本研究利用熱還原法製備低溫噴墨製程用的銅銀二元墨水，藉由銅的前驅鹽Copper(Ⅱ) formate tetrahydrate和錯合劑 n-octylamine去製備出銅墨水，以及利用銀的前驅鹽Silver nitrate和DP (1-dimethylamino-2-propanol)在最佳化的混合溶劑中(乙醇和乙二醇)去製備出銀墨水，接著再將兩種墨水混合在一起去製備出不同比例的銅銀墨水，並以XRD確認在不同熱處理溫度下的轉換效果，以及以SEM去確認薄膜表面燒結的情況。將製備好的銅銀墨水滴在玻璃基板上，在氮氣保護下以160℃進行熱處理1小時，所得最適合的銅銀比例之銅銀薄膜電阻率為3.4×10-4 Ω cm。

Low-temperature cured Copper-Silver binary Inks were prepared from thermal reduction reaction for ink-jet printing. Copper inks were synthesized by thermal decomposition of a copper precursor (Copper(Ⅱ) formate tetrahydrate) and a complexing agent (n-octylamine). Silver inks were synthesized by a silver precursor (silver nitrate) and DP(1-dimethylamino-2-propanol) in an optimal ratio of a mixed solvent(ethanol and ethylene glycol). The two kinds of inks were mixed in different ratio to prepare a binary inks. The conversions of the precursors to the copper and silver were confirmed by XRD. The situation of sintering was observed by SEM. A copper–silver film(copper precursor : silver precursor ＝1:0.1) was fabricated onto a glass substrate by calcination in nitrogen atmosphere at 160℃ for one hour. The resistivity of the film was 3.4×10-4 Ω cm.

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