本研究是探討錫銀無鉛銲錫合金與無電鍍鎳之固液界面反應。利用潤濕天平試驗分析錫銀銲錫合金與無電鍍鎳之潤濕性，並觀察其界面反應，且進一步討論介金屬化合物之成長動力行為。所探討之錫銀合金為Sn-3Ag；使用之無電鍍鎳之含磷量約為7 wt.%。
　　由潤濕天平試驗結果可知，錫銀合金與無電鍍鎳在浸鍍溫度為250 oC反應時即有潤濕行為發生，但在浸鍍溫度提高為270 oC反應時，其潤濕時間小於1秒，即具有較佳之潤濕性。
　　錫銀合金與無電鍍鎳經過潤濕天平試驗後，在界面上生成Ni3Sn4與Ni3P介金屬化合物。當反應溫度為250 oC時、反應時間從30秒起，試片界面上可發現Ni3Sn4與Ni3P間生成Ni-Sn-P三元素混合層。針對短時間5秒反應的試片界面，利用TEM分析得知，液態銲錫中錫原子擴散進入Ni3Sn4與Ni3P界面而形成Ni-Sn-P三元素混合層，Ni-Sn-P層中於靠近Ni3P處形成Ni3SnP結晶相，而靠近Ni3Sn4處則有顆粒狀Ni3Sn4生成於Sn基地中。當反應溫度為270 oC時，因鎳、錫原子擴散速率加快，P-rich層中除了有Ni3P外，可能另有其他鎳磷化合物於其中。隨著反應時間增長，P-rich層中會逐漸出現擴散孔洞。
　　錫銀合金與無電鍍鎳固液反應中，Ni3Sn4在不同反應溫度下的成長動力行為差異不大─Ni3Sn4平均厚度不會因為反應時間有明顯的增加，而P-rich與Ni-Sn-P之成長動力行為，在反應溫度為250 oC時為擴散控制反應，當反應溫度提高為270 oC時其反應轉為混合控制反應。

This research investigated the interfacial reaction between liquid Sn-3Ag solder and electroless nickel with 7 wt.% phosphorous. The wettability between Sn-Ag solder and electroless nickel was investigated with wetting balance. After the wettability test, the interfacial reaction and the growth kinetics of the IMCs were investigated and discussed.
The result of wettability test revealed that the wetting behavior occurred between the liquid Sn-Ag solder and electroless nickel deposit at 250 oC. The wetting time at 270 oC was smaller than 1 second and demonstrated a better wettability.
After the wettability test, the IMCs, Ni3Sn4 and Ni3P formed at the interface between the Sn-Ag solder and electroless nickel. When the test was processed at 250 oC, there were Ni-Sn-P layer formed between Ni3Sn4 and Ni3P after reaction for 30 seconds. The result of TEM analysis on the 5 second reaction specimen indicates that Sn atoms diffused into the interface between Ni3Sn4 and Ni3P to form a Ni-Sn-P ternary layer. It formed Ni3SnP phase in the region near Ni3P layer. When the test was processed at 270 oC, the diffusion rate of Ni, Sn atoms increased so that the P-rich layer might include Ni3P and other Ni-P compounds. Because of the compositions of IMCs were so close that the IMC layers could not be clearly distinguished. With the increasing reaction time, the Kirkendall voids appeared in the P-rich layer gradually.
In the interfacial reaction between the liquid Sn-Ag solder and electroless nickel, the thickness of Ni3Sn4 did not significantly change with the reaction time. The reaction at 250 oC was diffusion controlled, while it becomes a mixed mode at 270 oC.

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