| 研究生: |
謝育杰 Hsieh, Yu-Jie |
|---|---|
| 論文名稱: |
具潛熱冷却頂板毫米矩形流道熱沉內氧化鋁-水奈米流體熱散逸性能實驗研究 Experimental study on heat dissipation performance of alumina-water nanofluid flow in a mini-channel heat sink with a latently-cooled ceiling |
| 指導教授: |
何清政
Ho, Ching-Jenq |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 機械工程學系 Department of Mechanical Engineering |
| 論文出版年: | 2017 |
| 畢業學年度: | 105 |
| 語文別: | 中文 |
| 論文頁數: | 101 |
| 中文關鍵詞: | 奈米流體 、平行毫米流道熱沉 、具潛熱冷卻頂板 、等溫加熱條件 |
| 外文關鍵詞: | Nanofluid, Mini-channel heat sink, Microencapsulated phase change material(MEPCM), isothermal condition, cooling ceiling |
| 相關次數: | 點閱:147 下載:2 |
| 分享至: |
| 查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
本研究探討具潛熱冷卻頂板平行毫米流道熱沉內氧化鋁-水奈米流體於穩態等溫加熱條件下之熱散逸性能。單一流道截面積尺寸為寬1mm、高3mm。本研究相關參數範圍:純水與氧化鋁-水奈米流體重量百分濃度分別為5%、10%;體積流量 為 、 、 ,以純水物性為基礎,換算成基底流體雷諾數為161至968之間;等溫加熱條件是依流道底部壁溫來設定,溫度分別50 與55 ;流體入口溫度設定為40 與45 ;相變化微膠囊層使用二十二烷相變化微膠囊,熔點為43 ,相變化微膠囊層須配合等溫冷却頂板將熱能帶走,等溫冷却頂板在本研究設定為25 、30 以及35 。由本實驗結果顯示加熱片所提供之熱能,80%由平行毫米流道熱沉帶走,而潛熱冷却頂板只帶走5%。說明潛熱冷却頂板效果不佳。添加氧化鋁奈米流體之工作流體,有提升平均熱傳增益,但也因壓降增加,造成此研究之效能指標皆小於一。高溫流體入口溫度能使相變化微膠囊層吸收較多之潛熱,但須配合低溫之等溫冷却底板,避免膠囊層溫度超過熔點。
SUMMARY
The study was to research an experimental study that is heat dissipation characteristics of Al2O3-water nanofluid flow in a mini-channel heat sink under isothermal condition and with microencapsulated phase change material(MEPCM) layer. The multi-channel heat sinks of a length of 50 mm and a width of 25.1 mm were fabricated of oxygen-free copper with eight parallel mini-channels, each with an inlet cross-section of 1 mm in width and 3 mm in height. The MEPCM uses n-docosane as a core material and urea-formaldehyde as a shell material. The melting temperature of MEPCM is 43℃, so we need Cooling ceiling to take away heat and prevent MEPCM melting. The pertinent experimental conditions considered are in the following ranges: the volumetric flow rate of working fluid through the heat sink, Q ̇= 100, 300, 600 cm3/min; the mass fraction of Al2O3-water nanofluid, ωnp = 5%, 10%; the isothermal condition of channel wall average temperature, (T_w ) ̅ =50℃, 55℃; the inlet temperature of working fluid, Tin =40℃, 45℃; and the isothermal condition of cooling ceiling average temperature, T ̅_cw =25℃, 30℃, 35℃.
The study was to research an experimental study that is heat dissipation characteristics of Al2O3-water nanofluid flow in a mini-channel heat sink under isothermal condition and with microencapsulated phase change material(MEPCM) layer. The multi-channel heat sinks of a length of 50 mm and a width of 25.1 mm were fabricated of oxygen-free copper with eight parallel mini-channels, each with an inlet cross-section of 1 mm in width and 3 mm in height. The MEPCM uses n-docosane as a core material and urea-formaldehyde as a shell material. The melting temperature of MEPCM is 43℃, so we need Cooling ceiling to take away heat and prevent MEPCM melting. The pertinent experimental conditions considered are in the following ranges: the volumetric flow rate of working fluid through the heat sink, Q ̇= 100, 300, 600 cm3/min; the mass fraction of Al2O3-water nanofluid, ωnp = 5%, 10%; the isothermal condition of average temperature of channel wall, (T_w ) ̅ =50℃, 55℃; the inlet temperature of working fluid, Tin =40℃, 45℃; and the isothermal condition of average temperature of cooling ceiling, T ̅_cw =25℃, 30℃, 35℃.
The experimental results obtained reveal that using Al2O3-water nanofluid can get better heat transfer coefficient than pure water. The pressure drop of nanofluid is larger than pure water. As concentration increases, pressure drop increases. The heat sinks take away 80% heat energy from heater, on the other hand, the MEPCM layer take away 5% heat. That shows MEPCM layer effective is very lower, but raise working fluid inlet temperature can improve MEPCM layer effective.
