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研究生： 蔡百揚
Tsai, Pai-Yang
論文名稱： 利用類鑽碳薄膜改善發光二極體及封裝散熱之研究
Improvement of Thermal Management in GaN-based Light Emitting Diode Device and Package with Diamond-like Carbon Heat Spreading Layer
指導教授： 王永和
Wang, Yeong-Her
學位類別： 博士
Doctor
系所名稱： 電機資訊學院 - 微電子工程研究所
Institute of Microelectronics
論文出版年： 2015
畢業學年度： 104
語文別： 英文
論文頁數： 103
中文關鍵詞： 鋁基板 、類鑽碳 、氮化鎵 、發光二極體 、遠程螢光粉
外文關鍵詞： Al-metal core PCB, diamond-like carbon, GaN, light emitting diode(LED), remote phosphor
相關次數： 點閱：105  下載：7 
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    • 論文中利用類鑽碳薄膜的高導熱率與高熱擴散率改善發光二極體元件磊晶內部熱聚集的現象。因為熱聚集會造成發光二極體元件界面溫度過高且會有自我加熱的效應產生，所以元件的性能與可靠度皆會受到破壞。在發光二極體元件加入類鑽碳熱擴散層之後，在兩倍或三倍的標準電流注入下，元件的介面溫度可降低5℃以上，並且在光通量可增加約5~10％。元件表面熱分布溫差與沒有類鑽碳的元件更為均勻。
    論文中將類鑽碳應用在增加封裝基板的熱擴散為主。一般的鋁基板中間絕緣材料通常為導熱係數約8W/m．k，造成發光二極體產生的熱集中在元件固晶的位置，鋁基板的面積並無有效的被利用。而類鑽碳的高熱擴散率可以改善一般鋁基板的問題，同時也可以作為銅線路與鋁基板之間的絕緣層。在光通量熱衰減的實驗中，使用類鑽碳鋁基板作發光二極體之封裝可增加約7％。封裝體的介面溫度可降低10℃以上，發光二極體在經過1000小時的測試，元件的光通量可改善約3％。
    除了元件與封裝基材的散熱能力之外，螢光粉的熱效應也是封裝散熱的要素之一。論文中利用遠程螢光粉的形式避免螢光粉與發光二極體元件直接接觸造成互相加熱的效應。在高電流的注入下，遠程螢光粉光通量沒有飽和或下垂的現象。與螢光粉直接塗佈在發光二極體的形式比較，色溫偏移的現象較不明顯。而可以利用遠程螢光粉不同的形狀設計達到廣角或特殊光型的應用。
    在論文中提出利用類鑽碳材料改善發光二極體元件與封裝基材的散熱方式加上遠程螢光粉的應用可以設計出一個高效率及高可靠度的發光光源。

    In this dissertation, the high thermal conductivity and thermal diffusivity of diamond-like carbon (DLC) could reduce the heat crowding phenomenon in the epitaxy layer of light-emitting diodes (LEDs). The performance and reliability of LED devices were damaged or decreased owing to the heat crowding phenomenon, leading to high junction temperature and self-heating effect in the LEDs. At two or three times injection current, the junction temperature of LEDs with DLC heat-spreading layer was decreased more than 5 °C. The relative light intensity was increased by approximately 5% to 10%. The surface temperature distribution of LED with DLC heat-spreading layer was more uniform than that of LED without DLC heat-spreading layer.
    The thermal diffusivity of Al metal-core printed circuit board (PCB) was increased by using DLC as heat-spreading and insulating layer. Metal core PCB substrate limits thermal dissipation because of the low thermal conductivity of the insulating layer between the Cu circuit and Al substrate. Therefore, heat was crowded under the LED device area and not spread all over the Al substrate area. The DLC heat-spreading layer improved the low thermal conductivity with regular metal core PCB. For the measurement of light intensity droop at the thermal equilibrium, the light intensity of metal core PCB with DLC heat-spreading layer was improved by approximately 7%. The junction temperature was decreased by more than 10 °C. The relative light intensity was improved by 3% after turn-on of 1,000 h.
    In addition to the heat dissipation capability of LED device and package material, the thermal effect of phosphor material is important in the LED package. The remote phosphor was directly attached to the metal-core printed circuit board (MCPCB), and then the phosphor layer and blue LED chip were separated by air. Therefore, the heat of the blue LED chip was indirectly conducted to the phosphor layer. At high injection current, the light intensity of remote phosphor type was not saturated and droop phenomenon was observed. For the correlated color temperature shift, the remote phosphor type was lower than the conventional phosphor coating technology. The former type can be designed with different shapes for different light pattern applications.
    This dissertation demonstrated the high efficiency and reliability of white LED light source for the solid-state lighting. This light source is composed of remote phosphor, LEDs, and Al MCPCB with DLC heat-spreading layer.

