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研究生：	王泰翔 Wang, Tai-Siang
論文名稱：	銲錫接點於高速衝擊測試下之破壞行為及機制之研究 Investigation on the Fracture Behavior and Mechanism of Solder Joint under High Speed Ball Impact Test
指導教授：	林光隆 Lin, Kwang-Lung
學位類別：	碩士 Master
系所名稱：	工學院 - 材料科學及工程學系 Department of Materials Science and Engineering
論文出版年：	2008
畢業學年度：	96
語文別：	中文
論文頁數：	102
中文關鍵詞：	破壞機制、銲錫接點
外文關鍵詞：	fracture mechanism, solder joint
相關次數：	點閱：53 下載：3
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本研究使用BIT(Ball Impact Test)系統研究四種銲錫接點系統：Sn-37Pb/Au/Ni、Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga/Au/Ni(5e/Au/Ni)、Sn-1Ag-0.5Cu/Cu(SAC105/Cu)、Sn-3Ag-0.5Cu/Au/Ni(SAC305/Au/Ni)的高速衝擊破壞行為及機制，選用的衝擊速度分別為1、1.5、2 m/s。
觀察三種衝擊速度所形成之破壞面可知，Sn-37Pb/Au/Ni沿著銲錫內部產生延性破壞；5e/Au/Ni沿著銲錫、銲錫/AgZn3、AgZn3/AuZn3界面發生延性脆性混合型破壞；SAC105/Cu則穿過Cu6Sn5產生脆性破壞；SAC305/Au/Ni幾乎沿著(Cu,Ni)6Sn5/Ni基材界面產生脆性破壞。Sn-37Pb/Au/Ni、5e/Ni/Au銲錫接點之最大衝擊破壞力Fmax隨著衝擊速度增加並無明顯變化；SAC105/Cu、SAC305/Au/Ni之Fmax則隨著衝擊速度增加約略有下降的趨勢。另外，產生初始衝擊破壞所需的能量E以延性以及延性脆性混合型破壞的Sn-37Pb/Au/Ni、5e/Au/Ni較高，而脆性破壞的SAC105/Cu、SAC305/Au/Ni產生初始破壞所需的能量較小。而四種銲錫接點在達到最大衝擊破壞力所需要的時間皆隨著衝擊速度的增加而逐漸縮短。
本研究嘗試以以下列三種原因解釋破壞行為：(1)界面晶格失配(Lattice Misfit)，(2)各相之間彈性係數(Young’s Modulus)差異，以及(3)不同晶體結構造成塑性變形難易度不同。Sn-37Pb/Au/Ni接點以晶體結構的影響主導了破壞的機制；5e/Au/Ni由Lattice Misfit以及晶體結構差異兩項因素影響了破壞機制；Young’s Modulus的差異和晶體結構的不同則影響了SAC105/Cu的破壞機制；而SAC305/Au/Ni的破壞機制則由上述三種原因同時主導。
本研究提供的是判斷破壞發生的原則，進一步推論出不同銲錫接點的破壞機制，對於不同的銲錫接點系統，影響破壞機制的三種因素所佔的比重可能也會有所更動，造成破壞面發生的位置或破壞模式改變。

