| 研究生: |
莊書璋 Chuang, Shu-Chang |
|---|---|
| 論文名稱: |
具支援製造與設備工程程序能力的設備連接架構 Equipment Connection Framework for Supporting Manufacturing- and Equipment-Engineering Processes |
| 指導教授: |
鄭芳田
Cheng, Fan-Tien |
| 學位類別: |
碩士 Master |
| 系所名稱: |
電機資訊學院 - 製造工程研究所 Institute of Manufacturing Engineering |
| 論文出版年: | 2005 |
| 畢業學年度: | 93 |
| 語文別: | 中文 |
| 論文頁數: | 142 |
| 中文關鍵詞: | 半導體設備與材料國際聯盟 、國際半導體技術組織 、機台使用效能 、先進製程控制 、先進機台控制 、電子診斷 、電子化製造 |
| 外文關鍵詞: | EES, OEE, ISMI, SEMI, APC, AEC, EDA, e-Manufacturing, e-Diagnostics |
| 相關次數: | 點閱:95 下載:6 |
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隨著全球半導體技術的迅速發展,對於如何提高生產良率(Yield)及整體設備使用效能(Overall Equipment Effectiveness, OEE),已成為降低生產成本及提高產品品質的關鍵指標。為有效提昇此關鍵指標,半導體廠在引進製程設備之後,無不投入大量資源,致力於提昇設備使用率與生產線的可靠度與彈性,以獲取最大的產出良率及降低生產成本。
為了提昇及維護機台的效能並降低因停機產生的成本損失,現階段已有許多相關的設備工程(Equipment Engineering)解決方案持續進行研究並被導入,包括OEE提昇、智慧型預測保養、虛擬量測、APC(Advanced Process Control)及AEC(Advanced Equipment Control)等技術之引用。此類技術均須依賴機台生產時的詳細資料,因此國際半導體設備與材料組織(SEMI)為半導體業之設備工程(Equipment Engineering)制定了機台資料擷取(Equipment Data Acquisition, EDA)介面規範,此介面規範亦稱為Interface A。
有鑑於此,本研究即建構一個具支援製造與設備工程程序能力的設備連線架構,將機台資料分成製程控制及設備工程兩大部份,以結構化的方式表達機台特性,所取得的機台資料分別透過不同匯流排(Bus)送出,俾同時兼顧製程控制與設備工程之資料擷取需求,有效改善廠內網路頻寬。
Confronting the rapid development and vigorous competition of semiconductor industry, how to improve yield and overall equipment effectiveness(OEE)has become the key index to production cost deduction and product quality improvement. In order to effectively improve this key index, the semiconductor manufacturers invest a lot of capital in production equipment to improve the utility and availability of production equipment and the reliability and flexibility of the production line for the largest yield and lowest production cost.
In order to improve and assert the performance of production equipment and prevent the extra production cost resulted from equipment failure, many researches and solutions on related equipment engineering are proposed, for example, OEE improvement, intelligent prognostics maintenance, virtual metrology, advanced process control(APC), advanced equipment control(AEC), etc. All these technologies require detailed data collected from production equipment; hence SEMI defined the interface standard, so called Interface A, for the equipment data acquisition(EDA)of equipment engineering of semiconductor industry.
Thus, in this work we propose equipment connection framework for supporting both manufacturing and equipment engineering processes to classify the equipment data into two groups, for manufacturing process control and equipment engineering to systematically present the equipment attributes. The classified equipment data is exported via different buses, accordingly not only the requirement of equipment engineering data retrieve is fulfilled but also the transition of intranet is effectively improved.
[1] “Industry White Paper – Making Sense of e-Manufacturing: A Roadmap for Manufacturers”, Rockwell Automation, Nov. 2000.
http://www.rockwellautomation.com/
[2] J. Lee, S. A. Ali, and M. Koc, “e-Manufacturing – Its Elements and Impact”, in Proceedings of the Annual institute of Industrial Engineering(IIE)Conference, Advances in Production Session, Dallas, Texas, USA, May 21-23, 2001.
