| 研究生: |
劉政良 Liu, Cheng-Liang |
|---|---|
| 論文名稱: |
分子動力學運用於薄膜機械性質之計量與實驗 Investigation of Indentation Process and Quantitative Evaluation of Thin Film Mechanical Properties Using Molecular Dynamics Simulation |
| 指導教授: |
林仁輝
Lin, Jen-Fin |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 機械工程學系 Department of Mechanical Engineering |
| 論文出版年: | 2004 |
| 畢業學年度: | 92 |
| 語文別: | 中文 |
| 論文頁數: | 120 |
| 中文關鍵詞: | 楊氏模數 、分子動力學 、勢能 、奈米壓痕 |
| 外文關鍵詞: | Molecular dynamics, Nanoindentation, young's modulus, potential |
| 相關次數: | 點閱:90 下載:2 |
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奈米壓痕是最近發展出的技術,一種量測薄膜的機械性質的新方法。當薄膜厚度愈來愈薄之時,微硬度試驗實驗上有它的缺陷,因此奈米壓痕技術隨即受到注目。其利用負載與壓痕深度的關係圖,來求得薄膜的機械性質。而本研究中,實驗方面使用NanoTest來量測鑽石膜,而金膜跟鎳膜則是使用Hysitron TriboScope®來量測,藉此得到鑽石膜、金膜及鎳膜的機械性質。而其接觸的機制一直受到注意,因此為了觀察其微觀接觸下的界面效應,本研究還使用分子動力學做為工具,希望藉由其原子動態的特性來幫助瞭解接觸界面間的物理現象,並且與實驗結果相互比較。模擬方面,使用Tersoff勢能來描述碳原子的行為,而金和鎳則是使用TB-SMA勢能來描述。本文研究發現硬度及楊氏模數會隨著溫度上升而下降;並且在相同負載速度之下,不同壓深會造成硬度及楊氏模數的變化。另外,壓痕器在壓痕過程中會產生磨耗及壓縮的現象,造成壓痕器的投影面積估算上的誤差,使得硬度高估的現象。此外,在相同壓深之下,增加負載速度,可以發現硬度及楊氏模數都呈現上升的趨勢。
Mechanical properties of diamond, gold and nickel films were investigated by nanoindentation experiments and molecular dynamics (MD). Molecular dynamics is used to describe the atomistic interface behavior under indentation. The Tersoff potential function was used to describe the behavior of carbon atoms and gold and nickel atoms were described by the TB-SMA potentials. The results showed that both the hardness and Young’s modulus of the films are decreased as the temperature increased. The hardness and Young’s modulus are increased with increasing loading rate. Compared with nanoindentation experiments and MD result it can obtain that the indentation load and penetration became weaker as the film was thinner due to the size effect. Under the same loading rate, the hardness and Young’s modulus decreased due to the increasing penetration depth. Furthermore, because of the indenter’s wear and compressive occurrence under indentation, the hardness could be under-estimated using determination for the projection contact area.
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