本次實驗探討銀合金線燒球能力(球的真圓度)以及第一銲點品質能力，作業中小停機狀況，包含銲不黏(Non Stick On Pad , Non Stick On Lead) 、 切線後線尾穩定性(Short tail)及信賴性測試，並測試IMC (Intermetallic compounds)成長狀況。實驗結果得知，銀線燒球電流在20mA且保護氣體流量在0.25 l/min時其FAB良率較佳，第一銲點參數經田口實驗設計法實驗後得知，銀合金線不僅信賴性測試沒問題且作業性與目前的金線及銅合金線水準差距不大，作業參數範圍:金線>銀合金線>銅線。

The study explores the bonding capability of the silver-95% alloy wire, including the FAB (Free Air Ball) such as the ball roundness, and the first bond quality. The machine trouble shooting such as non-stick on pad, non-stick on lead, and short tail is also examined. The bonding reliability and IMC growth situations are tested and observed to evaluate the quality of the bonds.
Experimental results show that the yield of the silver-95% alloy wire FAB made by using 20mA current under the inert gas of 0.25 l/min is better. First bond parameters from the Taguchi experimental design indicate that the silver-95% alloy wire can be applied to Hybrid Flip Chip Ball Grid Array Packages because its reliability bond-ability and work-ability all pass the criteria. Moreover, the working window in descending order is gold wire> silver alloy wire> copper wire.

[1] G.G. Harman and J.Albers, "Ultrasonic Welding Mechanism as Applied to Alumimum-Wire and Dold -Wire Bonding in Microelectronics", IEEE Transactions on Parts Hybrids and Packaging, Vol 13, pp. 406-412, 1977.
[2] S. Kainmori, T. Nonaka and A.Mizoguchi, "The Development of Cu Bonding Wire with Oxidation-Resistant Metal Coating",IEEE Transaction on Advanced Packaging, Vol.29, pp. 227-213, 2006.
[3] T.Uno, "Enhancing Bondability with Coated Copper Bonding Wire" Microelectronics Reliability, Vol.51, pp. 88-96, 2011.
[4] 李俊德，蔡幸樺，蔡志欣，莊東漢，「21世紀封裝導線的新材料-銀金鈀合金線」，電子月刊，第十八卷，第四期 (民國一百零一年)，180-191頁。
[5] R. Guo, L. M. Gao, D. L. Mao, M. Li, X. Wang, Z. Lv, et al., "Study of free air ball formation in Ag-8Au-3Pd alloy wire bonding," Microelectronics Reliability, vol. 54, pp. 2550-2554, Nov 2014.
[6] C. Hang, C. Wang, M. Shi, X. Wu, H. Wang, "Study of Copper Free Air Ball in Thermosonic Copper Ball Bonding" , 6th International Conference on Electronic Packaging Technology, IEEE. 2005.
[7] S. Murali, N. Srikanth, Charles J, "Effect of Wire Size on The Formation of Intermetallics and Kirkendall Voids on Thermal Aging of Thermosonic Wire Bonds", pp. 3096-3101, 2004.
[8] S. Murali, N. Srikanth, Charles J, " An analysis of Intermetallics Formation of Gold and Copper Ball Bonding on Thermal Aging", Materials Research Bulletin, pp. 637-646, 2003.
[9] S.A Gam, H.J. Kim, J.S. Cho, Y.J. Park, J.T. Moon and K.W. Paik, "Effect of Cu and Pd Addition on Au Bonding wire/Al pad Interfacial Reactions and Bond Reliability", Journal of Electronic Materials, Vol.35, No. 11, pp. 2048-2055, 2006.
[10] T.S. Saraswati, T. Sritharan, C.I. Pang, Y.H. Chew, C.D. Breach, F. Wulff, S.G. Mhaisalkar and C.C. Wang, "The Effect of Ca and Pd Dopants on Gold Bonding Wire and Gold Rod", Thin Solid Films, Vol. 462, pp. 351-356, 2004.
[11] M.A. Bahi, P. Lecuyer, A. Gentil, H. Fremont, J.P. Landesman, F. Christien, "Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires", IEEE Electronics Packing Technology Conf, pp. 800-807, 2008.
[12] Y.W Lin, R.Y Wang, W.B. Ke, I.S. Wang, Y.T. Chiu, K.C Lu, K.L.Lin and Y.S. Lai, "The Pd Distribution and Cu Flow Pattern of the Pd-plated Cu Wire Bond and Their Effect on the Nanoindentation", Materials Science and Engineering A, Vol. 543, pp. 152-157, 2012.
[13] 徐瑞富，以田口方法改善金線偏移之銲線製程問題碩士論文，中原大學機械工程研究所，2004.
[14] 李輝煌，田口方法-品質設計的原理與實務，高立圖書有限公司，2004.
[15] 陳柏光，應用田口法探討銲線製程參數最佳化碩士論文，逢甲大學資訊電機工程碩士在職專班，2009.
[16] 楊正宏、李豐昇，「 田口式實驗計畫法應用於球格式封裝第二銲點零時最佳化參數」， 國立高雄應用科技大學 電子工程學系，2001年。
[17] C. H. Hsieh, J. H. Chou and Y. J. Wu, Optimal Takagi-Sugeno fuzzy gain-scheduler design using Taguchi-MHGA method, JSME International Journal, Series C, Vol.44, pp.143-155. (SCI, EI) , 2001..
[18] J. H. Chou and S. H. Chen, Robust stability analysis of the discrete Takagi-Sugeno fuzzy model, Proc. of the 1997 Automatic Control Conference, Taiwan, pp.410-415, March 1997.
[19] C. H. Hsieh, J. H. Chou and Y. J. Wu, Taguchi-MHGA method for optimizing Takagi-Sugeno fuzzy gain-scheduler, Proc. of the 2000 Automatic Control Conference, Taiwan, pp.523-528, March 2000.
[20] Z.-C. Lin, D.Y. Chang, A Neural Networks Approach Combined with Taguchi's Method for IC Leadframe Dam-bar Shearing Process, Journal of the Chinese Society of Mechanical Engineers Vol.29 No.5, pp. 355-364, October 2008.