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研究生: 林宮正
Lin, Kung-Cheng
論文名稱: 玻璃基板上雷射低溫成長多晶矽薄膜之金屬-絕緣層-半導體蕭特基二極體式低成本高感度高速氫氣感測器的研製
Characterization and Preparation of Low Temperature Poly-silicon (LTPS) Thin Film Metal-Insulation-Semiconductor Schottky Diode-Type Low Cost High Sensitivity Hydrogen Sensors
指導教授: 高泉豪
Kao, Chuan-Haur
方炎坤
Fang, Yean-Kuen
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 微電子工程研究所
Institute of Microelectronics
論文出版年: 2007
畢業學年度: 95
語文別: 中文
論文頁數: 130
中文關鍵詞: 氫氣低溫多晶蕭特基半導體感測器
外文關鍵詞: hydrogen, sensors, LTPS, Schottky, semiconductor
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  • 本論文係探討利用準分子雷射退火(Excimer Laser Annealing, ELA)技術在玻璃基板成長的低溫多晶矽薄膜上研製低成本高性能MIS蕭特基二極體式氫氣感測器。由實驗結果,我們發現金-半接面結構會受到矽化物與界面態位的控制,使得蕭特基能障高度較不受極化氫原子的影響,因而導致氫氣感測能力差,故須添加絕緣層來改善。而在金屬-絕緣層-半導體接面結構中,則以TiO2作為絕緣層材料的感測元件特性最佳。該元件在逆偏壓1V與氫氣濃度100ppm的操作環境下,呈現2500%的靈敏度及36秒的反應時間(response time),並顯示很好的再現性與選擇性。
    此外吾人並研究利用磷摻雜、硼摻雜及氮電漿處理來改善薄特性,其中以磷摻雜表現的特性最佳。另外在薄膜表面不同粗糙度對元件特性的影響研究中發現粗糙的薄膜表面會有較佳的感測特性。
    最後,在27°C、70°C與110°C的溫度變化試驗中,發現較高的操作溫度有助於感測元件的反應速度,但同時會降低靈敏度。

    In this thesis, we used the excimer laser annealing(ELA) prepare low temperature poly-silicon thin film on glass substrate to fabricate the MIS Schottky diode-type low cost and high sensitivity hydrogen sensors. The experimental results show the Pd/TiO2/Si MIS Schottky diode has the highest sensitivity (2500%), fast response time τr (36sec), good reliability, and selectivity under 1V reverse bias and 100ppm hydrogen.
    Besides, we improved the property of poly-silicon thin film with Phosphorous doping, Boron doping, and nitrogen plasma treatment, and find the Phosphorous doping gains the best improvement. Moreover, a rough surface in poly-Si thin film can enhances the sensitivity.
    Furthermore, we find the sensor operated in a high temperature got fast time response, but lowers sensitivity at the same time.

    目錄 中文摘要 I 英文摘要 II 目錄 III 表目錄 V 圖目錄 VI 第一章 導論 1 1-1 前言 1 1-2 論文架構 4 第二章 元件原理與氫氣感測機制 5 2-1 元件基礎理論 5 2-2 氫氣的吸附作用 6 2-3 元件感測機制 9 第三章 元件製作與量測系統 11 3-1 元件之製作程序 11 3-2 量測實驗 11 3-3 儀器系統介紹 12 3-3-1電漿助長化學氣相沉積系統(PECVD) 12 3-3-2 真空熱蒸著系統(Thermal Vacuum Evaporation System) 13 3-3-3 射頻磁控濺鍍系統(Radio-Frequency Sputtering System) 13 3-3-4 退火系統(Annealing System) 15 3-3-5 掃描式電子顯微鏡(FE-SEM) 15 3-3-6 原子力顯微鏡(AFM) 15 3-3-7 二次離子質譜儀(SIMS) 15 3-3-8 歐傑電子光譜儀(AES) 16 第四章 結果與討論 17 4-1 絕緣層對元件的影響 17 4-1-1 Pd/n-type poly-Si結構 17 4-1-2 Pd/SiO2/n-type poly-Si結構 18 4-1-3 Pd/TiO2/n-type poly-Si結構 20 4-1-4 Pd/ZnO/n-type poly-Si結構 21 4-1-5 Pd/Si3N4/n-type poly-Si結構 22 4-1-6 厚度之影響分析 23 4-2 薄膜表面處理對元件的影響 25 4-2-1 溼蝕刻表面平滑處理 25 4-2-2 電漿表面處理 26 4-3 不同操作溫度之感測特性分析 29 第五章 結論與未來展望 33 5-1 結論 33 5-2 未來展望 33 參考文獻 35 附表 39 附圖 47

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