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研究生：	林煜斌 Lin, Yu-Ping
論文名稱：	鎳鈀金PPF釘架銲線製程的研究 Study of wire bonding process for NiPdAu PPF leadframe
指導教授：	周榮華 Chou, Jung-Hua
學位類別：	碩士 Master
系所名稱：	工學院 - 工程科學系碩士在職專班 Department of Engineering Science (on the job class)
論文出版年：	2006
畢業學年度：	94
語文別：	英文
論文頁數：	116
中文關鍵詞：	鎳鈀金PPF，田口實驗設計，變異數分析
外文關鍵詞：	analysis of variance, NiPdAu PPF, Taguchi design of experiment
相關次數：	點閱：104 下載：26
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查詢本校圖書館目錄查詢臺灣博碩士論文知識加值系統勘誤回報

由於環保意識的抬頭，故目前在半導體工業已廣泛地使用減少塑膠封裝電鍍製程
的預鍍鎳鈀金基板，作為綠色產品元件。本研究針對半導體構裝中鎳鈀金PPF釘架在
銲線製程中對釘腳銲線能力的探討，將相關影響銲線能力的鎳鈀金厚度條件、銲針
(capillary)尺寸、金線、製程條件及參數，使用田口實驗設計及變異數分析，透過實
驗的過程配合JUMP及MINITAB軟體進行分析，同時分析金線銲線在鎳鈀金釘腳上的
魚尾銲接形成；再者針對鎳鈀金PPF釘架金屬微結構及表層成份分析，且探討影響釘
腳銲線能力相關之鎳鈀金PPF釘架表層結構，以了解釘架製造與銲線製程的影響性進
而評估封裝時釘架品質控管的方法，然後成功得構建出銲線製程最佳組
合，有助於有效處理其他半導體構裝在鎳鈀金釘架銲線的問題。
在這研究中得到最佳鎳鈀金金屬層的厚度,金與鈀較大的厚度能有較好的抗氧化能力, 銲線參數使用大的接觸力量和小的超音波能量,相對硬的金線, 和14°的FA(face angle)和OR(outer radius) 0.5µm的銲針尺寸在鎳鈀金PPF釘架上均有較佳的銲線強度。針對魚尾的接觸形成在鎳鈀金預鍍釘架上，它發生在金魚尾銲點與鎳鈀金薄金層上。

Because of the growing environmental consciousness, NiPdAu PPF leadframe that eliminates plating process of plastic package is already used widely in semiconductor industry at present, as a green products component. The research is to study crescent bonding bondability on the inner finger of NiPdAu PPF leadframe. Through Taguchi methods and analysis of variance are used to evaluate related matters that influence crescent bonding bondability including thickness condition of NiPdAu, capillary dimension, gold wire type, process condition, bonding parameter. The software packages JUMP and MINITAB are used to analyze through the course of the experiment. In the mean time, the bonding formation of gold crescent bond on the inner finger of NiPdAu PPF leadframe is also examined. Thus, metal microstructure and surface morphology of NiPdAu PPF leadframe which might influence crescent bonding bondability on the inner finger can be understood. Through this study, an optimized bonding process to achieve good crescent bond bondability is obtained.

