| 研究生: |
羅杰 Luo, Jie |
|---|---|
| 論文名稱: |
於純銅催化劑與電解質中一價羰基銅離子所自然產生之動態介面碳碳耦合 Nature-born dynamic interface C-C coupling through aqueous Cu(I) carbonyl complex and adsorbed CO on copper |
| 指導教授: |
鄭沐政
Cheng, Mu-Jeng |
| 學位類別: |
碩士 Master |
| 系所名稱: |
理學院 - 化學系 Department of Chemistry |
| 論文出版年: | 2026 |
| 畢業學年度: | 114 |
| 語文別: | 中文 |
| 論文頁數: | 44 |
| 中文關鍵詞: | 二氧化碳電化學還原 、銅催化劑 、碳碳耦合 、Cu⁺ 介導 、密度泛函理論 |
| 外文關鍵詞: | CO2ER, Copper, C-C coupling, Cu+ mediated, DFT |
| 相關次數: | 點閱:5 下載:0 |
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溫室氣體一直是科學家致力解決的難題,其中電化學二氧化碳還原提供了一條降低碳排放的永續途徑,同時能產生有價值的多碳(C₂₊)產物。然而,C₂₊ 產物的生成效率受限於碳-碳耦合步驟,傳統模型認為該步驟僅透過兩個表面結合的 *CO 物種二聚化來進行。然而近期研究顯示,銅催化劑在電解過程中會經歷動態的溶解與再沉積,產生瞬態的 Cu⁺ 羰基錯合物,這些錯合物參與 C-C 鍵結形成的潛力過去一直被忽視。
在此我們應用定電位模型的密度泛函理論(DFT),來探討這種過去未被考慮的 C-C 鍵結形成機制,即溶解的 Cu⁺ 羰基錯合物中的 CO 配基與表面吸附的 *CO 進行耦合。我們發現,Cu-CO + *CO 耦合路徑在動力學上是可行的,在 Cu(100)、Cu(110)、Cu(211) 和 Cu(331) 表面上的自由能障礙約為 0.77 eV,且幾乎不受晶面與表面形態的影響。與傳統耦合方式的高反應自由能障相比,該路徑因此在階梯表面(如 Cu(211) 和 Cu(331))上成為一條具競爭力的平行反應途徑,為傳統的 *CO + *CO 二聚化提供了低能障的替代方案。
此耦合過程為 Cu⁺ 配位的 CO 與 Cu⁰ 吸附的 *CO 之間的反應,與近年研究推崇之相鄰 Cu⁺ 與 Cu⁰ 中心的雙位點協同機制吻合。此外,我們證明了 Cu⁺ 錯合物的 CO 配基與其他由 *CO 進一步還原衍生出的 *C₁ 物種之間的 C-C 耦合在動力學上更為容易,平均能障僅 0.44 eV。這些結果揭示了一種由 Cu⁺ 介導的 C-C 形成路徑,擴展了反應機制的範疇,並凸顯了銅溶解動力學可作為催化系統設計的新方法。
Electrochemical carbon dioxide reduction offers a sustainable pathway for mitigating carbon emissions and generating multi-carbon C2+ products. Traditional models posit that carbon-carbon coupling proceeds exclusively via the dimerization of two surface-bound *CO species. This study explores an overlooked mechanism wherein transient Cu+ carbonyl complexes, generated during the dynamic dissolution of copper catalysts, participate in C-C bond formation. Using density functional theory (DFT) calculations, we demonstrate that the coupling pathway between the dissolved Cu+ carbonyl complex and surface-adsorbed CO is kinetically feasible, exhibiting free energy barriers close to the rapid-reaction threshold of 0.75 eV across Cu(100), Cu(110), Cu(211), and Cu(331) surfaces. On stepped surfaces such as Cu(211) and Cu(331), this pathway provides a competitively low-barrier alternative to conventional dimerization, offering a more viable scheme for a dual-site synergistic process between Cu+-coordinated CO and Cu0-adsorbed *CO. Furthermore, C-C coupling between the Cu+ complex and other *C1 species is kinetically even more favorable, with an average barrier of only 0.44 eV. This study unveils a novel Cu+-mediated pathway for C-C bond formation, highlighting the critical importance of considering copper dissolution kinetics in the design of catalytic systems.
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