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研究生：	杜建毅 Du, Chien-Yi
論文名稱：	一級熱電製冷片在考慮湯姆生效應下之實驗與數值分析 Experimental Investigation and Numerical Analysis for One-stage Thermoelectric Cooler under Thomson Effect
指導教授：	溫昌達 Wen, Chang-Da
學位類別：	碩士 Master
系所名稱：	工學院 - 機械工程學系 Department of Mechanical Engineering
論文出版年：	2008
畢業學年度：	96
語文別：	中文
論文頁數：	107
中文關鍵詞：	熱電製冷片、西貝克效應、湯姆生效應、熱電效應
外文關鍵詞：	thermoelectric, Seebeck effect, Thomson effect
相關次數：	點閱：74 下載：1
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本研究透過實驗與數值分析方法，討論一級熱電製冷片在考慮湯姆生效應下，內部溫度分布以及湯姆生熱分布之情況。實驗指定三種熱端溫度323.2K(50℃)、333.2K(60℃)與343.2K(70℃)，在冷端接受5.5W、12.3W 與22.0W 三種熱負載下，結果發現冷熱溫差在高電流、低熱負載或高熱端溫度下較大；性能係數在低電流、高熱負載或低熱端溫度時有較大值。
利用二階LSM 模型(2nd-order LSM)、常數西貝克模型(CSM)以及一階LLS 模型(1st-order LLS)三種模型來描述西貝克係數隨溫度變化的趨勢。其中，二階LSM 西貝克模型與一階LLS 模型分別視湯姆生係數為溫度函式與常數，而常數西貝克模型表示不考慮湯姆生效應之影響。比較實驗與模擬之冷端溫度與性能係數的結果，LSM模擬之誤差最小，此即表示考慮湯姆生熱(Thomson heat)之影響下，其推測冷端溫度之精確度將可以提高。由熱電製冷片的內部湯姆生熱分布顯示，在供應電流增加下，冷端之湯姆生熱會減低生成熱的影響；熱端之湯姆生熱會在大於一臨界電流值後，與焦耳熱一同增加內部的生成熱，造成熱端溫度梯度急劇變化。

This study conducts experimental investigation and numerical analysis for one-stage thermoelectric cooler(TEC) under Thomson effect. Three hot side temperatures and three cold side heat loads are assigned to study the distributions of temperature and Thomson heat inside TEC. Results show that higher current, higher hot side temperature, or lower heat load can increase the temperature difference between the cold and hot sides. Oppositely, lower current, lower hot side temperature, or higher heat load can increase the COP.
Three Seebeck coefficient models, second-order linear Seebeck model(LSM), constant Seebeck model(CSM), and log-linear Seebeck model(LLS) are applied to numerically study the Thomson effect on TEC. Thomson coefficient is a function of temperature for LSM and a constant value for LLS. However, CSM neglects the Thomson effect. Results show that LSM provides the best overall performance. This proves that Thomson effect should be considered in TEC thermal modeling. The distributions of temperature and Thomson heat inside TEC are further analyzed by the aforementioned best model. Results show that with increasing current, Thomson heat decreases the amount of heat generation at the cold side. However, the trend reverses at the hot side after passing a critical current and causes the rapid change in temperature gradient.

摘要......................................... i
Abstract..................................... ii
誌謝......................................... iii
目錄......................................... iv
表目錄....................................... viii
圖目錄....................................... ix
符號說明..................................... xii
第一章 緒論.................................. 1
  1-1 研究背景............................... 1
  1-2 文獻回顧............................... 2
  1-3 研究動機與目的......................... 6
  1-4 本文架構............................... 7
第二章 理論分析.............................. 9
  2-1 不可逆熱力學........................... 9
  2-2 昂薩格倒易關係式....................... 11
    2-2.1 西貝克效應......................... 13
    2-2.2 皮爾特效應......................... 15
    2-2.3 湯姆生效應......................... 17
    2-2.4 熱電效應關係式..................... 19
  2-3 統馭方程式之推導....................... 20
  2-4 一級熱電製冷片之熱分析................. 22
第三章 數值分析.............................. 27
  3-1 西貝克係數之數學模型................... 27
  3-2 基本假設............................... 29
  3-3 數值分析法............................. 29
    3-3.1 二階LSM西貝克係數模型.............. 31
    3-3.2 常數西貝克係數模型................. 35
    3-3.3 一階LLS西貝克係數模型.............. 36
  3-4 程式流程............................... 36
第四章 實驗方法.............................. 39
  4-1 實驗架構............................... 39
    4-1.1 環境控制系統....................... 39
    4-1.2 量測系統........................... 45
    4-1.3 測試模組........................... 47
    4-1.4 加熱元件........................... 49
    4-1.5 散熱元件........................... 49
  4-2 實驗流程............................... 50
  4-3 不準度分析............................. 55
第五章 結果與討論............................ 57
  5-1 西貝克係數之分析....................... 57
  5-2 一級熱電製冷片之實驗結果............... 63
    5-2.1 一級熱電製冷片之冷熱溫差實驗結果... 68
    5-2.2 一級熱電製冷片之性能係數實驗結果... 71
  5-3 數值模擬分析........................... 74
    5-3.1 數值模擬之結果..................... 74
    5-3.2 數值模擬與實驗結果之比較分析....... 74
    5-3.3 一級熱電製冷片之內部溫度分布....... 81
    5-3.4 一級熱電製冷片內部之熱分析......... 83
第六章 結論與未來展望........................ 88
  6-1 結論................................... 88
  6-2 未來展望............................... 90
參考文獻..................................... 93
附錄A  實驗數據.............................. 98
附錄B  英中對照表............................ 102
自述......................................... 107
                                    

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校內：2009-08-20公開
校外：2009-08-20公開

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