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研究生：	吳方堯 Wu, Fang-Yao
論文名稱：	Al-Ga-Ni三元合金的相平衡及機械性質研究 Phase equilibria and mechanical properties of Al-Ga-Ni ternary alloys
指導教授：	林士剛 Lin, Shih-Kang
學位類別：	碩士 Master
系所名稱：	工學院 - 材料科學及工程學系 Department of Materials Science and Engineering
論文出版年：	2021
畢業學年度：	109
語文別：	英文
論文頁數：	116
中文關鍵詞：	Al-Ga-Ni 三元系統、相圖計算軟體、相平衡研究、材料基礎學理分析
外文關鍵詞：	Al-Ga-Ni ternary system, Phase diagram calculation software, Phase equilibrium experiment, Fundamental research
相關次數：	點閱：57 下載：0
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摘要	ii
Abstract	iii
誌謝	v
Table of Contents	vii
Table of figure	ix
Table of table	xvii
Chapter 1	Introduction	1
Chapter 2	Paper review	3
2.1 Al-Ga-Ni ternary system	3
2.1.1 Phase equilibrium theory	3
2.1.2 Al-Ga binary system	5
2.1.3 Al-Ni binary system	7
2.1.4 Ga-Ni binary system	9
2.1.5 Al-Ga-Ni ternary system	12
2.2 Al-Ga-Ni ternary alloys	14
2.2.1 Al-Ni alloys	14
2.2.2 Al-Ga-Ni alloys	16
2.3 High power devices	19
2.4 Cu-Ni-Ga solid-solution	23
2.4.1 Transient liquid phase (TLP) bonding technique	23
2.4.2 Solid-solution type TLP bonding technique	25
Chapter 3	Method	31
3.1 Calphad	31
3.2 Materials	33
3.3 Characterizations	36
3.4 Annealing Temperature	37
3.5 Mechanical properties	38
Chapter 4	Results and discussion	39
4.1	Model construction with some estimated parameter	41
4.2	The phase equilibrium of Al-Ga-Ni ternary system at 1000oC	43
4.3	The phase equilibrium of Al-Ga-Ni ternary system at 900 oC	48
4.4	The phase equilibrium of Al-Ga-Ni ternary system at 600 oC	64
4.5	Mechanical properties of Al-Ga-Ni ternary alloys	78
Chapter 5	Conclusion	89
Chapter 6	Outlook	92
Reference:	93
Appendix	97
                                    

Reference:
[1] J. L. Murray, "The Al−Ga (Aluminum-Gallium) system," Bulletin of Alloy Phase Diagrams, vol. 4, no. 2, pp. 183-190, 1983/09/01 1983.
[2] A. Watson, "Re-assessment of phase diagram and thermodynamic properties of the Al-Ga system," Calphad, vol. 16, no. 2, pp. 207-217, 1992/04/01/ 1992.
[3] H. Okamoto, "Al-Ni (aluminum-nickel)," Journal of Phase Equilibria and Diffusion, vol. 25, no. 4, pp. 394-394, 2004/10/01 2004.
[4] I. Ansara, N. Dupin, H. L. Lukas, and B. Sundman, "Thermodynamic assessment of the AlNi system," Journal of Alloys and Compounds, vol. 247, no. 1, pp. 20-30, 1997/01/30/ 1997.
[5] R. Ducher, R. Kainuma, and K. Ishida, "Phase equilibria in the Ni-rich portion of the Ni–Ga binary system," Intermetallics, vol. 15, no. 2, pp. 148-153, 2007/02/01/ 2007.
[6] C. Schmetterer, H. Flandorfer, C. L. Lengauer, J.-P. Bros, and H. Ipser, "The system Ga–Ni: A new investigation of the Ga-rich part," Intermetallics, vol. 18, no. 2, pp. 277-285, 2010/02/01/ 2010.
[7] J. Gröbner, R. Wenzel, G. G. Fischer, and R. Schmid-Fetzer, "Thermodynamic calculation of the binary systems M-Ga and investigation of ternary M-Ga-N phase equilibria (M=Ni, Co, Pd, Cr)," Journal of Phase Equilibria, vol. 20, no. 6, p. 615, 1999/11/01 1999.
[8] Z.-M. Cao, X. Shi, W. Xie, I. Ohnuma, K. Ishida, and Z.-Y. Qiao, "Thermodynamic reassessment of Ni–Ga binary system," Rare Metals, vol. 34, no. 12, pp. 864-872, 2015/12/01 2015.
