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研究生： 林帛毅
Lin, Bo-Yi
論文名稱： 探討迴焊製程中銦基及鎵基熱界面材料之界面行為
Investigation of Interface Behaviors of Indium- and Gallium-Based Thermal Interface Materials during Reflow Process
指導教授： 郭瑞昭
Kuo, Jui-Chao
學位類別： 碩士
Master
系所名稱： 工學院 - 材料科學及工程學系
Department of Materials Science and Engineering
論文出版年： 2023
畢業學年度： 111
語文別： 中文
論文頁數： 244
中文關鍵詞： 熱界面焊料 、擴散接合 、介金屬化合物相 、熱穩定性 、接合品質
外文關鍵詞： Thermal-interface materials solder, Diffusion bonding, Intermetallic compound phase, Thermal stability, Bonding quality
相關次數： 點閱：66  下載：0 
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    • 目錄 中文摘要 I Extended Abstract III 誌謝 XII 目錄 XV 表目錄 XX 圖目錄 XXVI 第一章　前言 1 第二章　文獻回顧 4 2.1　電子構裝之沿革 4 2.2　熱界面材料 8 2.3　熱界面銲料中之介金屬化合物 12 2.4　銲料之強化行為 15 第三章　材料與實驗方法 20 3.1　實驗目的 20 3.2　實驗材料 22 3.3　實驗流程 24 3.4　試片製備 25 3.5　熱界面銲料之XRD分析 28 3.6　熱界面銲料之EBSD分析 30 3.6.1 晶粒形貌分析 30 3.6.2 相分布分析 32 3.6.3 Dictionary re-indexing分析 33 3.6.4 晶粒尺寸分析 35 3.6.5 Schmid Factor分析 36 3.7 熱界面銲料之奈米壓痕分析 38 第四章　實驗結果 40 4.1　銦基底熱界面銲料之基材性質分析 40 4.1.1 相鑑定分析 40 4.1.2 相分布分析 45 4.1.3 晶粒尺寸分析 50 4.1.4 Schmid Factor分析 53 4.1.5 界面強度分析 57 4.2　銦基熱界面材料之介金屬化合物性質分析 64 4.2.1 相鑑定分析 64 4.2.2 相分布分析 68 4.2.3 晶粒尺寸分析 71 4.2.4 Schmid Factor分析 74 4.3　鎵基熱界面材料之基材性質分析 78 4.3.1 相鑑定分析 78 4.3.2 相分布分析 88 4.3.3 晶粒尺寸分析 99 4.3.4 Schmid Factor分析 104 4.3.5 界面強度分析 110 4.4　鎵基熱界面材料之介金屬化合物性質分析 125 4.4.1 相鑑定分析 125 4.4.2 相分布分析 132 4.4.3 晶粒尺寸分析 138 4.4.4 Schmid Factor分析 143 4.4.5 界面強度分析 150 4.5　迴焊製程鎵基熱界面材料之基材性質分析 152 4.5.1 相鑑定分析 152 4.5.2 相分布分析 157 4.5.3 晶粒尺寸分析 162 4.5.4 Schmid Factor分析 165 4.5.5 界面強度分析 169 4.6　迴焊製程鎵基熱界面材料之介金屬化合物性質分析 176 4.6.1 相鑑定分析 176 4.6.2 相分布分析 181 4.6.3 晶粒尺寸分析 186 4.6.4 Schmid Factor分析 190 4.6.5 界面強度分析 194 第五章　討論 197 5.1　銦基熱界面材料界面接合之熱穩定性 197 5.2　鎵基熱界面材料界面接合之熱穩定性 202 5.3　熱膨脹對熱界面材料界面接合之影響 215 5.4　迴焊製程對介金屬化合物演化之影響 219 第六章　結論 229 參考文獻 232 Curriculum vitae 244

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