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研究生： 林彥璋
Lin, Yen-Chang
論文名稱： 一個適用於半導體業網路式診斷應用之介面的通用型嵌入式裝置
A Generic Embedded Device for e-Diagnostics Interface A of Semiconductor Industry
指導教授： 鄭芳田
Cheng, Fan-Tien
學位類別： 碩士
Master
系所名稱： 電機資訊學院 - 製造工程研究所
Institute of Manufacturing Engineering
論文出版年： 2004
畢業學年度： 92
語文別： 中文
論文頁數： 74
中文關鍵詞： 機台使用效能 、網路式診斷 、機台資料擷取 、通用型嵌入式裝置
外文關鍵詞： Overall Equipment Effectiveness, e-Diagnostics, Interface A, Equipment Data Acquisition, Generic Embedded Device
相關次數： 點閱：126  下載：9 
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    • 　　為了保有競爭力，半導體廠不斷尋求提昇機台使用效能（Overall Equipment Effectiveness, OEE）的方法。而為了提昇及維護機台的效能並且降低因停機產生的成本損失，機台製造商開發了許多以電腦為主（Computer-Based）的應用程式，這些應用程式的主要任務包括：機台健康狀態監控（Equipment Health Monitoring），故障偵測與分類（Fault Detection and Classification, FDC），Run-to-Run控制（R2R），與預測性維護（Predictive Maintenance）等。因為這些應用程式必須仰賴生產機台的詳細資料，所以國際半導體設備與材料組織（SEMI）為半導體業之網路式診斷（e-Diagnostics）提出了Interface A的機台資料擷取（Equipment Data Acquisition, EDA）介面規範。本論文設計並實作了一個通用型嵌入式裝置（Generic Embedded Device, GED），該裝置符合Interface A的需求並且可嵌入於任何機台之內。此外，GED內含一開放標準之應用程式介面，以便可輕易地外加及抽換各種客制化之智慧型維護應用程式。應用GED的這個特性，將可使智慧型維護的任務被分散於各個機台中，以便減輕廠區網路通訊的負擔。

    　　In order to remain competitive, semiconductor wafer manufactures seek to continuously improve overall equipment effectiveness (OEE). In an effort to improve OEE, device makers are implementing more and more computer-based applications to improve and maintain equipment performance and drive down costs. These include applications such as equipment health monitoring, fault detection and classification (FDC), run-to-run control (R2R), predictive maintenance, and others. All of these applications depend on the collection of detailed data from process equipment. Therefore, Interface A is proposed and defined for equipment data acquisition (EDA) to support the e-Diagnostics of semiconductor industry. This work designs and implements a Generic Embedded Device (GED) that can be embedded into any kind of equipment and meet the requirements of Interface A. Moreover, GED has an open-standard application interface that flexibly enables GED to possess any pluggable and customized intelligent-maintenance applications. With this feature, the intelligent-maintenance tasks can be distributed and localized such that the factory network burden can be released.

    論文目次 中文摘要 英文摘要 誌謝 目錄..........................................................i 圖目錄......................................................iii 表目錄........................................................v 第一章 緒論...................................................1 1.1 研究之背景與描述..........................................1 1.2 研究動機與目的............................................2 1.3 論文架構..................................................8 第二章 需求分析...............................................9 2.1 通用型嵌入式裝置的發展程序................................9 2.2 GED 系統功能需求分析.....................................12 第三章 物件導向分析..........................................14 3.1 GED 物件導向分析(OOA)之Use Case Diagram..................14 3.2 GED Use Cases敘述與物件導向分析(OOA)之Sequence Diagrams..15 3.2.1 Use Case 1：Configure DCPlan...........................15 3.2.2 Use Case 2：Activate DCPlan............................17 3.2.3 Use Case 3：Deactivate DCPlan..........................18 3.2.4 Use Case 4：Acquire Equipment Data.....................20 3.2.5 Use Case 5：Warn Performance Degradation...............22 3.2.6 Use Case 6：Download Parameters........................24 3.3 GED 物件導向分析(OOA)之Class Diagrams....................24 第四章 物件導向設計..........................................27 4.1 GED 物件導向設計(OOD)之Sequence Diagrams.................27 4.1.1 Use Case 1：Configure DCPlan...........................27 4.1.2 Use Case 2：Activate DCPlan............................33 4.1.3 Use Case 3：Acquire Equipment Data.....................35 4.1.4 Use Case 4：Deactivate DCPlan..........................39 4.1.5 Use Case 5：Warn Performance Degradation...............41 4.1.6 Use Case 6：Download Parameters........................43 4.2 關於CEM及ESD之設計.......................................43 4.2.1 Common Equipment Model (CEM)...........................44 4.2.2 Conveyor Common Equipment Model........................45 4.2.3 Equipment Self Description (ESD).......................50 4.2.4 Conveyor Equipment Self Description....................51 4.3 GED 物件導向設計(OOD)之Class Diagrams....................60 4.3.1 System Scenarios.......................................63 第五章 系統實作與整合........................................67 5.1 架構實作.................................................67 5.1.1 開發環境...............................................67 5.1.2 GED端使用者介面........................................68 5.1.3 Remote Client端使用者介面..............................69 5.2 嵌入式架構實作...........................................70 5.3 可抽換（Pluggable）之嵌入式應用程式實作..................71 第六章 結論..................................................72 6.1 研究成果與論文總結.......................................72 6.2 未來研究方向.............................................72 參考文獻.....................................................73

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