本文針對晶圓級晶片尺寸構裝（WLCSP）在環境溫度熱循環測試下，利用ANSYS有限元素分析軟體模擬WLCSP構裝體之材料非線性結構行為，以探討焊錫接點在各種不同的FR-4板設計之下對焊錫接點可靠度的影響。
由本文研究結果顯示，由於受到構裝材料性質差異之影響，使得構裝體在受到熱循環作用之下產生變形，並在焊錫接點外側角落產生最大等效應變，使得構裝體最外側焊錫接點與黏著墊接合處會造成疲勞破壞。針對本文所設計之基板模型在製程上省略了微貫孔樹脂增層基板重新佈線之問題；以結構分析而言，與樹脂增層基板比較之結果發現，此基板模型可降低整體構裝之位移量、最外側焊錫接點之等效應力、塑性剪應變範圍並增加其可靠度，且避免了焊錫接點下方與黏著墊發生脫離的可能。最後，以3-D模型探討在2-D平面應力分析時所會忽略掉的結果。
本文考慮焊錫接點黏塑性材料之潛變效應，以ANSYS有限元素軟體進行分析，改變WLCSP晶片與基板組裝上之設計，以提高其焊錫接點之疲勞壽命，作為WLCSP構裝體在設計組裝上之參考。

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