共軛導電高分子最大的優勢在於其優秀的機械變形能力(Mechanical deformability)，讓這些可拉伸的材料在軟性電子學及穿戴型裝置等領域有著廣泛的應用潛力。然而，也因為高分子可撓的特性，造成其薄膜形貌及高分子鏈排列有序性難以控制，導致元件內載子傳輸效率低，且難以評估元件之機械強度。為提升軟性電子元件的效能及耐用度，需系統性控制薄膜有序性的高低，找出元件電性表現及機械強度的平衡點，以實現高機械變形及電子效能共存的優異可撓式元件。
前人研究已知高分子鏈有序排列與基板間的作用力高度相關37-39，即高分子側鏈與修飾的自組裝單分子層必須匹配，因此在本研究中，透過半定量方法調控基板上自組裝單分子層表面能，調整高分子與自組裝分子間作用力的匹配程度，達到控制微觀尺度下高分子鏈的排列有序性高低，並使用原子力顯微鏡中之峰力定量機械特性模式，分析不同高分子薄膜排列有序性的楊氏模數響應，得出薄膜內部晶粒排列隨有序性提高、晶粒內部高分子鏈排列更加緊密下，楊氏模數會升高，與模型預測相符。
本實驗成功以半定量法控制單分子層表面能，達到調控高分子之排列有序性高低，並以彈簧原理釐清高分子排列有序性及其薄膜微觀結構之楊氏模數間的關係，為研究者提供設計有機軟性電子元件的重要資訊，以實現高可撓性及高效能並存的實用元件。

Conductive polymers' standout advantage is their remarkable deformability, which plays a crucial role for flexible electronics. However, the polymer chain’s flexibility also hampers the processed films to form ordered morphology with high electronic performance, leading to tremendous challenges from low mobility and unreliable mechanical strength. To enhance a flexible electronic device's lifetime and performance, balancing electronic performance and mechanical strength is a vital step. Employing a semi-quantitative method to match the interactions between polymer chains and self-assembled monolayer (SAM), this study successfully manipulates the surface energy to adjust polymer chain alignment. Using atomic force microscopy to analyzes Young's modulus response, the observations revealing that ordering level significantly impact modulus values. Systematic manipulation on surface energy achieves a controllable polymer chain alignment and mechanical responses, shedding light on controlling polymer chain ordering and Young's modulus. These findings provide profound insights for designing flexible electronic devices with enhanced performance.

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