隨著半導體製程技術不斷進步，積體電路元件愈做愈小，頻率及功率，一直提升，但相對的高發熱量的問題也越來越嚴重，產生的高溫也是電子元件損壞的主因。針對半導體測試治具，本文先製作一環型水冷頭進行實驗與模擬分析，數值計算是使用COMSOL多重物理量耦合分析軟體，將實驗溫測與計算數據作比較，結果兩者很一致。然後於不改變水冷頭模組外觀之條件，再以數值模擬的方法，針對水冷頭在流量、銅底厚度等不同的參數，以及設計五款不同流道結構之水冷頭，來探討這些參數與設計對散熱性能的影響。最後依據前述之結果，實際改良製作第二款水冷頭，並進行實驗與數值模擬的結果相互比較與驗證。

As semiconductor process technology continually advances, the integrated circuit components become smaller, the frequency and the power rate get higher and higher. However, the high amount of heat causes more and more serious problems relatively. The heat generated is the main cause to the damages of electronic components.
In this thesis, a ring type water cooling device for IC test kits is fabricated and analyzed experimentally and numerically. The computed results by using the COMSOL Multiphysics software are compared with those taken from the experiments. Both results are consistent with each other.
In the condition without changing the water-cooling head module appearance, the numerical simulations are used to study the effects of different parameters (like the copper bottom thickness and flow rate) and five different designs of water channel structure on the heat-dissipation performances. According to the analysis results, the second water-cooling device is designed and made. The simulation results of the device are compared and verified with the experimental ones. From the results, it can be found that the performances of the second device are better than those of the first one.

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