條紋投影法及條紋反射法為光學量測方法，因此具有非接觸性及非破壞性的優點，可用來建構出物體的外形及當物體受到外在環境變化，如：溫度、外力…等所產生的面外變形，且具有即時性和全場性且架設簡單。

　　本文研究中，主要目的是建構出兩套精密光學量測系統，應用在電子產品的檢測及晶圓表面翹曲量的量測。首先以條紋投影法量測錫球的外型及建構金手指IC的三維形貌，接著以條紋反射法量測表晶圓表面的斜率變化及表面形貌，本量測系統已測試晶圓表面的三維形貌，其表面高度分佈範圍小於25微米，在本系統的精確度方面，經過高精度表面粗度儀SE-3500驗證比對後最大誤差在2μm以內。

　In this paper, the major purpose is to build two optical measuring systems that are applied in inspecting the electric products and measuring the warpage of wafers. First, we use fringe projection method to measure the surface profile of an Sn ball and a golden fringe IC. Latter, we use fringe reflection method to measure the surface slope variation and surface profile of a wafer. The result shows that the height range is below 25 microns. About the accuracy of this system, by comparing with the surface roughness measuring instrument SE-3500, the error is under 2μm.

　Fringe projection and fringe reflection methods are optical measuring methods, so the advantages are noncontact and nondestructive. By using these methods, we can build the shape of object and measuring out-of-plane deformation when subjected by the change of external environment, for example temperature and external force…etc. These two methods also contain the characteristics of real time, full-field measurement, and setup simply.

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