高運算功能的筆記型電腦，相對的會產生高功率，而在筆記型電腦體積越來越小的情況下，如何有效的利用有限空間來散熱便是重要之研究課題，亦為本文所欲探討之對象。在固定熱管寬度或其總面積的限制下，本文建立一套簡化的一維熱阻模型，並試圖找出在平板上的最佳熱管數目和其佈置方式。同時，針對若干關鍵設計概念，我們也使用CFD-ACE套裝軟體來計算三維模型之實際散熱情形，以驗證簡化一維熱阻模型之預測。研究中發現，若固定熱管寬度，並在平板使用熱管以使其最大溫差小於未使用熱管時的溫度差5%內，找出最佳熱管根數，此外，以熱管總面積最小情形下，找出所對應的熱管根數與寬度。同時在固定熱管總面積條件下，則以將熱管全部佈置在平板較短邊上為佳。

As the operation speed of notebook computers increases, and their size decreases (hence less space available for ventilation), it has become a challenging problem to remove the extensive heat generation inside a notebook computer. One way to help remove the heat generation is to use flat-plate heat pipes, whose optimal deployment is studied in this thesis. In particular, a simple one-dimensional thermal resistance model, in which the heat pipes are modeled as a uniform material having a very large thermal conductivity, is constructed to estimate the overall thermal resistance of various heat pipe deployment strategies. The predictions of our thermal resistance model are also verified by comparison with the results of numerical computations using the commercial software CFD-ACE. Through extensive parameter studies, it is found that, when heat pipes having the same width are used, there is a minimum number of heat pipes that will reduce the maximum temperature difference between the heat source and the environment below 5% of the maximum temperature difference that will be present when heat pipes are not used. Moreover, for fixed total area of the heat pipe (i.e., high conductivity material), it is found that the overall thermal resistance is minimized when all the high conductivity material is placed on the shorter side of the flat plate.

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