In this study, we used high speed Ball Impact Test (BIT) system to investigate the fracture behavior and mechanism of four different kinds of solder joints: Sn-37Pb/Au/Ni、Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga/Au/Ni 、Sn-1Ag-0.5Cu/Cu、Sn-3Ag-0.5Cu/Au/Ni (denoted by 5e/Au/Ni, SAC105/Cu and SAC305/Au/Ni respectively). The impact velocities in the experiment were 1, 1.5, and 2 m/s.
The investigation on fracture morphology indicates that Sn-37Pb/Au/Ni fractured through the solder in a ductile mode, 5e/Au/Ni fractured along the solder, solder/AgZn3 and AgZn3/AuZn3 interfaces in a ductile-brittle mixed mode, while the fracture surface of SAC105/Cu passed through the Cu6Sn5 IMC and resulted in a brittle fracture; Finally, SAC305/Au/Ni exhibited a brittle failure mode with fracture surface observed at the (Cu,Ni)6Sn5/Ni substrate interface. The maximum impact force (Fmax) of Sn-37Pb/Au/Ni and 5e/Au/Ni almost remained constant in various impact velocities while that of SAC105/Cu and SAC305/Au/Ni roughly decreased with increasing impact velocity. Additionally, the energy for fracture initiation (E) of ductile fracture Sn-37Pb/Au/Ni and ductile-brittle mixed mode fracture 5e/Au/Ni were larger than brittle mode fracture SAC105/Cu and SAC305/Au/Ni solder joints. Furthermore, the time for facture initiation reduced with higher impact velocity in all solder joints.
The fracture mechanism were interpreted through: (1) Lattice Misfit, (2) The difference in Young’s Modulus of each phase in the solder joint and (3) Divergent plastic deformation arose from different crystal structure. The predominant factors which controlled the fracture mechanism of solder joints are described as follows: Crystal structure was the most important factor affecting the fracture mechanism of Sn-37Pb/Au/Ni; both Lattice Misfit and crystal structure had influence on the fracture mechanism; difference in Young’s Modulus and crystal structure simultaneously contributed to the brittle fracture of SAC105/Cu; and the brittle failure mode of SAC305/Au/Ni could be ascribed to all of the three factors. These three factors will affect the fracture mechanism to different extent.
What we provided in this study is a principle to determine the fracture initiation, and then took one step further to deduce the fracture mechanism. For different solder joint systems, there exists relative proportion of the three factors in determining the fracture mechanism and the failure mode.

總目錄
中文摘要………………………………………………………….....Ⅰ
Abstract	……………………………………………………………..Ⅱ
致謝………………………………………………………….........Ⅳ
總目錄…………………………………………………………….....Ⅵ
表目錄…………………………………………………………….....Ⅸ
圖目錄…………………………………………………………….....Ⅹ
附錄目錄…………………………………………………………...ⅩⅢ
第壹章 簡介……………………………………………………….....1
  1-1 銲錫接點機械性質測試方式……………………………......1
    1-1-1摔落測試(Drop test)…………………………………....2
    1-1-2 拉伸測試(Cold Bump Pull Tensile test)…………….2
    1-1-3 剪力測試(Shear test)………………………………....5
    1-1-4 衝擊測試(Impact test)………………………………...5
  1-2 文獻回顧………………………………………………….....12
  1-3 研究目的………………………………………………….....17
第貳章 實驗方法與步驟…………………………………………....18
  2-1 實驗構想與設計………………………………………….....18
  2-2 實驗材料選擇…………………………………………….....18
  2-3 實驗步驟………………………………………………….....22
    2-3-1 機械性質測試……………………………………….....22
    2-3-2破斷表面及橫截面分析………………………………....26
  2-4 高速衝擊測試簡介 (Ball Impact Test, BIT)…………….26
第參章 結果與討論………………………………………………....33
  3-1 Ball Impact Test…………………………………………….33
    3-1-1 Ball Impact Test實驗曲線意義……………………….33
    3-1-2 Ball Impact Test實驗曲線解讀……………………….34
      3-1-2-1最大衝擊破壞力 (Fmax) 之分析………………....34
      3-1-2-2 產生初始破壞所需能量 (E) 之分析…………....44
      3-1-2-3 達最大衝擊破壞力時之時間(t)之分析…………..44
  3-2 衝擊破壞面之分析……………………………………….....50
    3-2-1 Sn-37Pb/Au/Ni銲錫接點之破壞分析………………....50
      3-2-1-1 衝擊前之原始Sn-37Pb/Au/Ni界面微觀組織…....50
      3-2-1-2 Sn-37Pb/Au/Ni於不同速度衝擊破壞後之分析…..50
    3-2-2 Sn-8.5-0.5Ag-0.01Al-0.1Ga/Au/Ni銲錫接點之破壞分
          析………………………………………………………...54
      3-2-2-1 衝擊前之原始5e/Au/Ni銲錫接點界面微觀組織...54
      3-2-2-2 5e/Au/Ni於不同速度衝擊破壞後之分析………...55
    3-2-3 Sn-1.0Ag-0.5Cu/Cu銲錫接點之破壞分析……………..57
      3-2-3-1 衝擊前之原始Sn-1.0Ag-0.5Cu/Cu銲錫接點界面微
              觀組織………………………………………….....57
      3-2-3-2 Sn-1.0Ag-0.5Cu/Cu於不同速度衝擊破壞後之分析
              ………………………………………………….....60
    3-2-4 Sn-3.0Ag-0.5Cu/Au/Ni銲錫接點之破壞分析………...63
      3-2-4-1 衝擊前之原始Sn-3.0Ag-0.5Cu/Au/Ni銲錫接點界面
              微觀組織…………………………………….......63
      3-2-4-2 Sn-3.0Ag-0.5Cu/Au/Ni於不同速度衝擊破壞後之分
              析……………………………………………….....63
  3-3 衝擊機制之探討………………………………………….....67
    3-3-1 Lattice Misfit對整體結構之影響…………………….67
    3-3-2 彈性係數在衝擊過程中扮演之角色……………….....74
    3-3-3 塑性變形之關聯性………………………………….....78
  3-4 綜合討論………………………………………………….....82
    3-4-1 Sn-37Pb/Au/Ni銲錫接點之破裂機制………………....82
    3-4-2 5e/Au/Ni銲錫接點之破裂機制………………………...83
    3-4-3 SAC105/Cu銲錫接點之破裂機制……………………....84
    3-4-4 SAC305/Au/Ni銲錫接點之破壞機制……………….....85
第肆章 結論………………………………………………………....88
參考文獻………………………………………………………….....90

