本文主要在探討超薄型化表面黏著型態(SMD，surface-mount device)的發光二極體(LED，light emitting diode)封裝中，LED封裝所使用的基板、封裝膠餅及封裝後的可靠度之研製與特性。在LED封裝基板部分，表面黏著型態的LED封裝中，基板大多以印刷電路板(Printed circuit board，PCB)為主，以目前市場上薄型化的SMD Type的LED厚度約0.3mm，對於PCB板材的結構此封裝厚度將到達極限，欲將元件再輕薄化會導致金線外漏，元件壽命與特性將受影響。本文中引用IC封裝所使用的基板USP(Ultra Small Package)完成超薄型化LED封裝，不僅元件厚度變薄對於元件的壽命也有提升。在封裝膠餅部分，我們選用三種不同性質的封裝膠餅，針對USP板材封裝上試出最佳化製程條件，穩定製作生產。在可靠度部分、測試皆與溫度有關，溫度循環與溫度衝擊造成元件內部產生熱應力，USP板材元件內部是否承受的了熱應力的破壞將是我們所關切的問題。


關鍵字: 表面黏著型元件,發光二極體,印刷電路板

In the thesis, we focus on the development of substrate and compound and the characteristic of reliability in the process of LED package typed SMD. The substrate used most, in the process of LED package typed SMD, is Print Circuit Board (PCB). The thickness of thinned LED typed SMD approaching the limit is around 0.3mm in the current market, and the life- time and the characteristic will be influenced in further thinning as a result of the leakage of wire. The Ultra Small Package (USP) cited in the thesis not only thins the thickness but lifts the life-time up. On the other hand, we choose three different kinds of molding compound and try out the condition of optimization allowing stable manufacture. While the reliability is relevant to the temperature, in this thesis it will be an important issue whether USP is resistible from the destroying of thermal strain derived from circulation and impact of temperature.

Keywords: surface-mount device, light emitting diode, Printed circuit board

[1] L. T. mansion “simulation of Cavity filling and curing in reaction injection molding”, polym. eng. Sci. Vol. 21, p. 1234, 1981.

[2] J. S. Shim, W. Lee, J. Jang, Polym. Bull., 25, 661(1991)

[3] J. Y. Wang, H.J. Ploehn, J. Appl. Polym. Sci., 59, 345(1996)

[4] J. V. Crivello, R. Narayan, Macromolecules, 29, 433(1996)

[5] J. V. Crivello, D. Bi, J. Polym. Sci., Part A: Polym. Chem., 31, 3121(1993)

[6] K. Matsukawa, K. Hasegawa, H. Inoue, A. Fukuda, Y. Arita, J. Polym.Sci., Part A: Polym. Chem., 30, 284(1992)

[7] Y. L. Liu, G. H. Hsiue, Y. S. Chiu, R. J. Jeng, C. Ma, J. Appl. Polym. Sci., 59, 1619(1997)

[8] Y. L. Liu, G. H. Hsiue, C.W. Lan, J. K. Kuo, R. J. Jeng, Y. S. Chiu, J. Appl. Polym. Sci., 63, 875(1997)

[9] Y. L. Liu, G. H. Hsiue, R. F. Lee, Y. S. Chiu, J. Appl. Polym. Sci., 63, 895(1997)

[10] S. D. Smith, T. E. McGrath, J. Polym. Sci., Part A: Polym. Chem., 32, 1747(1994)

[11] J. D. Mackenzie, In Hybrid Organic-Inorganic Composites, AmericanChemical Society: Washington, DC, Chap. 17(1995)

[12] T.D. Dang, J.P. Chen, F.E. Arnold, In Hybrid Organic-Inorganic
Composites, American Chemica Chemical Society: Washington, DC, Chap. 21(1995)

[13] C. L. Soles, F. T. Chang, D. W. Gidley, and A. F. Yee, J. Polym. Sci., Part B: Polym. Phys., 38, 776(2000)
[14] M. G. Lu, M. J. Shim, and S. W. Kim. Polym. Sci.,81, 2253(2001)

[15] M. G. Lu, H. K. Choi, H. K. Lee, and S. W. Kim. Polym. J., 33, 49(2001)

[16] V. H. Kenner, B. D. Harper, and V. Y. Itkin, J. Electron. Mater., 26, 821(1997)

[17] Z. G. Wang, M. R. Xie, Y. F. Zhao, and S. B. Fang, polymer, 44, 923(2003)

[18] X. Huang, S. Lewis, W. J. Brittain, R. A. Vaia, Macromolecules, 33, 2000(2000)

[19] Z. Wang, T. J. Pinnavaia, Chen. Mater., 10, 1820(1998)

[20] T. Lan, et al., Chem. Mater., 7, 2114(1995)

[21] T. Lan, et al., Chem. Mater., 6, 573(1994)