[9] N. Belyavina, V. Markiv, O. Nakonechna, and F. Lozovyi, "Phase equilibria in the Ni–Al–Ga system at 700°C," Journal of Alloys and Compounds, vol. 593, pp. 41-49, 2014/04/25/ 2014.
[10] B. A. Hull, S. E. Mohney, and Z. K. Liu, "Thermodynamic modeling of the Ni–Al–Ga–N system," Journal of Materials Research, vol. 19, no. 6, pp. 1742-1751, 2004.
[11] D. F. L. Ramgopal Darolia, "Ductility microalloyed NiAl intermetallic compounds," 1992.
[12] X. Zhang, Q. Wang, X. Zhao, F. Wang, and Q. Liu, "Study of Cu–Al–Ni–Ga as high-temperature shape memory alloys," Applied Physics A, vol. 124, no. 3, p. 242, 2018/02/14 2018.
[13] S.-k. Lin, C.-y. Yeh, and M.-j. Wang, "On the formation mechanism of solid-solution Cu-to-Cu joints in the Cu/Ni/Ga/Ni/Cu system," Materials Characterization, vol. 137, pp. 14-23, 2018/03/01/ 2018.
[14] S. K. Lin, M. J. Wang, C. Y. Yeh, H. M. Chang, and Y. C. Liu, "High-strength and thermal stable Cu-to-Cu joint fabricated with transient molten Ga and Ni under-bump-metallurgy," Journal of Alloys and Compounds, Article vol. 702, pp. 561-567, 2017.
[15] Y. A. Chang et al., "Phase diagram calculation: past, present and future," Progress in Materials Science, vol. 49, no. 3, pp. 313-345, 2004/01/01/ 2004.
[16] eutectic system [Online]. Available: https://zh.wikipedia.org/wiki/%E5%85%B1%E6%99%B6%E7%B3%BB%E7%B5%B1.
[17] Y.-w. Yen, J.-w. Su, and D.-p. Huang, "Phase equilibria of the Fe–Cr–Ni ternary systems and interfacial reactions in Fe–Cr alloys with Ni substrate," Journal of Alloys and Compounds, vol. 457, no. 1, pp. 270-278, 2008/06/12/ 2008.
[18] W. Huang and Y. A. Chang, "A thermodynamic analysis of the NiAl system," Intermetallics, vol. 6, no. 6, pp. 487-498, 1998/01/01/ 1998.
[19] W. Huang and Y. Chang, "A thermodynamic analysis of the Ni-Al system (vol 6, pg 487, 1998)," Intermetallics, vol. 7, no. 5, pp. 625-626, 1999.
[20] V. Panov, V. Shugaev, and M. Goldberg, "The possibility of utilization of Ni3Al as the binding material for hard alloys," Russian Journal of Non-Ferrous Metals, vol. 50, pp. 317-320, 06/01 2009.
[21] G. K. Dey, "Physical metallurgy of nickel aluminides," Sadhana, vol. 28, no. 1, pp. 247-262, 2003/02/01 2003.
[22] N. S. Stoloff, C. T. Liu, and S. C. Deevi, "Emerging applications of intermetallics," Intermetallics, vol. 8, no. 9, pp. 1313-1320, 2000/09/01/ 2000.
[23] V. K. Sikka, S. C. Deevi, S. Viswanathan, R. W. Swindeman, and M. L. Santella, "Advances in processing of Ni3Al-based intermetallics and applications," Intermetallics, vol. 8, no. 9, pp. 1329-1337, 2000/09/01/ 2000.
[24] R. Darolia, "NiAl alloys for high-temperature structural applications," JOM, vol. 43, no. 3, pp. 44-49, 1991/03/01 1991.
[25] J. L. Hudgins, G. S. Simin, E. Santi, and M. A. Khan, "An assessment of wide bandgap semiconductors for power devices," IEEE Transactions on Power Electronics, vol. 18, no. 3, pp. 907-914, 2003.
[26] V. R. Manikam and K. Y. Cheong, "Die Attach Materials for High Temperature Applications: A Review," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 4, pp. 457-478, 2011.
[27] M. R. Werner and W. R. Fahrner, "Review on materials, microsensors, systems and devices for high-temperature and harsh-environment applications," IEEE Transactions on Industrial Electronics, vol. 48, no. 2, pp. 249-257, 2001.
