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研究生: 梁祐誠
Leong, Gordon Cheng-Ning
論文名稱: B添加對Sn-1.5Ag-0.7Cu低銀無鉛銲料顯微組織與機械性質影響之研究
Effect of Boron Addition on Microstructure and Mechanical Properties of Low-Ag-content Lead-free Sn-1.5Ag-0.7Cu Solder Joints
指導教授: 李驊登
Lee, Hwa-Teng
學位類別: 碩士
Master
系所名稱: 工學院 - 機械工程學系
Department of Mechanical Engineering
論文出版年: 2018
畢業學年度: 106
語文別: 英文
論文頁數: 89
中文關鍵詞: 低銀無鉛銲料B添加微結構界面IMC層低週疲勞
外文關鍵詞: Low silver lead-free solder, B addition, Microstructure, Intermetallic compound, Low cycle fatigue
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  • 本研究討論B元素添加0.0010、0.0025、0.0050wt.%對Sn-1.5Ag-0.7Cu(SAC157)低銀無鉛銲料顯微組織與機械性質的影響,並以150℃,225hrs之高溫熱儲存試驗評估銲料抗熱性,與原銲料SAC157進行比較。
    顯微組織方面,含有0.0010wt.%B的SAC-10B銲料其顯微組織與SAC157相似,其中主要析出物Ag3Sn形貌仍呈細長條狀。添加至0.0025wt.% B時, SAC-25B中的Ag3Sn形貌轉變為針狀,最後當添加至0.0050wt.% B時,Ag3Sn則以細長條狀與板片狀形貌在SAC50B中形成,此外,在SAC50B基地中發現一新型化合物―含B柱狀體在板片狀Ag3Sn周圍析出,導致B細化晶粒效果降低。比較各銲料IMC層厚度,SAC10B具有最薄的IMC層厚度,且隨著B的添加,IMC層的厚度增加。此外,各銲料經高溫熱儲存後,析出物皆有粗大化現象. IMC層厚度亦有所增加,但添加B後的銲料IMC增厚幅度較小,顯示B可抑制銲料IMC層在高溫環境下的生長速度。
    在機械性能方面,銲料的硬度和剪切強度隨著B添加量上升而增加,而在低週疲勞試驗中,由於B的晶粒細化效應,SAC25B的疲勞壽命與SAC157相比有所改善。此外,高溫熱儲存後各銲料的硬度均降低,但添加B的銲料硬度降幅較小,說明其抗熱性較佳。
    綜合銲料顯微組織、IMC層量測與疲勞壽命測試結果,當 SAC157銲料添加0.0025wt.% B時,可有效提升銲料性能。
    綜合銲料固液區間、微結構、界面層量測與疲勞壽命,研究結果顯示B添加量為0.0025wt.%時可提升低銀SAC銲料之性能。

    The purpose of this study was to investigate the effects of Boron addition (0.0010, 0.0025, 0.0050wt.%) on the microstructure, and mechanical properties of low-silver lead-free solder Sn-1.5Ag-0.7Cu (SAC157). The solder properties at elevated temperature was evaluated using a high-temperature heat storage test (150°C / 225 hrs) and compared with a boron-free solder.
    The experimental results show that the microstructure of SAC157 with 0.001wt.% B was similar to that of SAC157 after B was added. It still contained eutectic structure and part of B is minorly dissolved in precipitates. With the increase of B content up to 0.0050wt.%, the eutectic structure of the network gradually disintegrates, and the morphology of the precipitated Ag3Sn changed from an elongated strip shape of Sn-1.5Ag-0.7Cu-0.0010B (SAC10B) to needle-like in Sn-1.5Ag-0.7Cu-0.0025B (SAC25B) and finally a mixed of flake-like and strip-like in Sn-1.5Ag-0.7Cu-0.0050B (SAC50B). A new type of compound, namely cuboidal is found in matrix of SAC50B, and appearing near plate-like Ag3Sn, causing a reduced grain refinement effect of SAC50B. After high-temperature heat storage, the precipitates become coarse while SAC25B maintained its needle-like eutectic structure. Besides that, the addition of Boron can reduce the growth IMC layer by refining grains and hindering diffusion of Sn atoms. SAC10B has the smallest IMC layer thickness, and the thickness of the IMC layer has increased with the addition of B. After high-temperature thermal storage, the thickness of the solder IMC layer increased, but the increase in the B-added solder was small, indicating that B can inhibit the growth of the SAC solder IMC layer at high temperatures.
    In terms of mechanical properties, the hardness and shear strength of the solder increase with the increase of boron addition. After thermal storage, the hardness of all solders decreased, but the solder added with B showed a smaller decrease, indicating better heat resistance. In the low-cycle fatigue test, the fatigue life of SAC25B and was improved compared with SAC157, mainly due to the grain refinement effect of B.
    In conclusion, in terms of boron-added solders’ microstructure, IMC layer measurement and fatigue life, the results show that the addition of 0.0025wt.% B can improve the performance of low-silver SAC solder.

    Abstract I 摘要 II 誌謝 III Table of Contents IV List of Tables VI List of Figures VII Chapter One Introduction 1 1-1 Introduction 1 1-2 Research Motive and Purpose 3 Chapter Two Literature Review 5 2-1 Introduction of Packing Technology 5 2-2 Lead free solder’s development trend 9 2-3 Binary alloy solder 10 2-3-1 Sn-Ag 10 2-3-2 Sn-Cu 11 2-3-3 Sn-Sb 12 2-4 Ternary alloy solder 13 2-4-1 Sn-Ag-Cu 13 2-4-2 Sn-Ag-Sb 15 2-4-3 Sn-Ag-Ni 16 2-5 Quaternary alloy solder 16 2-5-1 Sn-Ag-Cu-Sb 18 2-5-2 Sn-Ag-Cu-Ni 19 2-5-3 Sn-Ag-Cu-B 23 2-6 Low cycle fatigue 27 2-6-1 Overview of solder reliability 27 2-6-2 Overview of low-cycle fatigue properties 28 2-6-3 Fatigue life assessment 28 Chapter Three Experimental Procedures 31 3-1 Experimental planning 31 3-2 Specimen preparation 33 3-3 Experimental content 42 3-4 Parameter setting for fatigue test 46 Chapter Four Results and Discussions 48 4-1 Effect of boron addition on microstructure of solder materials 48 4-1-1 Metallographic microstructure 48 4-1-2 Metallographic microstructure after heat storage 64 4-2 Effect of adding boron on hardness of solder 66 4-3 Effect of B addition on the growth of IMC layer 68 4-4 Shear test 72 4-5 Low cycle fatigue test 75 Chapter Five Conclusions 82 Chapter Six Future work and research direction 83 Chapter Seven Bibliographies 84 Chapter Eight Appendix 89 8-1 SACB B-content 89

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