隨著半導體元件輕薄短小的趨勢，在封裝製程中所產生的翹曲（warpage）與托盤偏移（paddle-shift）問題也日益受到重視。以往研究中，大部分均認為造成IC構裝元件翹曲的主要原因為構成材料之熱膨脹係數不同所造成的不均勻體積收縮，卻因此忽略了環氧樹脂（EMC）本身固化收縮的材料特性，因而造成利用電腦模擬分析時，容易低估成品翹曲量。本文將同時考量環氧樹脂之固化效應與溫度效應所造成的體積收縮，以建立一套分析封裝體翹曲的分析方法。在研究中用來描述環氧樹脂行為的關係式為P-V-T-C關係式，也就是將環氧樹脂因固化效應所造成的體積收縮行為表示成壓力（pressure）、體積（volume）、溫度（temperature）、熟化率（degree of cure）相關之方程式。而溫度效應所造成的環氧樹脂體積收縮量則考慮是由於構成封裝體的材料之熱膨脹係數不同所造成。
本文亦提出解決方案來預測於IC封裝充填製程所發生的托盤偏移現象。托盤偏移泛指導線架與晶片的變形偏移，過大的偏移可能會降低封裝體對於內部元件的保護效果，甚至還會影響到金線的偏移量。本文將建立一種分析方法來預測托盤偏移的程度，首先進行三維之封裝模擬以獲得膠體之流動波前與壓力分佈，接著自封裝模擬之結果檔中擷取不同歷程時導線架與晶片所受到來自塑料的壓力，並且將此壓力轉換到結構變形分析中以作為受力來源，最後即可獲得封裝體中托盤變形的程度。
在本文的最後則經由實際的工程案例來加以驗證所建立之分析方法的可行度，經由比對驗証實驗的結果與模擬分析的結果，証實本文所建立的翹曲分析方法與托盤偏移方法不僅具有經濟效益，亦有相當不錯的準確度。

Warpage problems play an important role in IC encapsulation processes. Previous researchers had focused on warpage analyses with temperature changes between constituent materials and neglected the cure shrinkage effects. However, more and more studies indicate that estimation of warpage according to CTE (Coefficient of Thermal Expansion) was not able to predict the amount of warpage in IC packaging. The EMC properties were obtained by various techniques: degree of cure by differential scanning calorimeter (DSC), modulus by P-V-T-C testing machine. These experimental data were used to formulate P-V-T-C equation.
The purpose of this study was to find out the method of warpage estimation due to P-V-T-C equation of EMC. In this study, mold filling analyses were conducted to predict cure content within models. Predicted warpage values were compared with experimental and numerical results.
With thorough investigation, the result showed that cure shrinkage of epoxy was a significant parameter for IC packaging warpage estimation. The P-V-T-C equation was successfully implemented to verify that warpage was governed by thermal shrinkage and cure shrinkage.
A methodology for computational modeling and prediction of paddle shift was also presented in this thesis. The methodology was based on modeling the flow of the polymer melt around the leadframe and paddle during the filling process, and extracting the pressure loading induced by the flow around the paddle. The pressure loading at different times during the filling stage was then applied to a three-dimensional, static, structural analysis module to determine the corresponding paddle deflections at those times.
By comparing the experimental results and simulation results, it was shown that the analytic simulation with decoupled flow and structure analyses could achieve good accurate and efficient prediction of paddle shift phenomena.

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