化學鍍鎳合金廣泛地應用在各種工業上，而鎳也是著名的鐵磁性材料之一。我們使用表面接金粒子的二氧化矽粒子當作基板，利用化學鍍鎳合金的技術，製備出在100~300奈米範圍的磁性粒子，同時也利用實驗室現有的技術，以化學鍍的方法製備出磁性的薄膜，以做比較。使用VSM 和SQUID來測量其磁學性質，並且利用EDX、XRD以及電子繞射來分析材料的結構。改變鍍液的組成，製備出二種磁化強度不同的粒子，並且控制析鍍時間的長短，改變粒子的大小，研究粒徑對磁化強度的關係。我們所製備出來的磁性粒子和薄膜，其居里溫度較純鎳金屬塊材而言，大幅地下降。磁矯頑力相當地小，而且擁有不錯的磁化強度，可被應用在MRI的顯影劑上。

　Magnetic nickel-tungsten-phosphorus (NiWP) particles of ca. 100~300 nm and films were fabricated by electroless deposition on silica templates, gold nanoparticles and brass substrates TEM, SEM equipped with EDX, XRD, VSM, and SQUID were employed to characterize these NiWP particles and films. These NiWP deposits consist of nickel near ca. 90 wt% and equal amount, by weight, of phosphorus and tungsten. For comparison, nickel-phosphorus (NiP) alloys having the same content of nickel were synthesized using electroless deposition technique as well. It is found that 70°C is sufficient to deposit NiWP particles, in contrast to 90°C required for NiWP deposited on planar substrates. Soft ferromagnetic properties were found in these NiWP materials, in contrast to the paramagnetic behaviors on NiP deposits. In addition, almost no hysteresis in magnetization curves was found for NiWP particles, whereas their magnetic properties are profoundly influenced by the P-contents in these particles. The Curie temperatures and saturation magnetization of these particles are around 300 K and the ranging from 0.1 to 20 emu/g, significantly lower than those of bulky nickel material which are 627 K and 54.4 emu/g, respectively.

Ashassi-Sorkhabi, H., Dolati, N. Parvini-Ahmadi, and J. Manzoori, “Electroles deposition of Ni-Cu-P alloy and study of the influences of some parameters on the properties of deposits”, Applied Surface Science 185, pp. 155-160 (2002).

Chen, B. H., L. Hong, Y. Ma, and T. M. Ko, “Effects of surfactants in an electroless nickel-plating bath on the properties of Ni-P alloy deposits”, Industrial & Engineering Chemistry Research 41, pp. 2668-2678 (2002).

Chen, C.-J. and K.-L. Lin, “Wetting interaction between the Ni-Cu-P deposit and In-Sn solders”, IEEE Transactions On Components, Packaging, and Manufacturing Technology—Part B 20(3), pp. 211-216, Aug (1997).

Cullity, B. D., "Introduction to Magnetic Materials", Addison-Wesley, Reading, Mass. (1972).

Duff, D. G., A. Baiker, and P. P. Edwards, “A New Hydrosol of Gold Clusters. 1. Formation and Particle Size Variation” Langmuir 9, pp.2301-2309 (1993).

Ghosh, S. K., A. Pal, S. Kundu, S. Nath, and T. Pal, “Fluorescence quenching of 1-methylaminopyrene near gold nanoparticles: size regime dependence of the small metallic particles” Chemical Physics Letters 395, pp.366-372 (2004).

Graf, C. and A. van Blaaderen, “Metallodielectric Colloidal Core-Shell Particles for Photonic Applications” Langmuir 18, pp.524-534 (2002).

Jackson, J. B., S. L. Westcott, L. R. Hirsch, J. L. West, and N. J. Halas, “Controlling the surface enhanced Raman effect via the nanoshell geometry” APPLIED PHYSICS LETTERS 82(2), pp.257-259 (2003).

Kittel, C., “Introduction to solid state physics” 7th ed., Wiley, New York, (1996).

Klabunde, K. J., “Nanoscale materials in chemistry”, Wiley-Interscience , New York , (2001).

Kohlscheen, J., H.-R Stock, and P. Mayr, “Chemical bonding in magnetron sputtered TiNx coatings and its relation to diamond turnability”, Surface and Coatings Technology 142-144, pp. 992-998 (2001).

Leslie-Pelecky, D. L. and R. D. Rieke, “Magnetic Properties of Nanostructured Materials” Chem. Mater. 8, pp.1770-1783 (1996).

Lim, V. W. L., E. T. Kang, and K. G. Neoh, “Electroless plating of palladium and copper on polypyrrole films”, Synthetic Metals (123), pp. 107-115 (2001).

Liu, P. L. and J. K. Shang, “A comparative fatigue study of solder/electroless-nickel and solder/copper interfaces”, J. Mater. Res., Vol. 15, No. 11, pp. 2347-2355, Nov (2000).

Liz-Marzán, L. M., M. Giersig, and P. Mulvaney, “Synthesis of Nanosized Gold-Silica Core-Shell Particles” Langmuir 12, pp.4329-4335 (1996).