[28] (2017). The power electronics industry is showing steady growth and high dynamism [Online]. Available: http://www.yole.fr/STATUS_POWER_ELECTRONICS_INDUSTRY.aspx#.Wrnee.
[29] H. Kang, A. Sharma, and J. P. Jung, "Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics," Metals, vol. 10, no. 7, p. 934, 2020.
[30] "Development of DBA (Direct Bonded Aluminum) Substrate with Thick Cu for Highly-Functional Insulated Circuit Substrates Used in Next-Generation Power Modules," 2013.
[31] N. Terasaki, Y. Nagatomo, T. Nagase, and Y. Kuromitsu, "New power-module structures consisting of both Cu and Al bonded to AlN substrates with an Al base plate," in CIPS 2014; 8th International Conference on Integrated Power Electronics Systems, 2014, pp. 1-5.
[32] R. J. Fields. (1991). PHYSICAL AND MECHANICAL PROPERTIES OF INTERMETALLIC COMPOUNDS COMMONLY FOUND IN SOLDER JOINTS [Online]. Available: https://www.metallurgy.nist.gov/mechanical_properties/solder_paper.html.
[33] C. C. Lee, P. J. Wang, and J. S. Kim, "Are Intermetallics in Solder Joints Really Brittle?," in 2007 Proceedings 57th Electronic Components and Technology Conference, 2007, pp. 648-652.
[34] G. O. Cook and C. D. Sorensen, "Overview of transient liquid phase and partial transient liquid phase bonding," Journal of Materials Science, vol. 46, no. 16, pp. 5305-5323, 2011/08/01 2011.
[35] L. Bernstein, "Semiconductor Joining by the Solid-Liquid-Interdiffusion (SLID) Process," Journal of The Electrochemical Society, vol. 113, no. 12, p. 1282, 1966.
[36] J. F. Li, P. A. Agyakwa, and C. M. Johnson, "Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process," Acta Materialia, vol. 58, no. 9, pp. 3429-3443, 2010/05/01/ 2010.
[37] J. F. Li, P. A. Agyakwa, and C. M. Johnson, "Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process," Acta Materialia, vol. 59, no. 3, pp. 1198-1211, 2011/02/01/ 2011.
[38] T. L. Yang et al., "Full intermetallic joints for chip stacking by using thermal gradient bonding," Acta Materialia, vol. 113, pp. 90-97, 07/01 2016.
[39] W. Zhang and W. Ruythooren, "Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking," Journal of Electronic Materials, vol. 37, no. 8, pp. 1095-1101, 2008/08/01 2008.
[40] H. Baker, "Alloy phase diagrams," ASM handbook, vol. 3, pp. 2-80, 1992.
[41] S.-k. Lin, C.-l. Cho, and H.-m. Chang, "Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples," Journal of Electronic Materials, vol. 43, no. 1, pp. 204-211, 2014/01/01 2014.
[42] 卓政樑, "銅/鎵界面反應及其在三維度積體電路的應用," 成功大學材料科學及工程學系學位論文, 2013.
[43] S.-k. Lin, H.-m. Chang, C.-l. Cho, Y.-c. Liu, and Y.-k. Kuo, "Formation of Solid-Solution Cu-to-Cu Joints Using Ga Solder and Pt under Bump Metallurgy for Three-Dimensional Integrated Circuits," Electronic Materials Letters, vol. 11, pp. 687-694, 07/25 2015.
[44] Z.-K. Liu, "First-principles calculations and CALPHAD modeling of thermodynamics," Journal of phase equilibria and diffusion, vol. 30, no. 5, pp. 517-534, 2009.
[45] W. Cao et al., "PANDAT software with PanEngine, PanOptimizer and PanPrecipitation for multi-component phase diagram calculation and materials property simulation," Calphad, vol. 33, no. 2, pp. 328-342, 2009/06/01/ 2009.
[46] P. Nash, "Phase diagrams of binary nickel alloys," ASM International(USA), 1991, p. 394, 1991.
[47] C. WANG, J. XU, X. HU, D. CHEN, H. SUN, and B. YU, "ELASTIC AND THERMODYNAMIC PROPERTIES OF NiAl AND Ni3Al FROM FIRST-PRINCIPLES CALCULATIONS," International Journal of Modern Physics B, vol. 25, no. 27, pp. 3623-3631, 2011.
[48] R. Seymour et al., "Nanoindentation of NiAl and Ni3Al crystals on (100), (110), and (111) surfaces: A molecular dynamics study," Applied Physics Letters, vol. 104, no. 14, p. 141904, 2014.

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