| 研究生: |
張嘉芸 Chang, Chia-Yun |
|---|---|
| 論文名稱: |
硫化與氯化對閃積金層鍍鈀銅導線顯微組織與打線接合特性研究 The Microstructure and Bonding Properties of Pd-Coated Cu wires Flash Au after Sulfidation and Chlorination |
| 指導教授: |
洪飛義
Hung, Fei-Yi 呂傳盛 Lui, Truan-Sheng |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 材料科學及工程學系 Department of Materials Science and Engineering |
| 論文出版年: | 2017 |
| 畢業學年度: | 105 |
| 語文別: | 中文 |
| 論文頁數: | 68 |
| 中文關鍵詞: | 閃積金鍍鈀銅導線(PCA線) 、鍍鈀銅線 、硫化 、氯化 、打線接合 |
| 外文關鍵詞: | Pd-coated Cu wires flash Au (PCA wire), Pd-coated copper wire (PCC wire), sulfidation, chlorination, wire bonding |
| 相關次數: | 點閱:108 下載:0 |
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閃積金層鍍鈀銅導線(Pd-Coated Cu wires Flash Au, PCA wire)為有效加強銅線抗腐蝕及抗氧化缺點之新興微細導線,能同時擁有鍍鈀銅線的抗氧化能力且抑制介金屬化合物生成,以及具有鍍金銅線的抗腐蝕性與提升接合強度。若鍍金銅線的鍍金層太厚,於放電結球時會包覆內部線材,使線材失去真圓性,導致無法應用於打線接合製程。因此本研究採用閃積方式,將鍍鈀銅線以化學浸鍍方法在表面快速鍍上一層薄的鍍金層,藉此降低因鍍層包覆而不易成球的問題。並透過創新的硫化與氯化實驗,了解線材的抗腐蝕性;以及比較硫化與氯化實驗後之打線接合強度與表面形貌。
在硫化試驗方面,PCA線抗硫化特性較鍍鈀銅線和純銅線好,硫化後拉伸性質沒有太大變化,但由延伸率發現閃金層可延緩劣化2小時以上。電性部分則是有稍微影響,但鍍鈀銅線的電阻上升趨勢較明顯;氯化試驗部分,PCA線仍然有較好的抗氯化特性,拉伸性質亦沒有改變,電阻則是PCA線與鍍鈀銅線皆有明顯上升,證明PCA線的閃積金層可有效增強抗腐蝕性,但因氯化實驗為孔蝕,因此會以鍍金層較薄的部份侵蝕,使得PCA線和鍍鈀銅線的抗氯腐蝕性差異不大。
透過硫化和氯化實驗,調查PCA線與鋁基板接合前後之強度和電性。硫化後之強度無變化,因表面有硬脆硫化物增加強度,但電阻因硫化物厚度增加而明顯提高。氯化後之強度明顯下降且電阻明顯增加,因氯離子孔蝕使得接合部被侵蝕而造成。第二銲點頸部因下壓後鍍層硬化,抗腐蝕性較尾部佳。綜合而論,PCA線確實可以增強銅線抗腐蝕及抗氧化能力,亦可增加接合強度,因此可應用於不同環境下的晶片封裝。
Palladium coated copper wire with flash gold (PCA) is a fine wire that can effectively enhance the corrosion resistance and oxidation resistance. This study applied the new sulfidation and chlorination test. We confirm that PCA wires have better sulfidation corrosion resistance than both palladium coated copper (PCC) wires and bare copper wires and the flash gold layer can retard degradation for more than 2 hours. In chlorination test, chlorine ion erode by pitting. So PCA wires do not have apparent corrosion resistance. We also investigated the bonding strength and electrical properties after PCA wire bonded on the aluminum substrate by sulfidation and chlorination test. After the sulfidation test, the bonding strength had no change. Because the surface had hard and brittle sulfide to increase the intensity, but the electrical resistance improved due to the thickness of sulfide was significantly increased. The bonding strength decreased significantly and the electronic resistance increased significantly after chlorination test, due to chloride ion etching caused by the erosion of the bonding area. The research not only analyzes the surface of wire, the tensile properties, the bonding strength and electrical properties, but also discusses the metallurgic mechanism of free air balls (FAB) during the electric flame-off (EFO) process. With the increase in the diameter of the ball, gold atoms distribute uniformly and the segregation of palladium atoms can retard. The flash gold layer of PCA wires can improve certain shortcomings, including: (1) efficiently promoting the sulfidation corrosion resistance; (2) solving the problem of segregating palladium during the electric flame-off (EFO) process; (3) reducing the starting voltage; and, (4) stabilizing the electrical resistivity of the bonding interface.
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校內:2022-07-31公開