本論文發展出一個可調相位與振幅功能之雙軸向振動切削方法進行硬脆材料加工。實驗證明此創新製程可在單晶矽上加工出深度約為傳統劃切十三倍之無脆性破壞之溝槽。傳統加工方法在硬脆材料延性加工區間內，由於受限延脆轉換深度之影響故其移除效率不佳。本論文提出之加工方法可使刀具路徑為任意二維運動之週期軌跡，此一加工特性可使切屑以類似銑削之方式移除，因而改善硬脆材料之移除效率且達成高切深之延性加工。
本論文透過刀具與工件之運動幾何分析，可得知在不同振幅與相位差等加工參數下，切削角度與刀具傾角、切屑厚度、切削深度之關係。實驗結果在相同短軸振幅下，較大之長軸振幅可加工出較深之無脆性破壞溝槽；而藉由調配相位差則可避免刀具與工件之干涉。並從實驗結果和幾何分析提出一臨界切厚線，即為不同刀具傾角下所對應臨界切屑厚度之關係，根據此關係可得知刀具因子，一旦獲得刀具因子則可預測該刀具切削不同硬脆材料之延脆轉換深度。最後以延脆轉換深度辨識比切削能，進而可預測延性切削過程之切削力，以便於後續尋找最佳之加工參數。實驗中之最佳結果為以傾角-60∘之單晶鑽石刀具進行單晶矽之切削，可加工出深度為2.46μm之無脆性破壞溝槽，相較於傳統劃切之0.19μm提高約十三倍。

In this paper, a biaxial vibration cutting with adjustable phase and amplitude was developed. This innovative process performed groove cutting experiments on single crystalline silicon and maintained ductile regime which the depth of the groove is about 13 times than traditional scribing. In conventional cutting, the material removal rate is poor because of the restriction of the small critical depth of cut. This thesis proposed a machining process that the tool path can be designed in any 2D periodic locus so the chip removal form is similar to milling process and it enable to improve the material removal rate and increase the critical chip thickness.
Through analyzed the kinematics of the tool and workpiece, the cutting parameters such as cutting degree, tool rake angle and chip thickness can be known. Experiments showns under the same short-axis amplitude by raising the long-axis amplitude can increase the critical depth of cut and according to adjusting the phase can avoid the interference between tool and workpiece. By cutting parameters and experiments results, the critical chip thickness line was proposed to obtain the tool factor. Once the tool factor was known, it can be predicted the depth of brittle-ductile transition even if the tool is cutting different brittle materials. Finally, the characteristic of specific cutting constant was founded to estimate cutting force and optimal process parameters. The best experiments results in this paper is machined single crystalline silicon by using a diamond cutting tool and maintained ductile cutting to 2.46μm depth which is 13 times than traditional scribing that maintained ductile cutting to 0.19μm

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