表目錄

表1-1不同衝擊測試之文獻資料…………………………………....14
表2-1四種銲錫接點於不同衝擊速度之實驗組數(左：實驗組數 右：
     去除異常值後組數)…………………………………….......25
表3-1四種銲錫接點在不同衝擊速度下之最大衝擊力(Fmax)平均值
     與標準差……………………………………………..........41
表3-2四種銲錫之應變速率敏感指數( Strain rate sensitivity 
     index, m)……………………………………………………...43
表3-3四種銲錫接點在不同衝擊速度下產生初始破壞所需要的能量
     平均值(E)與標準差………………………………….........46
表3-4四種銲錫接點在不同衝擊速度下達到最大衝擊破壞力所需的
     時間(t)及標準差…………………………………….........48
表3-5四種銲錫接點中所含的相及晶體結構與晶格常數………....70
表3-6四種銲錫接點各相之間的Lattice Misfit值………………..73
表3-7四種銲錫接點中各相的彈性係數及彈性係數差…………....77
表3-8不同結構的材料滑移系統及數目…………………………....79
表3-9影響四種銲錫接點破壞機制原因之比較…………………....87

圖目錄

圖1-1摔落測試機台示意圖 (a)儀器整體構造,(b)衝擊模具組…...3
圖1-2拉伸測試示意圖…………………………………………….....4
圖1-3剪力測試示意圖…………………………………………….....7
圖1-4 Micro-impact Testing Machine裝置示意圖………………..8
圖1-5 Micro Impact Tester裝置示意圖…………………………...9
圖1-6 Ball Impact Test系統示意圖……………………………….11
圖2-1實驗流程圖…………………………………………………....19
圖2-2銲錫接點結構示意圖：(a)Sn-37Pb、5e、SAC305與Au/Ni/Cu
    銲墊,(b)SAC305與Cu銲墊……………………...............20
圖2-3衝球測試 ( Ball Impact Test ) 系統裝置示意圖…………21
圖2-4撞針穿過儀器中央平台輕置於銲錫接點示意圖…………....23
圖2-5 Ball impact test所選用的試片尺寸及測試之銲錫接點位置
      示意圖………………………………………………….......24
圖2-6由CCD camera側面定位撞針及BGA基板之間的距離….......27
圖2-7 (a)由CCD camera正面定位撞針及球的相對位置示意圖 (b)
      由CCD camera側面定位撞針及基板間距示意圖…….......28
圖2-8 Ball Impact Test力量─位移示意圖……………………….32
圖3-1 Sn-37Pb/Au/Ni銲錫接點在不同衝擊速度下的力量(F)─位移
      (d)與所有曲線平均值圖，衝擊速度分別為(a),(b) 1 m/s
      (c),(d) 1.5 m/s (e),(f) 2 m/s……………………………37
圖3-2 Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga/Au/Ni銲錫接點在不同衝擊
      速度下的力量(F)─位移(d)與所有曲線平均值圖，衝擊速度
      分別為(a),(b) 1 m/s (c),(d) 1.5 m/s (e),(f) 2 m/s…38
圖3-3 Sn-1.0Ag-0.5Cu/Cu銲錫接點在不同衝擊速度下的力量(F)─
      位移(d)與所有曲線平均值圖，衝擊速度分別為(a),(b) 1 
      m/s (c),(d) 1.5 m/s (e),(f) 2 m/s……………………..39
圖3-4 Sn-3.0Ag-0.5Cu/Au/Ni銲錫接點在不同衝擊速度下的力量
      (F)─位移(d)與所有曲線平均值圖，衝擊速度分別為(a),
      (b) 1 m/s (c),(d) 1.5 m/s (e),(f) 2 m/s………………40
