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研究生: 曾介正
Tseng, Jie-Jeng
論文名稱: 加強嵌入式系統記憶體模組可靠度之研究
A Study on Memory Module Reliability improvement of embedded system
指導教授: 王宗一
Wang, Tsung-I
學位類別: 碩士
Master
系所名稱: 工學院 - 工程科學系碩士在職專班
Department of Engineering Science (on the job class)
論文出版年: 2006
畢業學年度: 94
語文別: 中文
論文頁數: 78
中文關鍵詞: 嵌入式系統靜電可靠度關鍵性任務三倍冗餘判決漢明碼
外文關鍵詞: Triple Modular Redundancy (TMR), Hamming Code, Critical Mission, Reliability, Electrostatic Discharge, Embedded Systems
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  •  雖然現今電子技術的進步日新月異,產品的可靠度(Reliability)也一直在改善,但在今日電子系統的架構趨於複雜,以致所需組成的元件也變多,單一元件縱使具有高可靠度,但大量的元件組合在一起之後,其出錯的機率便會大增,進而抵消掉元件本身的可靠性,這是在某些應用於關鍵性任務(Critical Mission)的系統而言,因其無法忍受錯誤的發生,所無法接受的。
     造成電子產品出錯的性質主要有分兩種,一種為硬錯誤(Hard Error);另一種為軟錯誤(Soft Error),硬錯誤指受到外界然環境中強大的能量如雷擊(Surge)或靜電(Electrostatic Discharge)的瞬間放電而造成系統元件永久性損壞。軟錯誤則是指半導體元件受到不明帶電粒子影響,如果正好撞擊到記憶體中的儲存單元,只要能量足夠就會導致位元翻轉,造成資料錯誤。
     本研究擬針對造成硬體系統硬錯誤的主因"靜電"作一探討並討論如何透過一些技巧改善此現象所造成的損害及如何驗證一個產品的抗靜電能力,而針對軟錯誤本研究則根據目前常用的容錯編碼方式:三倍冗餘判決(Triple Modular Redundancy TMR)及漢明碼(Hamming code),去探討兩者之間的差異及比較兩者之間的優缺點。
     最後本研究會嘗試去規劃並實作出一個小型音樂播放系統,去展示如何去應用TMR編碼方式來改善一個嵌入式系統的容錯能力。

     With technology advanced day by day, the reliability of electronic products is improving gigantically too. However, an electron system to date tends to contain more and more components when its functionality becomes more complex. Even when the reliability of every single component is high, the probability of a system becoming erroneous is also high if the interactions between components are faulty. For systems used in a critical mission, fault is unendurable and unacceptable.
     There are two kinds of error in electronic products: the Hard Error and the Soft Error. Hard Errors result in permanent damages in a system's components. It could be caused by the struck of strong energy from external environment like electromagnetic waves or electrostatic discharge. Soft Errors result in temporary malfunctions of a system's components. It could be caused by unknown charged particles; mostly when they hit the memory components. It usually causes data error when there is sufficient power to turn memory cell bits over.
     This research is to design a fault-tolerant memory module that can almost free from soft errors caused by "Electrostatic Discharge". The design methodology can be applied to memory designs for any embedded systems. It is based on the commonly used fault-tolerant encoding method: the Triple Modular Redundancy (TMR) and the Hamming Code encoding scheme. This methodology considers also the way to verify the product's anti-static electricity ability.
     The result of this research is verified by a mini music player, demonstrating how the fault-tolerant memory module of an Embedded System with TMR encoding can be designed and implemented.

    中文摘要 ........................III Abstract ........................IV 誌謝 ..........................V 目 錄 .........................VI 圖目錄 .........................VIII 表目錄 .........................X 第一章 緒論 ......................1  1-1研究背景與動機...................1  1-2研究目的......................2  1-3研究範圍與限制...................3  1-4研究方法與流程...................4  1-5各章節概要.....................6 第二章 相關探討.....................7  2-1 Electrostatic Discharge Immunity Test.......8  2-1-1 ESD成因.....................8  2-1-2 ESD場地設置...................9  2-1-3 ESD測試方式...................9  2-1-4 ESD通過條件...................11  2-1-5 ESD解決對策...................12  2-2 Radiated Susceptibility Test ...........13  2-2-1 Radiated Susceptibility場地設置.........14  2-2-2 Radiated Susceptibility通過條件.........15  2-3 Conducted Susceptibility (CS) Test ........15  2-3-1 Conducted Susceptibility場地設置 ........16  2-3-2 Conducted Susceptibility測試方式 ........16  2-4 TMR與Hamming code.................17  2-4-1三倍冗餘判決-TMR(Triple Modular Redundancy) ..17  2-4-2 TMR與Hamming code的比較.............18  2-5 相關元件介紹 ...................19  2-5-1 ATMega128元件介紹(ok)..............19  2-5-2 MA8205元件介紹 .................22  2-5-3 PLD簡介.....................24 第三章 系統分析與規劃..................25  3-1 系統功能分析 ...................26  3-2 嵌入式系統硬體規劃 ................26  3-3 PLD Function block ................28  3-3-1規格定義.....................28  3-3-2 示意圖說明 ...................29  3-3-3 TMR編碼.....................30  3-3-4 TMR解碼.....................30  3-3-4 記憶體模熱插拔 .................33  3-4 微控制器規劃 ...................33  3-4-1 微控制器資源規劃 ................34  3-5 PC端軟體-RemotePlayer ..............34  3-5-1 使用者介面 ...................35  3-5-2 Use case ....................36  3-5-3 Sequence Diagram ................37 第四章 系統實作.....................39  4-1 實作環境 .....................40  4-2 PLD相關實作....................40  4-2-1 PLD硬體實作...................41  4-2-2 PLD軟體實作...................42  4-2-3 Tri-state問題..................47  4-2-4 ALE訊號的時序問題................50  4-3 微控制器相關實作 .................54  4-3-1 記憶體測試 ...................54  4-3-2 RS-232 實作...................57  4-3-3 中斷問題 ....................59  4-3-3 Auto Recovery..................59  4-4資料傳輸相關實作..................60  4-4-1 PC端軟體-RemotePlayer..............60  4-5 MP3 Decoder相關實作................62  4-5-1 另人混淆的SPI介面................63  4-5-2 該使用XCS或XDCS? ................64  4-5-3 GPIO驅動 vs SPI驅動...............65  4-6 系統整合 .....................67 第五章 結論與未來研究方向................69  5-1結論........................69  5-2未來研究方向....................69 附錄 ..........................71 參考資料 ........................77 自 述 .........................78

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