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研究生: 張逸輝
Chang, I-Hui
論文名稱: 晶圓廠模擬模式之建立與分析
Simulation modeling and analysis for wafer fabrication facilities
指導教授: 楊大和
Yang, Taho
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 製造工程研究所
Institute of Manufacturing Engineering
論文出版年: 2004
畢業學年度: 92
語文別: 中文
論文頁數: 79
中文關鍵詞: 自動化物料搬運系統12吋晶圓廠系統模擬虛擬晶圓廠模擬平台
外文關鍵詞: 300mm wafer fabrication, VFSP, AMHS, simulation modeling
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  •   本文介紹一個虛擬晶圓廠模擬平台 (Virtual Fab Simulation Platform, VFSP) 之建構,以及VFSP在12吋晶圓廠全廠自動化之應用。VFSP 是一套具有高度彈性與效率的晶圓廠模擬工具,可用來探討晶圓廠在計劃以及實際運作階段時所面臨到的相關議題。VFSP使用三層式架構,所以在維護上非常容易,本研究中的VFSP整合了製程系統與自動化物料搬運系統(Automated Material Handling System , AMHS)。VFSP的高度彈性,讓使用者可以更輕易的改晶圓廠參數設定,並調整不同的投料策略與機台派工,實驗設計確定後,VFSP 可有效率的進行實驗,並收集與分析系統產出資料。
      在本研究中所使用的晶圓廠機台與產品製程資料,是由Campbell於2000年所發表300 mm Factory Layout and Material Handling Modeling:Phase II Report (以下簡稱I300I Phase II Report)中所提供。將這些資料輸入進VFSP,然後使用VFSP產生一個包含自動化物料搬運系統的12吋晶圓廠模擬模型,接著將VFSP的產出資料與I300I Phase II Report的產出結果相互比較。經過確認後,VFSP的產出結果與I300I Phase II Report的產出結果,沒有充分的證據顯示兩個系統有顯著的差異。
      第二部份的研究,主要是在討論VFSP的自動化物料搬運系統考量與否。經過實驗後發現,未包含自動化物料搬運系統的模型,其平均Cycle Time較有考量自動化物料搬運系統的模型低4.6%。同樣的在比較平均WIP量時,未包含自動化物料搬運系統的模型,其平均WIP量較有考量自動化物料搬運系統的模擬模型低4.7%。

      This paper presents a virtual fab simulation platform (Virtual Fab Simulation Platform, VFSP) that provides an efficient and flexible modeling tool to investigate various production issues during planning and implementation phases of 300mm wafer fabrication. The VFSP with three-tier system architecture is aimed to address full-fab automation integrating manufacturing process and automated material handling system (AMHS). Several simulation experiments are conducted to demonstrate the potential applications of the VFSP.
      In this study, the simulation study of wafer fab consider both models with AMHS and without AMHS functions. The simulation results show the average cycle time of model without AMHS function is 4.6% smaller than the model with AMHS function. Similiarly, the average WIP of model without AMHS function is 4.7 % less than the model with AMHS function.

    摘要 Ⅰ ABSTRACT Ⅱ 誌 謝 Ⅲ 目 錄 Ⅳ 圖 目 錄 Ⅵ 表 目 錄 VIII 第一章 緒論 1 1.1 研究動機 1 1.2 研究前提與限制 2 1.3 研究目的 3 1.4 研究流程 4 1.5 論文架構 4 第二章 文獻探討 6 2.1 積體電路製造流程介紹 6 2.2 INTERNATIONAL SEMATECH介紹 8 2.3 晶圓廠模擬模型的發展 9 2.4 晶圓廠全廠模擬模型優缺點探討 11 2.5 使用VFSP發展晶圓廠全廠模擬模型 12 第三章 模式建立 14 3.1 虛擬晶圓廠模擬平台說明 14 3.2 系統假設說明 16 3.3 晶圓廠加工機台說明 18 3.4 晶圓廠自動化物料搬運系統說明 30 3.5 衡量指標 35 3.6 系統穩態的決定 36 3.7 模擬方式決定 36 3.8 產出資訊的標準差、變異數與信賴區間的計算 36 3.9 比較兩個模擬專案的方法 37 第四章 VFSP模擬系統功能說明 39 4.1 基本資料的輸入 39 4.2 參數功能說明 45 4.3 產出資料的計算 52 第五章 研究方法與實驗 55 5.1 模擬模型說明 55 5.2 實驗流程說明 55 5.3 模擬參數的決定 56 5.4 比較I300I PHASE II REPORT與VFSP含自動化物料搬運系統 59 5.5 VFSP含搬運系統與不含搬運系統模型之比較 61 5.6 VFSP含搬運系統與不含搬運系統之模擬時間比較 63 第六章 結論 65 6.1 結論 65 6.2 未來研究建議 66 參考文獻 68 附 錄 72