[1] D. B. TUCKERMAN, and R. F. W. PEASE, “High-Performance Heat Sinking for VLSI,” Electron Device Letters, IEEl, vol. 2, no. 5, pp. 126-129, 1981.
[2] W. Qu, and I. Mudawar, “Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink, ” International Journal of Heat and Mass Transfer,” vol. 45, no. 12, pp. 2549-2565, 2002.
[3] P.S. Lee, S.V. Garimella, and D. Liu, “Investigation of heat transfer in rectangular microchannels, ” International Journal of Heat and Mass Transfer, vol. 48, no. 9, pp. 1688-1704, 2004
[4] H. Garg, V.S. Negi1, Nidhi, A.K. Lall, “Numerical tudy of microscale heat sinks using different shapes & fluids,” the 2013 COMSOL Conference in Bangalore, 2013
[5] X.F.Peng, G.P.Peterson, “ Convective heat transfer and flow friction for
water flow in microchannel structures,” International Journal of Heat and Mass Transfer, vol. 39, no. 12, pp. 2599-2608, 1996
[6] Y. Xuan, and Q. Li, “Heat transfer enhancement of nanofluids,” International journal of heat and fluid flow, vol. 21, no. 1, pp. 58-64, 2000
[7] J. Lee, and I, Mudawar, “Assessment of the effectiveness of nanofluids for single-phase and two-phase heat transfer in micro-channels,” International journal of heat and mass transfer, vol. 50, no. 3-4, pp. 452-463, 2007
[8] R.Y. Chein, and G.M. Huang, “Analysis of microchannel heat sink performance
using nanofluids,” Applied thermal engineering, vol. 25, no. 17-18, pp. 3104-3114, 2005
[9] J.Y. Jung, H.S. Oh, and H.Y. Kwak, “Forced convective heat transfer of nanofluids in microchannels,” International journal of heat and mass transfer, vol. 52, no. 1-2, pp. 466-472, 2009
[10] C.J. Ho, L.C. Wei, and Z.W. Li, “An experimental investigation of forced convective cooling performance of a microchannel heat sink with Al2O3/water nanofluid,” Applied thermal engineering, vol. 30, no. 2-3, pp. 96-103, 2010
[11] M.R. Sohel, S.S. Khaleduzzaman, R. Saidur, A. Hepbasli, M.F.M. Sabri, and , I. M. Mahbubul, “An experimental investigation of heat transfer enhancement of a minichannel heat sink usingAl2O3-H2O nanofluid,” International journal of heat and mass transfer, vol. 74, pp. 164-172, 2014
[12] A.M. Khudhair, and M.M. Farid, “A review on energy conservation in building applications with thermal storage by latent heat using phase change materials,” Energy conversion and management, vol. 45, no. 2, pp. 263-275, 2004
[13] I. Ceron, J. Neila, and M. Khayet, “Experimental tile with phase change materials (PCM) for building use,” Energy and buildings, vol. 43, no. 8, pp. 1869-1874, 2011
[14] G. Setoh, F.L. Tan, and S.C. Fok “Experimental studies on the use of a phase change material for cooling mobile phones,” International communications in heat and mass transfer, vol. 37, no. 9, pp. 1403-1410, 2010
[15] P.B. Salunkhe, and P.S. Shembekar “A review on effect of phase change material encapsulation on the thermal performance of a system,” Renewable & sustainable energy reviews, vol. 16, no. 8, pp. 5603-5616, 2012
[16] O. Su, and J. Darkwa “Thermal simulation of composite high conductivity laminated microencapsulated phase change material (MEPCM) board,” Applied energy, vol. 95, pp. 246-252, 2012
[17] 邱育慧, “毫米矩形流道內氧化鋁-水奈米流體於穩態/突然脈衝熱載下共軛冷卻特性之數值模擬,” 成功大學機械工程學系學位論文, pp. 1-160, 2016
[18] 廖健欽, “具潛熱冷卻頂板毫米流道熱沉內氧化鋁-水奈米流體於穩態/突然脈衝熱載下熱散逸性能之實驗研究,” 成功大學機械工程學系學位論文, pp. 1-89, 2016
[19] S. G. Kandlikar “Single-phase liquid flow in minichannels and microchannels,”
Heat transfer and fluid flow in minichannels and microchannels, pp. 87-136, 2006.
[20] 劉彥均, “奈米相變化膠囊懸浮液於具平行/漸擴毫米流道熱沉內強制對流熱傳遞特性之比較研究,” 成功大學機械工程學系學位論文, pp. 1-109, 2013
[21] Y. Rao, F. Dammel, P. Stephan, and G. Lin, “Convective heat transfer
characteristics of microencapsulated phase change material suspensions in
minichannels,” Heat and Mass Transfer, vol. 44, no. 2, pp. 175-186, 2007.
[22] C.J. Ho, W.C. Chen, and W.M. Yan, “Experimental study on cooling performance
of minichannel heat sink using water-based MEPCM particles,” International
Communications in Heat and Mass Transfer, vol. 48, pp. 67-72, 2013.