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研究生: 莊書璋
Chuang, Shu-Chang
論文名稱: 具支援製造與設備工程程序能力的設備連接架構
Equipment Connection Framework for Supporting Manufacturing- and Equipment-Engineering Processes
指導教授: 鄭芳田
Cheng, Fan-Tien
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 製造工程研究所
Institute of Manufacturing Engineering
論文出版年: 2005
畢業學年度: 93
語文別: 中文
論文頁數: 142
中文關鍵詞: 半導體設備與材料國際聯盟國際半導體技術組織機台使用效能先進製程控制先進機台控制電子診斷電子化製造
外文關鍵詞: EES, OEE, ISMI, SEMI, APC, AEC, EDA, e-Manufacturing, e-Diagnostics
相關次數: 點閱:95下載:6
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  •   隨著全球半導體技術的迅速發展,對於如何提高生產良率(Yield)及整體設備使用效能(Overall Equipment Effectiveness, OEE),已成為降低生產成本及提高產品品質的關鍵指標。為有效提昇此關鍵指標,半導體廠在引進製程設備之後,無不投入大量資源,致力於提昇設備使用率與生產線的可靠度與彈性,以獲取最大的產出良率及降低生產成本。
      為了提昇及維護機台的效能並降低因停機產生的成本損失,現階段已有許多相關的設備工程(Equipment Engineering)解決方案持續進行研究並被導入,包括OEE提昇、智慧型預測保養、虛擬量測、APC(Advanced Process Control)及AEC(Advanced Equipment Control)等技術之引用。此類技術均須依賴機台生產時的詳細資料,因此國際半導體設備與材料組織(SEMI)為半導體業之設備工程(Equipment Engineering)制定了機台資料擷取(Equipment Data Acquisition, EDA)介面規範,此介面規範亦稱為Interface A。
      有鑑於此,本研究即建構一個具支援製造與設備工程程序能力的設備連線架構,將機台資料分成製程控制及設備工程兩大部份,以結構化的方式表達機台特性,所取得的機台資料分別透過不同匯流排(Bus)送出,俾同時兼顧製程控制與設備工程之資料擷取需求,有效改善廠內網路頻寬。

     Confronting the rapid development and vigorous competition of semiconductor industry, how to improve yield and overall equipment effectiveness(OEE)has become the key index to production cost deduction and product quality improvement. In order to effectively improve this key index, the semiconductor manufacturers invest a lot of capital in production equipment to improve the utility and availability of production equipment and the reliability and flexibility of the production line for the largest yield and lowest production cost.
     In order to improve and assert the performance of production equipment and prevent the extra production cost resulted from equipment failure, many researches and solutions on related equipment engineering are proposed, for example, OEE improvement, intelligent prognostics maintenance, virtual metrology, advanced process control(APC), advanced equipment control(AEC), etc. All these technologies require detailed data collected from production equipment; hence SEMI defined the interface standard, so called Interface A, for the equipment data acquisition(EDA)of equipment engineering of semiconductor industry.
     Thus, in this work we propose equipment connection framework for supporting both manufacturing and equipment engineering processes to classify the equipment data into two groups, for manufacturing process control and equipment engineering to systematically present the equipment attributes. The classified equipment data is exported via different buses, accordingly not only the requirement of equipment engineering data retrieve is fulfilled but also the transition of intranet is effectively improved.

    目錄 中文摘要 英文摘要 誌謝 目錄 I 圖目錄 IV 表目錄 VII 第一章 緒論 1 1.1 研究背景 1 1.2 研究動機與目的 3 1.3 論文架構 8 第二章 文獻探討 9 第三章 理論基礎與核心技術 18 3.1 半導體設備資料傳輸通訊協定 18 3.2 網路服務(Web Services) 24 3.3 網路資訊安全技術 30 3.4 統一模塑語言(UML) 35 3.5 物件導向軟體開發程序 36 第四章 設備連接架構之設計與需求分析 39 4.1 Equipment Connection Framework(EQC Framework)之架構設計 39 4.1.1 Manufacturing Portion(Equipment Connection系統) 40 4.1.2 Engineering Portion(GED系統) 43 4.2 Equipment Connection Framework系統功能需求分析 58 4.2.1 Manufacturing Portion(Equipment Connection系統)需求分析 58 4.2.2 Engineering Portion(GED系統)功能需求分析 59 第五章 物件導向分析 62 5.1 物件導向分析(OOA)之Use Case Diagram 62 5.2 EQC Framework系統Use Cases敘述與物件導向分析(OOA)之Sequence Diagrams 65 5.3 Manufacturing Portion(Equipment Connection系統) 65 5.3.1 Equipment Initialize/End 65 5.3.2 Configure Equipment Parameter 66 5.3.3 Control Equipment 67 5.3.4 Monitor Equipment 71 5.3.5 Control Recipe 72 5.3.6 ECS物件導向分析(OOA)之Class Diagram 74 5.4 Engineering Portion(GED系統) 76 5.4.1 Configure Data Collection Plan 76 5.4.2 Activate DCPlan 77 5.4.3 Deactivate DCPlan 78 5.4.4 Single Client and Multi-DCP Activation/Deactivation 79 5.4.5 Multi-Client and Single DCP Activation/Deactivation 80 5.4.6 Multi-Client and Multi-DCP Activation/Deactivation 82 5.4.7 Warn Performance Degradation 83 5.4.8 Get Defined Privilege 84 5.4.9 Add/Delete ACL Entry 85 5.4.10 Authentication/Authorization 87 5.4.11 Get/Set sessions 88 5.4.12 GED 物件導向分析(OOA)之Class Diagram 89 第六章 物件導向設計 91 6.1 EQC Framework物件導向設計(OOD)之Sequence Diagrams 91 6.2 Manufacturing Portion(Equipment Connection系統) 91 6.2.1 Equipment Initialize/End 91 6.2.2 Configure Equipment Parameter 92 6.2.3 Control Equipment 93 6.2.4 Monitor Equipment 97 6.2.5 Control Recipe 98 6.2.6 OOD階段之Class Diagram 100 6.3 Engineering Portion(GED系統) 101 6.3.1 Configure Plan 101 6.3.2 Acticvate Plan 106 6.3.3 Deactivate Plan 107 6.3.4 Single Client and Multi-DCP Activation/ Deactivation 108 6.3.5 Multi-Client and Single DCP Activation/Deactivation 110 6.3.6 Multi-Client and Multi-DCP Activation/ Deactivation 111 6.3.7 Warn Performance Degradation 113 6.3.8 Get Defined Privilege 114 6.3.9 Add/Delete ACL Entry 115 6.3.10 Authentication/Authorization 116 6.3.11 Get/Set sessions 117 6.3.12 OOD階段之Class Diagram 118 第七章 系統實作與整合 119 7.1 開發環境 119 7.2 系統實作 120 7.2.1 Remote Client端使用者介面 120 7.2.2 Security Admin端使用者介面 126 7.2.3 GED端使用者介面 129 7.2.4 ECS使用者介面 132 第八章 結論 139 8.1 研究成果與論文總結 139 8.2 未來研究方向 139 參考文獻 140

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