Mine, E., A. Yamada, Y. Kobayashi, M. Konno, and L. M. Liz-Marzán, “Direct coating of gold nanoparticles with silica by a seeded polymerization technique” Journal of Colloid and Interface Science 264, pp.385-390 (2003).

Mirkin, C. A., “Programming the Assembly of Two- and Three-Dimensional Architectures with DNA and Nanoscale Inorganic Building Blocks” Inorganic Chemistry 39, pp.2258-2272 (2000).

Oldenburg, S. J., R. D. Averitt, S. L. Westcott, and N. J. Halas, “Nanoengineering of optical resonances” Chemical Physics Letters 28, pp.243-247 (1998).

Osterloh, F., H. Hiramatsu, R. Porter, and T. Guo, “Alkanethiol-Induced Structural Rearrangements in Silica-Gold Core-Shell-type Nanoparticle Clusters: An Opportunity for Chemical Sensor Engineering” Langmuir 20, pp.5553-5558 (2004).

Pham, T., J. B. Jackson, N. J. Halas, and T. R. Lee, “Preparation and Characterization of Gold Nanoshells Coated with Self-Assembled Monolayers” Langmuir 18, pp. 4915-4920 (2002).

Predoi, D., V. Kuncser, E. Tronc, M. Nogues, U. Russo, G. Principi and G. Filoti, “Magnetic relaxation phenomena and inter-particle interactions in nanosized γ-Fe2O3 systems” Journal of Physics: Condensed Matter15, pp. 1797-1811(2003).

Sada, E., H. Kumazawa, and E. Koresawa, “Reaction kinetics and size control in the formation of monosized silica spheres by controlled hydrolysis of tetraethyl orthosilicate in ethanol” The Chemical Engineering Journal 44, pp.133-139 (1990).

Shacham-Diamand, Y. and Y. Sverdlov, “Electrochemically deposition thin film alloys for ULSI and MEMS applications”, Microelectronic Engineering (50), pp. 525-531 (2000).

Stöber, W. and A. Fink, “Controlled growth monodisperse silica spheres in the micron size range” Journal of Colloid and Interface Science 26, pp.62-69 (1968).

Tachev, D., J. Georgieva, and S. Armyanov, “Magnetothermal study of nanocrystalline particle formation in amorphous electroless Ni-P and Ni-Me-P alloys”, Electrochimica Acta 47, pp.359-369 (2001).

Tomoakit, S., A. Masami, K. Mikico, and S. Shozaabur, “Particle size distributions produced by hydrolysis and condensation of tetraethylorthosilicate” Journal of Chemical Engineering of Japan 30(4), pp.759-762 (1997).

Tsutsuit, G., S. Huang, H. Sakaue, S. Shingubara, and T. Takahagi, “Well-size-controlled Colloidal Gold Nanoparticles Dispersed in Organic Solvents” Japanese Journal of Applied Physics 40, pp.346-349 (2001).

Valova, E. S., Armyanov, A. Franquet, K. Petrov, D. Kovacheva, J. Dille, J.-L. Delplancke, A. Hubin, O. Steenhaut and J. Vereeckenb, “Comparison of the Structure and Chemical Composition of Crystalline and Amorphous Electroless Ni-W-P Coatings” Journal of The Electrochemical Society 151(6), C385-C391 (2004)

Westcott, S. L., S. J. Oldenburg, T. R. Lee, and N. J. Halas, “Formation and Adsorption of Clusters of Gold Nanoparticles onto Functionalized Silica Nanoparticle Surfaces” Langmuir 14, pp.5396-5401 (1998).

Wu, F.-B., Y.-I Chen, P.-J. Peng, Y.-Y. Tsai, and J.-G. Duh, “Fabrication, thermal stability and microhardness of sputtered Ni-P-W coating”, Surface and Coatings Technology 150, pp. 232-238 (2002).

Xiao, G., S. H. Liou, A. Levy, J. N. Taylor, and C. L. Chien, “Magnetic relaxation in Fe-(SiO2) granular films” Physical Review B 34, pp.7573-7577(1986).

Yin, X., L. Hong, and B-H. Chen, “The role of Pb2+ stabilizer in electroless nickel plating system – A Theoretical Exploration”, Journal of Physical Chemistry B 108(30), pp.10919-10929 (2004).

Yu, Z. J., E. T. Kang, and K. G. Neoh, “Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers”, Polymer 43, pp. 4137-4146 (2002).

Zhang, J.H., P. Zhan, Z.L. Wang, and N.B. Ming “Preparation of monodisperse silica particles with controllable size and shape” Journal of Materials Research 18(3), pp.649-653 (2002).

馬振基主編，“奈米材料科技原理與應用”，全華科技圖書股份有限公司 (2004)

陳俊翰 “以銅離子為化學鍍鎳磷鍍液之穩定劑時其析鍍行為之探討” 國立成功大學化學工程學系碩士論文 (2004)

張力德、牟季美，奈米材料和奈米結構，科學出版社 (2002)

韓岱君 “含碳化鐵(Fe3C)奈米磁顆粒之非晶質碳膜其微觀結構、磁性質與磁阻之研究” 國立成功大學物理研究所博士論文 (2003)