低為220℃而讓最終之翹曲值降至3.86mils。因此，經由本論文之數值模擬，可以達到翹曲值23%之改善，並達成所需之規格，且馮氏應力也由541Mpa 降至519Mpa

　A numerical investigation of 3D-Stacked BGA packages is conducted to evaluate package warpage during the assembly process by ANSYS. The effects of die thickness、substrate thickness、mold compound thickness and process temperature on warpage are studied so that a set of optimum process parameters is obtained to improve the assembly yield.

　Computational results indicate a 1.5% difference in warpage between 2D and 3D models. There is a 10% difference in warpage between the 2D simulation and actual results and is considered acceptable. Thus, 2D model is adopted for further simulations. From the simulation results, it is observed that the substrate thickness and mold compound thickness have significant influence on package warpage. Also by decreasing the IR-reflow temperature from 230℃ to 220℃, the package warpage can be further reduced to 3.86mils and meets specification requirement. In other words, a 23% improvement in package warpage can be achieved and the von Mises stress also decreases from 541Mpa to 519Mpa.

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