因電子封裝之結構測試與破壞性試驗需要花費大量的時間和資源，加上現今電腦效能之進步，普遍上利用電腦模擬分析來代替傳統試驗，但因結構複雜，需耗費時間與高度的電腦效能，增加研發所需成本，且品質亦不盡理想。為能盡量減低額外資源消耗，並達成本、時程的節省及兼顧良好模擬品質，本研究中擬應用等效均質法及最佳化方法，用以縮短數值模擬時間及優化產品設計來提升效率。等效均質方法是將繁雜之複合材料性質轉換為均質的材料體使模擬分析時間有效縮短而提高效率。另外提出修正方法來提升等效參數之代表性，並藉由類神經網路來整合界面接角應力強度因子的計算，結合最佳化法模擬得到優良配置，達到二次效率及效能的提昇。

Since the tests of electronic packages usually require a large amount of time and resource, computer simulation is usually considered instead of traditional tests. However, due to the complexity of the structure in electronic packages, highly-efficient computers are needed, but this doesn’t ensure the quality of analysis and may increase the cost. In order to avoid unnecessary efforts on analyzing, and to improve the result, equivalent moduli and optimization method are chosen to shorten the time spent on analysis and increase the efficiency in this research. The concept of equivalent moduli is to homogenize those composite materials with complicated properties into effective homogeneous material with simpler mechanical properties, and therefore to reduce the amount of time for analysis. Besides, a correction method is also proposed to strengthen the correctness of the effective material properties, and by artificial neural network the calculation of stress intensity factor (SIF) is also integrated. Utilizing the optimization method, we may find the optimal placement for the components on the package.

ANSYS 10.0 Documentation : ANSYS Element Reference.
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