本論文應用分離式霍普金森壓縮桿 (split Hopkinson pressure bar, SHPB) 實驗設備來進行Sn63Pb37、SAC105以及SAC305銲錫材料的動態衝擊實驗，實驗之應變率範圍為1,000 ~ 3,000 s-1。
SHPB增溫實驗的測試溫度為室溫、60℃以及90℃，實驗用之試片在製造過程中則是以爐冷方式來進行冷卻。
為了提高實驗的準確性，在實驗過程中也嘗試以一些方法來減少溫度上升後所帶來的影響。
在銲錫材料的應力指數計算方面，是以高應變率實驗以及擬靜態壓縮實驗的數據來進行計算，藉此來觀察三種銲錫材料的特性。
結果顯示，銲錫材料的應力指數數值，會隨著測試溫度的上升而變小。
計算比較銲錫材料試片在5 %、10 %、15 %以及20 %應變所對應的應力指數，可以發現，5 %應變所對應的應力指數數值會大於10 %、15 %以及20 %應變所對應的應力指數數值，並隨著試片應變百分比的增加而呈現出逐步下降的趨勢。

The mechanical properties of Sn63Pb37, SAC105 and SAC305 solders have been measured at high strain rates (1,000 ~ 3,000 s-1) using SHPB (split Hopkinson pressure bar) apparatus.
Specimens were produced by quenching in air from the melt. Measurements were made at room temperature, 60 and 90 degrees Centigrade.
For better accuracy, we utilized some techniques to decrease the effects caused by temperature rising.
In order to find the stress exponents of solders, we measured the quasi-static properties of solder materials and use the results of both high and low strain rate tests to calculate the stress exponents.
The results showed that the elevated temperatures had effect on the stress exponents of solders. The higher test temperature will cause the value of stress exponent down.
In high strain rate tests (2,000 ~ 3,000 s-1), the Sn63Pb37, SAC105 and SAC305 solders all had obviously temperature dependency.
Observing the stress exponents of solders characterized at 5 %, 10 %, 15 % and 20 % strain, we can find that the value of stress exponent will change with different strains.

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