本文以有限元素分析軟體ANSYS15.0來模擬在FC-PBGA中錫球間距及錫球尺寸縮小，在加速溫度循環中無鉛錫球及有鉛錫球熱機械行為與疲勞壽命。
在本模擬中，首先利用ANSYS建立模型，並設定各元件材料參數完成網格化，之後施以溫度循環負載測試，觀察錫球在負載過程中的塑性應變變化(plastic strain range)，並將結果代入Coffin-Manson疲勞壽命預測公式來探討錫球的可靠度。
結果與討論中探討錫球(96.5Sn3.5Ag)的分析結果。首先觀察各個錫球的應力、應變，找出發生最大von Mises應變的關鍵錫球，再分析關鍵錫球於熱負載過程中應力與應變的變化，藉由Coffin-Manson equation，計算出含鉛錫球疲勞壽命，分析結果不同錫球材料，本文以無鉛錫球(96.5Sn3.5Ag)、無鉛錫球(95.5Sn3.8Ag0.7Cu)及有鉛錫球(60Sn40Pb)考慮三種不同型組合體對錫球疲勞壽命的影響，以及不同高分子組件與散熱組件的參數設計對錫球疲勞壽命的影響。本文藉由分析結果得知哪些因素對FC-PBGA錫球疲勞壽命影響顯著。
最後為無鉛錫球在錫球間距及錫球尺寸縮小下的比較，觀察不同無鉛材料的關鍵錫球在整個熱負載過程中的應力、應變，並比較含鉛與無鉛錫球的疲勞壽命。

This master's thesis uses finite element software ANSYS15.0 to analyze the Filp-Chip Plastic Ball Grid Array packaging (FC-PBGA) which minify substrate and solder ball under accelerated thermal cycling loading. We will observe the thermal mechanical behaviors of the solder balls and research the fatigue life.
In this simulation, we use ANSYS to establish the FC-PBGA model, and apply different material parameters in components to finish meshing. After that, we applied thermal Cycling Test (TCT) loads and observed the plastic strain range of the solder ball during TCT loads. Therefore, we used the Coffin-Manson equation to predict the fatigue life and reliability of the solder ball.

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