在現今科技產業中，消費性電子產品的體積邁向縮小化、輕薄化及多功能性，因此構裝技術對消費性電子產品的可靠度是一個非常關鍵的技術，為了達到產品輕薄短小的表現，用以接合晶片及基板的焊料之選用對於構裝技術是非常重要的一環，其效能受到焊料的潤濕性、接合性質、機械性質、強度等等之因素影響，於是在焊料的合金設計要求須考量上述的性質去選用合適的元素材料配方及製程。
現今常用的焊料合金以錫基焊料為主，並輔以添加其他元素使其增加其強度，如Ni、Sb、Zn等等元素，並建構含錫合金的三元及四元系統用以繪製成相圖，而目前尚未有文獻探討多種元素一同添加於錫基焊料會對其性質有無影響，因此本研究選用Ag、Al、Cu、Ni、Sb、Zn及Sn金屬粉末配製Sn-8Ag-8Al-8Cu-8Ni-8Sb-8Zn，以diffusion multiple方法加上粉末冶金法，製成粉末合金再加以172℃退火4小時淬火，再利用SEM、EDS、EPMA和nano-indenter，量測各元素溶解於錫相的情形及其性質。
我們發現錫相在局部定量分析的結果中，共有448個打點，打點結果落在Sn濃度為96.00 at%以上的打點結果有84個，落在Sn濃度為92.00~96 .00 at%有298個打點結果，而當中Al溶於Sn的溶解度為3.97 at%，Ni溶於Sn的溶解度為3.39 at%，Ag溶於Sn的溶解度為1.95 at%，Sb溶於Sn的溶解度為 5.05 at%，Cu溶於Sn的溶解度為3.39 at%，Zn溶於Sn的溶解度為5.63 at%，打點結果落在Sn濃度為87.00~91.99 at%的打點結果有66個。在奈米壓痕量測及定量分析的結果中，發現錫相經添加多種合金元素後，其楊氏模數及硬度皆會受到影響，當總元素溶解量的濃度變高時，Sn的濃度下降，其楊氏模數大多呈現下降的趨勢，另外溶解於Sn的元素佔比大部分為Al、Zn，再來是Sb、Cu，佔比略低的元素為Ni，最低則為Ag。

Nowadays, consumer electronics is going lighter and multifunctional. In order to achieve the light and short performance of electronics, we need to improve the alloy design requirements of the tin-based solder. It must take bonding performance and its mechanical properties into account. Commonly used solder alloys are mainly tin-based solders by the addition of other elements to increase their strength. In this research, we selected Ag, Al, Cu, Ni, Sb, Zn and Sn metal powders as our material and made a pellet which is Sn-8Ag-8Al-8Cu-8Ni-8Sb-8Zn alloy by powder metallurgy method and diffusion multiple approach. And then annealed it at 172 °C for 4 hours. Finally, apply SEM, EDS, EPMA and nano-indenter for quantitative analysis and indentation test to measure the content of each element in the tin phase. From the result of quantitative analysis, there were total 448 hits. Among the dot results, there were 84 hits with the Sn concentration of 96.00 at% or more, and the hit results were 298 with the Sn concentration of 92.00~96.00 at% , while the content of Al dissolved in Sn is 3.97 at%, the content of Ni is 3.39 at%, and the content of Ag is 1.95 at %, the content of Sb is 5.05 at%, the content of Cu is 3.39 at%, and the content of Zn is 5.63 at%. There were 66 hit results with a Sn concentration of 87.00~91.99 at%. In the results of nanoindentation measurement and quantitative analysis, when the concentration of the total elemental dissolved amount becomes high, Young's modulus of tin phase is mostly decreased. The proportion of elements dissolved in Sn is mostly Al and Zn, and then Sb and Cu. The element with a slightly lower proportion is Ni, and the lowest is Ag.

[1] S. Cheng, C.-M. Huang, and M. Pecht, "A review of lead-free solders for electronics applications," Microelectronics Reliability, vol. 75, pp. 77-95, 2017.
[2] J. Zhao, "Combinatorial approaches as effective tools in the study of phase diagrams and composition–structure–property relationships," Progress in Materials Science, vol. 51, no. 5, pp. 557-631, 2006.
[3] M. Abtew and G. Selvaduray, "Lead-free Solders in Microelectronics," Materials Science and Engineering: R: Reports, vol. 27, no. 5, pp. 95-141, 2000/06/01/ 2000.