    林則孟,(民90),系統模擬理論與應用,滄海書局。
    姜林杰祐、張逸輝、陳家明、黃家祚,(民90),系統模擬eM-Plant操作與實務,華泰文化事業股份有限公司。
    莊達人,(民87),VLSI製造技術,高立圖書有限公司。
    羅文雄、蔡榮輝、鄭岫盈,(民92),半導體製造技術,滄海書局。
    Bader, U., Besler, A., Schliesser, J. and Dorner, J., 1999, A view to the future – a modular simulation kit for cost-efficient fab-wide planning and the simulation of automated material handling systems in the semiconductor industry, 1999 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, 109-112.
    Bachrach, R., Pool, M., Genovese, K., Moran, JC, O'Halloran, M.D., Connolly, T.J., IDC, 2003, 300mm晶圓廠架構的比較分析:製程設備對於晶圓成本和動態效能的影響, 台灣半導體產業協會簡訊.
    Campbell, E., Ammenheuser, J., 2000, 300 mm Factory Layout and Material Handling Modeling: Phase II Report, International SEMATECH, Technology Transfer # 99113848B-ENG
    Campbell, P., Laitinen, G., 1997, Overhead Intrabay Automation and Microstocking – a virtual fab case study, Proceedings of the IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, 368-372, Cambridge, MA.
    Campbell, P., Norman, M., 1998, Microstocking and Fab Throughput, Proceedings of the AutoSimulations ’98 Symposium, 101-106, Bountiful, UT.
    Campbell, P.L., MacNair, E.A., 1999, A Model of A 300 mm Wafer Fabrication Line, Proceedings of the 1999 Winter Simulation Conference, Phoenix, Arizona.
    Campbell, E., Wright, R., Cheatham, J., Schulz, M. and Berry, J.L., 2000, Simulation modeling for 300mm semiconductor factories, Solid State Technology, 95-106.
    Chase, M., Scott, D. and Nestel-Patt, J., 2000, The challenges of macro integration for fully automated 300mm fabs, Solid State Technology, 52-64.
    Chang, I.H., Perng, D.B., Chen, J.R. and Chung, S.H., 2001, Object- Oriented Simulation Platform Construction for IC Fabs Modeling by Using SiMPLE++, ASTC2001 SMOMS, Seattle, Washington, USA.
    Chang, I.H. and Tyan, J.C., 2001, Development of a Vitural Fab Simulation Platform for 300mm fully automated wafer fabrication, CIIE2001, 0058.
    Glassey, C. R. and Resende, M. G. C., 1988, Closed-loop job release control for VLSI circuit manufacturing, IEEE Transactions on Semiconductor Manufacturing, 1, 36-46.
    Hsieh, B.W., Chang, S.C. and Chen, C.H., 2001, Dynamic Scheduling Rule Selection for Semiconductor Wafer Fabrication, Proceedings of 2001 IEEE International Conference on Robotics and Automation, Seoul, Korea.
    International SEMATECH, 2004, [Online] Available: http://www.sematech.org/corporate/ index.htm.
    Kelton, W.D., Sadowski, R.P. and Sadowski, D.A., 2002, Simulation with ARENA, McGraw-Hill.
    Kim, H., J. Park, S. Sohn, Y. Wang, S. Reveliotis, C. Zhou, D. Bodner and L. McGinnis., 2001, A High-Fidelity Web-Based Simulator for 300mm Wafer Fabs, Proceedings of the 2001 IEEE International Conference on Systems, Man, and Cybernetics, 1288-1293.
    Law, A.M. and Kelton, W.D., 2000, Simulation Modeling and Analysis, 3rd edition, McGRAW ineternational, 518-526.
    Lin, J.T., Wang, F.K. and Wu, C.K., 2003, Simulation Analysis of the Connecting Transport AMHS in a Wafer Fab, IEEE Transactions on Semiconductor Manufacturing, 16, 555-564.
    Lin, J.T., Wang, F.K. and Yen, P.Y., 2001, Simulation analysis of dispatching rules for an automated interbay material handling system in wafer fab, International Journal of Production Research, 39, 1221-1238.
    Lin, J.T., Wang, F.K. and Yen, P.Y., 2004, The maximum loading and the optimum number of vehicles in a double-loop of an interbay material handling system, Production Planning & Control, 15, 247-255.
    Norman, M., Tinsley, D., Barksdale, J., Wiersholm, O., Campbell, P. and MacNair, E., 1999, Process and material handling models integration, Proceedings of the 1999 Winter Simulation Conference, 1262-1267.
    Norman, M., Barksdale, J., Wiersholm, 1999, Integrated Manufacturing and Material Handling Simulation Modeling, Proceedings of the SIMULATION Solutions’99 Conference, Mesa, AZ.
    Quinn, T., Bass, Edward., 1999, 300 mm Factory Layout and Material Handling Modeling: Phase I Report, International SEMATECH, Technology Transfer # 99023688B-ENG.
    Schulz, M., Stanley, T.D. and Renelt, B., 2000, Simulation based decision support for future 300mm automated material handling, Proceedings of the 2000 Winter Simulation Conference, 1518-11522, Piscataway, NJ.
    Shikalgar, S.T., MacNair, E.A., 2002, 300 mm Wafer Fabrication Line Simulation Model, Proceedings of the 2002 Winter Simulation Conference, 1365-1368, Piscataway, NJ.
    Shikalgar, S.T., MacNair, E.A., 2003, Application of Cluster Tool Modeling to a 300 mm Fab Simulation, Proceedings of the 2003 Winter Simulation Conference, 1394-1397, New Orleans, LA.
    Tyan, J.C., Du, T.C., Chen, J.C. and Chang, I.H., 2004, Multiple response optimization in a fully automated FAB: an integrated tool and vehicle dispatching strategy, Computers & Industrial Engineering, 46, 121–139.
    Wein, L.M., 1988, Scheduling semiconductor wafer fabrication, IEEE Transactions on Semiconductor Manufacturing, 1, 115-130.
    Wang, C.N., Liao, D.Y., 2002, Proiritized Automatic Material Handling Services in 300 mm Foundry Manufacturing, IEEE 2002 Semiconductor Manufacturing Technology Workshop, 109-114.

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