圖3-5四種銲錫接點之最大衝擊力─衝擊速度關係圖…………....42
圖3-6四種銲錫接點於不同衝擊速度下產生初始破壞所需要的能量
     關係圖…………………………………………………........47
圖3-7四種銲錫接點在不同衝擊速度下達到最大衝擊破壞力之時間
     關係圖…………………………………………………........49
圖3-8未衝擊前銲錫接點橫截面微觀組織圖(a)Sn-37Pb/Au/Ni銲錫
     接點,(b)A區域之放大圖, (c)Sn-8.5Zn-0.5Ag-0.01Al-
     0.1Ga/Au/Ni銲錫接點,(d)B區域之放大圖………………....51
圖3-9 Sn-37Pb/Au/Ni銲錫接點於不同衝擊速度下之破壞面上視圖
      ，衝擊速度分別為：(a)1 m/s (c)1.5 m/s (e)2 m/s；(b)
      (d)分別為(a)(c)之局部放大圖………………………………52
圖3-10 Sn-37Pb/Au/Ni銲錫接點於不同速度下之破壞面橫截面圖，
       衝擊速度分別為：(a)1 m/s (c)1.5 m/s (e)2 m/s；(b)(d)
       分別為 (a)(c)之局部放大圖……………………………...53
圖3-11 5e/Au/Ni銲錫接點於不同衝擊速度下之破壞面上視圖，衝
       擊速度分別為：(a)1 m/s (c)1.5 m/s (e)2 m/s；(b)(d)
       (f)分別為(a)(c)(e)之局部放大圖…………………......56
圖3-12 5e/Au/Ni銲錫接點於不同速度下之破壞面橫截面圖，衝擊
       速度分別為：(a)1 m/s (c)1.5 m/s (e)2 m/s；(b)(d)(f)
       分別為 (a)(c)(e)之局部放大圖……………………………58
圖3-13未經衝擊前銲錫接點橫截面顯微組織圖(a)SAC105/Cu銲錫接
      點,(b)C區域之放大圖,(c)SAC305/Au/Ni銲錫接點,(d)D區域
      之放大圖……………………………………...............59
圖3-14 SAC105/Cu銲錫接點於不同衝擊速度下之破壞面上視圖，衝
       擊速度分別為：(a)1 m/s (c)1.5 m/s (e)2 m/s；(b)(d)
       (f)分別為(a)(c)(e)之局部放大圖…………………......61
圖3-15 SAC105/Cu銲錫接點於不同速度下之破壞面橫截面圖，衝擊
       速度分別為：(a)1 m/s (c)1.5 m/s (e)2 m/s；(b)(d)(f)
       分別為(a)(c)(e)之局部放大圖………………….........62
圖3-16 SAC305/Au/Ni銲錫接點於不同衝擊速度下之破壞面上圖 ，
       衝擊速度分別為：(a)1 m/s (c)1.5 m/s (e)2 m/s；(b)(d)
       (f)分別為(a)(c)(e)之局部放大圖…………………......64
圖3-17 SAC305/Au/Ni銲錫接點於不同速度下之破壞面橫截面圖，
       衝擊速度分別為：(a)1 m/s (c)1.5 m/s (e)2 m/s；(b)(d)
       (f)分別為(a)(c)(e)之局部放大圖…………………......65
圖3-18異相界面不對稱及產生之misfit dislocation示意圖…...68
圖3-19 Sn-37Pb/Au/Ni銲錫接點中富鉛相與Ni3Sn4 IMC之間的 
       Lattice Misfit(δ)計算範例……………………………….72
圖3-20彈性係數不同的材料在彈性變形區域內的σ - ε關係圖....76

附錄目錄

附錄一 負荷元電壓轉換方式說明………………………………....99
附錄二 Ball Impact Test系統參數設定………………………….100
附錄三 實際負荷元所記錄的電壓-時間關係圖………………....101
                                    

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