    Chinese Abstract I English Abstract III List of Tables IX List of Figures X Chapter1 1 Introduction 1 1-1. Solid State Lighting Technology 1 1-2. Heat Management of Chip Level 2 1-3. Heat Management of Package Level 5 1-4. Wide Angle of White Light Chip on Board Package Using Remote Phosphor 6 1-5. The Organization of this Study 7 Chapter2 12 Device Fabrication 12 2-1. Device Structure and Process 12 2-1-1. Lateral LEDs Fabrication 12 2-1-2. Flip-chip LEDs Fabrication 12 2-1-3. Vertical LEDs Fabrication 13 2-1-4. The Fabrication of Vertical and Flip-chip LEDs with Diamond-like Carbon Layer 14 2-2. Heat Transfer Mechanisms of Diamond-like Carbon 25 2-3. The Fabrication of Diamond-like Carbon Heat-spreading Layer 26 2-4. LEDs with DLC heat-spreading layer 27 2-4-1. LEDs Thermal Management with DLC Heat-spreading Layer 27 2-4-2. DLC Heat-spreading Layer as a Current Spreader 30 2-4-3. DLC heat spreading layer can Relieve Internal Film Stress 31 2-5. The Fabrication of COB Package with Diamond-like Carbon Heat-spreading Layer 32 2-6. The Fabrication of White Light COB Package 34 Chapter3 41 The Fabrication of Vertical and Flip-chip Light Emitting Diodes with Diamond-like Carbon Heat-spreading Layer 41 3-1. The Light Output Power, Current and Voltage Characteristics 41 3-1-1. L-I-V Variations of Vertical LEDs with and without DLC Heat-spreading Layer 41 3-1-2. L-I-V Variations of Flip-chip LEDs with and without DLC Heat-spreading Layer 42 3-2. The Variations of Wavelength Shift 43 3-3. Temperature Dependent Characteristics of Flip-chip LEDs with DLC Heat-spreading Layer 48 3-4. The Variations of Junction Temperature 49 3-4-1. The Variations of Junction Temperature to Injection Current 49 3-4-2. The Statistically of Junction Temperature 50 3-5. Surface Thermal Distribution 50 3-6. Summary 52 Chapter4 58 Reducing Heat Crowding of Flip-chip LEDs with Diamond-like Carbon Heat-spreading Layer 58 4-1. The Wetting Area and Surface Temperature Distribution 58 4-2. Light Output Power and Injection Current Characteristics 60 4-3. The Variations of Junction Temperature to Injection Current 61 4-4. Reliability Characteristics 62 4-5. The Statistically of Reliability 63 4-6. Summary 64 Chapter5 70 Chip on Board Package with Diamond like Carbon Heat-spreading Layer 70 5-1. Light Output Power and Injection Current Characteristics 70 5-2. Temperature Dependent Characteristics 72 5-2-1. The Light Intensity Drop Characteristics 72 5-2-2. The Junction Temperature Characteristics 75 5-3. The Reliability of COB Package 77 5-4. The Statistically of COB Package 77 5-5. Summary 79 Chapter6 85 Wide Angle of White Light Chip on Board Package using Remote Phosphor Structure 85 6-1. The Luminous Characteristics 85 6-1-1. The Luminous and Injection Current Characteristics 85 6-1-2. The Luminous Efficiency 86 6-2. Color Temperature and Radiation Pattern Characteristics 87 6-2-1. Color Temperature Shift 87 6-2-2. Angular Color Temperature 88 6-2-3. Radiation Pattern 88 6-3. The Temperature Characteristics 89 6-4. The Reliability Characteristics 90 6-5. Summary 90 Chapter7 96 Conclusions and Future Works 96 7-1. Conclusions 96 7-2. Future Work 98 References 99

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