[4] R. Agarwal et al., "Cu/Sn microbumps interconnect for 3D TSV chip stacking," in 2010 Proceedings 60th electronic components and technology conference (ECTC), 2010, pp. 858-863: IEEE.
[5] C.-M. Chuang, H.-T. Hung, P.-C. Liu, and K.-L. Lin, "The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates," Journal of electronic materials, vol. 33, no. 1, pp. 7-13, 2004.
[6] N.-S. Liu and K.-L. Lin, "Evolution of interfacial morphology of Sn–8.5 Zn–0.5 Ag–0.1 Al–xGa/Cu system during isothermal aging," Journal of Alloys and Compounds, vol. 456, no. 1-2, pp. 466-473, 2008.
[7] S. K. Das, A. Sharif, Y. C. Chan, N. B. Wong, and W. K. C. Yung, "Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy," Journal of Alloys and Compounds, vol. 481, no. 1, pp. 167-172, 2009/07/29/ 2009.
[8] H. Watanabe, N. Hidaka, I. Shohji, and M. Ito, "Effect of Ni and Ag on interfacial reaction and microstructure of Sn-Ag-Cu-Ni-Ge lead-free solder," MATERIALS SCIENCE AND TECHNOLOGY-ASSOCIATION FOR IRON AND STEEL TECHNOLOGY-, vol. 6, p. 135, 2006.
[9] A. El-Daly, A. El-Taher, and T. Dalloul, "Enhanced ductility and mechanical strength of Ni-doped Sn–3.0 Ag–0.5 Cu lead-free solders," Materials and Design, no. 55, pp. 309-318, 2014.
[10] F. Che, W. Zhu, E. S. Poh, X. Zhang, and X. Zhang, "The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures," Journal of Alloys and Compounds, vol. 507, no. 1, pp. 215-224, 2010.
[11] H.-T. Lee and Y.-H. Lee, "Adhesive strength and tensile fracture of Ni particle enhanced Sn–Ag composite solder joints," Materials science and engineering: A, vol. 419, no. 1-2, pp. 172-180, 2006.
[12] G. Ren and M. N. Collins, "The effects of antimony additions on microstructures, thermal and mechanical properties of Sn-8Zn-3Bi alloys," Materials & Design, vol. 119, pp. 133-140, 2017.
[13] H.-T. Lee, M.-H. Chen, H.-M. Jao, and C.-J. Hsu, "Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints," Journal of electronic materials, vol. 33, no. 9, pp. 1048-1054, 2004.
[14] H.-T. Lee, H.-S. Lin, C.-S. Lee, and P.-W. Chen, "Reliability of Sn–Ag–Sb lead-free solder joints," Materials Science and Engineering: A, vol. 407, no. 1, pp. 36-44, 2005/10/25/ 2005.
[15] D.-s. Jiang, Y.-p. Wang, and C. Hsiao, "Effect of minor doping elements on lead free solder joint quality," in 2006 8th Electronics Packaging Technology Conference, 2006, pp. 385-389: IEEE.
[16] A. El-Daly, H. El-Hosainy, T. Elmosalami, and W. Desoky, "Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying," Journal of Alloys and Compounds, vol. 653, pp. 402-410, 2015.
[17] J.-C. Zhao, "Reliability of the diffusion-multiple approach for phase diagram mapping," Journal of materials science, vol. 39, no. 12, pp. 3913-3925, 2004.
[18] J.-C. Zhao, "The Diffusion-Multiple Approach to Designing Alloys," Annual Review of Materials Research, vol. 35, no. 1, pp. 51-73, 2005.
[19] J.-C. Zhao, "A combinatorial approach for efficient mapping of phase diagrams and properties," Journal of Materials Research, vol. 16, no. 06, pp. 1565-1578, 2011.
[20] V. Abbasi Chianeh, H. R. Madaah Hosseini, and M. Nofar, "Micro structural features and mechanical properties of Al–Al3Ti composite fabricated by in-situ powder metallurgy route," Journal of Alloys and Compounds, vol. 473, no. 1-2, pp. 127-132, 2009.
[21] Z. Fathian, A. Maleki, and B. Niroumand, "Synthesis and characterization of ceramic nanoparticles reinforced lead-free solder," Ceramics International, vol. 43, no. 6, pp. 5302-5310, 2017.
