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研究生： 施育呈
Shih, Yu-Cheng
論文名稱： 中溫熱電材料ZnSb製程設計與石墨烯阻障層效應探討
Process Design of Medium-Temperature Thermoelectric ZnSb and the Effectiveness of Graphene Barrier Layers
指導教授： 施士塵
Shih, Shih-Chen
林仁輝
Lin, Jen-Fin
學位類別： 碩士
Master
系所名稱： 工學院 - 機械工程學系
Department of Mechanical Engineering
論文出版年： 2025
畢業學年度： 113
語文別： 中文
論文頁數： 98
中文關鍵詞： 鋅銻熱電材料 、火花電漿燒結 、Seebeck係數 、熱電優值 、石墨烯阻障層 、微觀結構
外文關鍵詞： Zinc antimonide thermoelectric material, Spark plasma sintering(SPS), Seebeck coefficient, Figure of merit, Graphene barrier layer, Microstructure
相關次數： 點閱：33  下載：0 
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    • 口試合格證書 I 摘要 II Abstract IV 誌謝 XIII 目錄 XIV 圖目錄 XVII 表目錄 XVIII 第一章 緒論 1 1-1 前言 1 1-2 文獻回顧 2 1-2-1 中溫熱電材料選擇 2 1-2-2 加強材料熱電效能的方法 4 1-2-3 阻障層材料的選擇 5 1-3 研究動機 7 1-4 研究歷程與目標 8 第二章 應用理論 10 2-1 應用理論 10 2-1-1 熱電優值 10 2-1-2 阿基米德法密度計算 10 2-1-3 塊材晶粒大小計算 11 2-1-4 Seebeck 係數 11 2-1-5 晶粒細化對熱導率的影響 12 2-1-6 晶粒尺寸與晶界密度關係 13 2-2 應用機制 13 2-2-1 機械合金化 13 2-2-2 不同粉體製程對晶粒結構與熱電性能的調控機制 15 2-2-3 SPS 燒結機制與緻密化原理 16 2-2-4 石墨烯作為 ZnSb 擴散阻障層的界面穩定機制 18 第三章 製程與實驗量測 20 3-1 ZnSb粉末冶金製程之粉末製作 20 3-1-1 ZnSb粉末球磨合金化 20 3-1-2 球磨時間參數調整 21 3-1-3 粉末粒徑量測 21 3-2 三種不同製程製備ZnSb 22 3-2-1 製程A之目的 23 3-2-2 燒結製程參數設定 25 3-2-3 製程B之目的 25 3-2-3 製程C之目的 26 3-3 粉體晶相與粒徑分析 27 3-3-1 粒徑量測 27 3-3-2 ZnSb粉體XRD晶相分析 27 3-4 塊材性質量測 28 3-4-1 熱傳導性質量測 28 3-4-2 電阻率與Seebeck係數量測 28 3-4-3 晶相分析 29 3-4-4 微結構觀察 29 3-4-5 相對密度量測 29 3-5 石墨烯阻障層之製備 30 3-5-1 石墨烯製備 30 3-5-2 石墨烯阻障層的轉印與界面分析 30 3-5-3 轉印石墨烯後ZnSb熱電性能量測 32 3-6 實驗設備 32 第四章 結果與討論 35 4-1 ZnSb粉末製作 35 4-1-1 機械合金化參數調整 35 4-1-2 粉末結構與結晶分析 36 4-2 火花電漿燒結 39 4-2-1 塊材相對密度量測 39 4-2-2 晶體結構與結晶分析 42 4-2-3 Seebeck係數量測 46 4-2-4 電導性質量測 47 4-2-5 熱傳導性質量測 49 4-2-6 熱電優值(ZT) 50 4-2-7 TEM分析 53 4-3 石墨烯阻障層 62 4-3-1 拉曼分析 62 4-3-2 阻障層效果的斷面觀察 63 4-3-3 擴散層橫截面導電性分析 66 4-3-4 石墨烯阻障層對ZEM-3熱電性質的影響 66 第五章 結論與未來展 71 5-1 結論 71 5-2 未來展望 72 第六章 參考文獻 74

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