[3] D. Bloss and D. Pillai, “E-Manufacturing Opportunities in Semiconductor Processing”, Semiconductor International, July 2001.
http://www.e-insite.net/semiconductor
[4] P. Singer, “E-Diagnostics: Monitoring Tool Performance”, Semiconductor International, Mar. 2001.
http://www.e-insite.net/semiconductor
[5] SEMI, Semiconductor Equipment and Material International.
http://www.semi.org/
[6] ISMI, International SEMATECH Manufacturing Initiative.
http://www.sematech.org/
[7] e-Diagnostics and EEC Workshop, International SEMATECH, Austin, Texas, USA, Oct. 19, 2001.
http://www.sematech.org/
[8] International SEMATECH, Equipment Engineering Capabilities (EEC) Guidelines, Version 2.5, International SEMATECH, July 2002.
[9] International SEMATECH, e-Diagnostics and EEC Guidance, International SEMATECH, 18 July 2003.
[10] e-Diagnostics Guidebook, version 1.6, International SEMATRCH, June 4, 2004.
[11] IBM, Enhanced Fab. Performance through Interface A, IBM, 18 July 2003.
[12] “Standard for SEMI Equipment Communication Standard Message Service,”
Global Information & Control Committee, SEMI E13, 1999.
[13] Y.C. Lin, “A Generic Embedded Device for e-Diagnostics Interface A of Semiconductor Industry”, Aug. 2004.
[14] ASYST Technologies INC.
http://www.asyst.com/default.asp
[15] CIMPortal Software for the Interface A SEMI Standards.
http://www.cimetrix.com/cimportal.cfm
[16] Lumax International Corp., Ltd
http://www.elumax.com/index_en.asp
[17] SEMI, Equipment Automation/Software Vol. 1 and 2, Semiconductor Equipment
and Materials International, 1996.
[18] “SEMI equipment communications standard 2 message content,” Global Information & Control Committee, SEMI E5-0600, 1998.
[19] SEMATECH, HSMS Technical Education Report, SEMATECH, 1995.
[20] HTTP Specification, World Wide Web.
http://www.w3.org/Protocols/Specs.html
[21] XML Specification, World Wide Web.
http://www.w3c.org/XML
[22] SOAP Specification, World Wide Web.
http://www.w3c.org/tr/soap
[23] Web Services Description Language, version 2.0.
http://www.w3.org/TR/2004/WD-wsdl20-20040803/
[24] H. E. Eriksson and M. Penker, UML Toolkit, NY: John Willy & Sons, 1998.
[25] G. Booch, Object-Oriented Analysis and Design with Applications, Redwood City,
CA: Benjamin Cummings, 1994.
[26] J. Rumbough, M. Blaha, and W. Premerlani, F. Eddy, and F. Lorensen,
Object-Oriented Modeling and Design, Englewood Cliffs, NJ: Prentice-Hall, 1991.
[27] I. Jacobson, M. Christerson, and G. vergaard, Object-Oriented Software
Engineering, Reding, NY: Addison-Wesley, 1992.
[28] D. Coleman, S. Bodoff, and P. Arnold, Object-Oriented Development: The Fusion
Method, NJ: Prentice Hall, 1994.
[29] UML, OMG's 1997 Press Releases.
http://www.omg.org/news/pr97.htm
[30] SEMI, The EDA Dataport - An Overview, in e-Manufacturing Workshop.
[31] SEMI, SEMI E120-0305 Specification for the Common Equipment Model(CEM), Semiconductor Equipment and Materials International, November 2004.
[32] SEMI, SEMI E125-0305 Specification for Equipment Self Description(EqSD), Semiconductor Equipment and Materials International, November 2004.
[33] SEMI, SEMI E132-0305 Specification for Equipment Client Authentication And Authorization , Semiconductor Equipment and Materials International, November 2004.
[34] SEMI, SEMI E124-0305 Specification for Data Collection Management, Semiconductor Equipment and Materials International, November 2004.
[35] Borland C++ Builder 6.0, Borland Corporation.
http://www.borland.com/cbuilderx/
[36] Microsoft Access, Microsoft Corporation.
http://www.microsoft.com/