微機電系統之製作，為了避免過度的試做及時間的浪費，應用電腦輔助設計是很重要的。藉由專家的經驗所建立的軟體環境，來建構虛擬原型的開發與環境測試，使設計者能大幅度縮減產品開發的時間。然而，現有微機電系統輔助軟體普遍存在一些問題，例如製程能力不一、元件分析過度強調3D的分析、忽略結構安全之需求以及成本昂貴等。
本論文主要是以製程模擬以及機電耦合分析方法為研究主體，提出合理的設計方法與流程。希望改善現有商用軟體的一些不足之處，並提供製程模擬以及機電耦合的分析能力。本論文將探討三個重要主題，首先，提出合理的系統分析方法，使得結構性能以及結構安全能同時兼顧。第二部分，將藉由實體模擬的概念將製程模擬實現，並提供一製程模擬器。第三部分，我們提出了兩種不同的方法分析機電耦合的問題，並針對樑的結構做了一系列的分析研究。兩種方法分別提供一快速且初步的分析結果以及較精確的分析結果。
根據上述的研究以及模擬分析結果，我們提出了較為合理的微機電系統分析方法。另外，對於製程模擬來說，我們提供了相較現有軟體相同甚至更廣泛的製程模擬技術。最後，對於機電耦合的分析結果，也可以顯示兩種方法都有其適用性。本論文可提供微機電系統部份的模擬與分析能力，並且建立合理的微機電系統模擬架構以提供後續的研究。

Computer aided design (CAD) is a key issue in development for all engineering products. In MEMS, it is important to reduce the lead-time and to accelerate the product development by CAD.As a result, the development of MEMS CAD has significant contributions to the MEMS industry.
However, the current commercialized MEMS CAD are extremely expansive and the most of their analysis modules can be actually replaced by other cheaper or free FEM or BEM utilities. In spite of accuracy ,their 3-D approach represents a higher computational cost and a less flexible in initial design phase. In this thesis, we like to develop our own MEMS CAD by integrating the lab owned solid modeling and FEM utilities with academic developed free-licensed solvers to improve these issues.
A fabrication complier has been developed to convert user’s fabrication flow to 3-D virtual MEMS devices using SDRC I-DEAS solid moduler and has been successfully demonstrated through a DMD fabrication procedure. Commercialized FEM software ABAQUS and the academic developed free-licensed electrostatic solver FASTCAP have been integrated together to form the electromechanical coupling analysis solvers. It is found that in most situations, including pull-in, this solver yields the same results with those obtained by the 3-D MEMCAD COSOLVER. In parallel, a simplified electromechanical coupling model by considering only the mechanical response has also developed by FEM with a FORTRAN distribuated load subroutine. This model yields similar but less accurate results. Nevertheless, this solver is still an efficient method for fast general parametric study in conceptual design phase.
The fabrication simulator and the electromechanical coupling solver developed in this thesis can be easily implemented using lad-owned facilities. Therefore they represent a low cost solution for MEMS analysis for specific fields. In addition, these utilities are also served as the frame for building our own MEMS CAD in the future.

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