本論文研究主要探討使用本實驗室自行合成之氮化鋁(AlN)與六方晶氮化硼(h-BN)粉體為填充料(filler)，以提升環氧樹脂(epoxy)之熱傳導值，期望有助於高導熱封裝材料(環氧成型模料，Epoxy molding compound, EMC)之開發。在AlN/epoxy複合材料的研究顯示：表面改質確實可以改善AlN與高分子之親和性進而提升熱傳導(5.6-33.3%)，而在各因素對AlN/epoxy複合材料熱傳導值之影響中發現；以AlN粉體添加量對AlN/epoxy複合材料之熱傳導值影響最為顯著(1567%)，而其他因素(AlN粒徑大小、氧含量、有無經表面改質)之影響也會隨著粉體添加量提升而有越顯著現象，其中又以AlN粉體粒徑為另一影響AlN/epoxy複合材料熱傳導值重要因素，當AlN粉體添加量在60 vol%下，粉體顆粒大小影響為106%，而氧含量及有無經表面改質則僅約35%。在h-BN/epoxy複合材料的研究顯示：表面改質亦可改善h-BN與高分子之親和性並提升熱傳導值(7.7-35.4%)；使用越大粒徑之h-BN粉體所製備出的h-BN/epoxy複合材料熱傳導值越高，但其複合材料之熱傳導值會隨著體積添加量提升至某一最大值然後開始下降(因在較高粉體體積添加量下h-BN/epoxy複合材料有較高之孔隙度且h-BN在複合材料呈較水平方向排列)。再比較相似粒徑之AlN及h-BN粉體製備成epoxy複合材料之熱傳導值結果則顯示：在較低粉體添加量下使用h-BN粉體所製備出的h-BN/epoxy複合材料有較高之熱傳導值，高粉體添加量下則以AlN粉體所製備出的AlN/epoxy複合材料有較高之熱傳導值。而使用本實驗室自行生產AlN或h-BN粉體所製備之epoxy複合材料熱傳導值約比市面上慣用之SiO2高235-435%，此外不同顆粒大小AlN或AlN與h-BN相互摻混可進而提升複合材料之熱傳導值約25-60%。

The thermal conductivity of epoxy resin composites filled with combustion synthesized aluminum nitride (AlN) particles and hexagonal boron nitride (h-BN) powders were fabricated and their thermal conductivities were compared.
Surface treatment of the combustion synthesized AlN powders was found to increase the thermal conductivity of the epoxy (CNE) resin composites by 5.6-33.3%. Within the ranges of the factors investigated in this study, it was found that the filler content has the greatest effect on the thermal conductivity of the composites: The maximum increase of the thermal conductivity can reach 1567% due to increase of the filler content from 10 to 60 vol%. The effects of the other three factors (particle size, oxygen content and with or without surface treatment) on the thermal conductivity of the composites increase roughly with increasing filler content. Among the three factors, particle size has the greatest effect on the thermal conductivity of the composites. At a filler content of 60 vol%, the maximum percentage increase of thermal conductivity reaches 106% due to particle size but only 30-35% due to oxygen content or surface treatment. The surface treatment of the h-BN particles was found to increase the thermal conductivity of the composites by 7.7–35.4%. The thermal conductivity of the composites was found to be higher when larger h-BN particles were used. The thermal conductivity was found to increase with increasing filler content to a maximum and then begin to decrease with further increases in this content. In addition to the effect of higher void at higher filler contents, more horizontally oriented h-BN particles formed at higher filler loadings (perhaps due to pressing during formation of the composites) were suggested to be a factor causing this decrease of the thermal conductivity. When comparing composites filled with similar size of AlN and h-BN particles, the h-BN-filled composites possess higher thermal conductivities than the AlN-filled composites do in the low filler content regions but the opposite was observed in the high filler content regions. The thermal conductivity of composites filled with combustion synthesized AlN or h-BN powders was found to be higher than that of commercialized SiO2 by 235-435% (i.e., 1.6, 3.8 and 6.92 W/m*K for filling with SiO2, AlN and h-BN, respectively). Besides, composites filled with bimodal particle size distribution of fillers or different types of fillers (AlN and h-BN) with different shapes can further increased the thermal conductivity of the composites by 25-60%.

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