[22] M. Todai et al., "Effect of building direction on the microstructure and tensile properties of Ti-48Al-2Cr-2Nb alloy additively manufactured by electron beam melting," Additive Manufacturing, vol. 13, pp. 61-70, 2017.
[23] C. Wu, M. Huang, J. Lai, and Y. Chan, "Developing a lead-free solder alloy Sn-Bi-Ag-Cu by mechanical alloying," Journal of electronic materials, vol. 29, no. 8, pp. 1015-1020, 2000.
[24] S.-W. Chen, C.-H. Wang, S.-K. Lin, and C.-N. Chiu, "Phase Diagrams of Pb-Free Solders and their Related Materials Systems," Journal of Materials Science: Materials in Electronics, vol. 18, no. 1-3, pp. 19-37, 2006.
[25] I. Karakaya and W. Thompson, "The Ag-Sn (silver-tin) system," Bulletin of Alloy Phase Diagrams, vol. 8, no. 4, pp. 340-347, 1987.
[26] U. r Kattner and W. J. Boettinger, "On the Sn-Bi-Ag ternary phase diagram," Journal of Electronic Materials, vol. 23, no. 7, pp. 603-610, 1994.
[27] A. McAlister and D. Kahan, "The Al− Sn (Aluminum-Tin) System," Journal of Phase Equilibria, vol. 4, no. 4, pp. 410-414, 1983.
[28] N. Saunders and A. Miodownik, "The Cu-Sn (copper-tin) system," Bulletin of Alloy Phase Diagrams, vol. 11, no. 3, pp. 278-287, 1990.
[29] J. Shim, C.-S. Oh, B. Lee, and D. Lee, "Thermodynamic assessment of the Cu-Sn system," Z Metallkd, vol. 87, no. 3, pp. 205-212, 1996.
[30] W. J. Boettinger, C. A. Handwerker, and U. R. Kattner, "Reactive wetting and intermetallic formation," in The mechanics of solder alloy wetting and spreading: Springer, 1993, pp. 103-140.
[31] C. Schmetterer et al., "A new investigation of the system Ni–Sn," Intermetallics, vol. 15, no. 7, pp. 869-884, 2007.
[32] J. Yu and J. Kim, "Effects of residual S on Kirkendall void formation at Cu/Sn–3.5 Ag solder joints," Acta Materialia, vol. 56, no. 19, pp. 5514-5523, 2008.
[33] T. Heumann, "The equilibrium state in the Ni-Sn system," Z. Metallkd., vol. 35, pp. 206-211, 1943.
[34] P. Rahlfs, "Die Kristallstruktur des Ni3Sn (Mg3Cd-Typ= Überstruktur der hexagonal dichtesten Kugelpackung)," Metallwirtschaft, Metallwissenschaft, Metalltechnik, vol. 16, pp. 343-345, 1937.
[35] B. Predel and W. Schwermann, "Constitution and thermodynamics of antimony-tin system," Journal of the Institute of Metals, vol. 99, no. JUN, pp. 169-+, 1971.
[36] B. Jönsson and J. Ågren, "Thermodynamic assessment of Sb–Sn system," Materials Science and Technology, vol. 2, no. 9, pp. 913-916, 1986.
[37] B.-J. Lee, "Thermodynamic assessments of the Sn-Zn and In-Zn binary systems," Calphad, vol. 20, no. 4, pp. 471-480, 1996.
[38] H. Ohtani, M. Miyashita, and K. Ishida, "Thermodynamic study of phase equilibria in the Sn-Ag-Zn system," Journal of the Japan Institute of Metals(Japan), vol. 63, no. 6, pp. 685-694, 1999.
[39] G. Pharr and W. Oliver, "Measurement of thin film mechanical properties using nanoindentation," Mrs Bulletin, vol. 17, no. 7, pp. 28-33, 1992.
[40] X. Li and B. Bhushan, "Development of a nanoscale fatigue measurement technique and its application to ultrathin amorphous carbon coatings," Scripta Materialia, vol. 47, no. 7, pp. 473-479, 2002/10/01/ 2002.
[41] X. Deng, N. Chawla, K. K. Chawla, and M. Koopman, "Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation," Acta Materialia, vol. 52, no. 14, pp. 4291-4303, 2004.