TABLE OF CONTENTS
     Page
Content	I
List of Tables	V
List of Figures	VIII
中文介紹	一
      第一章   背景與動機	一
      第二章   文獻探討	三
第三章   設計與方法	四
第四章   結果與討論	五
第五章   結論與建議	七
Chapter
   1 Introduction	1
   1.1 Background and Motivations	1
1.1.1 NiPdAu PPF leadframe process versus silver plating leadframe	2
            1.1.2 Crescent bond failure mechanisms	7
   1.2 Objectives	15
   1.3 Process	15
            1.3.1 Comparison of material analysis for three suppliers of NiPdAu 
                 PPF leadframe	16
   2 Literature Review	21
   3 Design and Methodology	26
   3.1 Wire bond process	26
   3.2 Bond pull test	31
   3.3 DOE (Design of experiment)	33
   3.4 ANOVA (Analysis of Variance)	36
   3.5 Material and surface morphology analysis	39
   4 Results and Discussion	41
       4.1 Evaluate wire-bonding bondability for the thickenss of metal layer of
          NiPdAu PPF leadframe through design of experiment method	41
            4.1.1 1st time DOE implementation for NiPdAu PPF leadframe	42
            4.1.2 2nd time DOE implementation	46
       4.2 Evaluation of bonding parameter and heat treatment	56
            4.2.1 Evaluation result of bonding parameter effect on the crescent 
                 bonding bondability for Ag plated and NiPdAu PPF L/F    
            run on K&S 1488 bonder with and without heat treatment	59
       4.2.2 Evaluation result of heat treatment effect on the crescent 
            bonding bondability for Ag plated and NiPdAu PPF L/F 
            run on K&S 1488 bonder	64
       4.2.3 Evaluation result of bonding parameter effect on the crescent 
            bonding bondability for Ag plated and NiPdAu PPF L/F 
            run on K&S 8028 bonder with and without heat treatment	68
       4.2.4 Evaluation result of heat treatment effect on the crescent
            bonding bondability for Ag plated and NiPdAu PPF L/F 
            run on K&S 8028 bonder 	74
            4.2.5 Evaluation result of bonding parameter effect on the crescent 
            bonding bondability for Ag plated and NiPdAu PPF L/F 
            run on ASM AB339 bonder with and without heat treatment	77
       4.2.6 Evaluation result of heat treatment effect on the crescent 
            bonding bondability for Ag plated and NiPdAu PPF L/F
            run on ASM AB339 bonder	82
            4.2.7 Verification of the reason of the variation of bonding bondability 
                 of NiPdAu PPF inner finger without and with heat treatment 
                 at 200°C, 1 hour, through surface analysis of EDS for 28L 
            SSOP 160*180mm	86
       4.3 Evaluate wire-bonding bondability for capillary dimension through 
     design of experiment method	87
          4.3.1 Capillary comparison of PCC and ECC capillary	88
             4.3.2 DOE result for PCC capillary	90
             4.3.3 DOE result for ECC capillary	91
        4.3.4 Dimension measurement of crescent bond	93
        4.3.5 Reconfirmation run for PCC and ECC capillary	96
     4.4 The effect of bonding bondability for different kinds of gold wire	99
       4.5 Contact formation analysis for crescent bond on NiPdAu PPF leadframe 
 	through metal microstructure and surface morphology analysis	104
   5 Conclusions and Suggestions	113
   Reference	115
 
LIST OF TABLES
Table                                                               Page
    1-1    Impurities that lead to weak bonds	10
    1-2    Microhardness of each metal layers for different leadframe
           manufactures	18
    3-1    Wire bonding cycle	27
    3-2    Taguchi’s Orthogonal Array L18 (21 × 37)	34
    3-3    S/N ratio definition	35
    3-4    ANOVA table	37
    4-1    Main variable factors and its level	42
    4-2    Noise factor definition for 1st time DOE	42
    4-3    DOE matrix and mean pull strength for 1st time DOE	43
    4-4    Mean and SN ratio for 1st time DOE	43
    4-5    Optimized thickness composition for 1st time DOE	44
    4-6    Noise factor definition for 2nd time DOE	46
    4-7    DOE matrix and mean pull strength without heat treatment 
for 2nd time DOE	46
    4-8    DOE matrix and mean pull strength with heat treatment 
for 2nd time DOE	47
    4-9    Mean and SN ratio without heat treatment for 2nd time DOE	47
    4-10   Mean and SN ratio with heat treatment for 2nd time DOE	48
    4-11   Optimized thickness composition without heat treatment for 2nd DOE	49
    4-12   Optimized thickness composition with heat treatment for 2nd DOE	49
    4-13   Comparison between reconfirmation run and predicted data	52
    4-14   Bonding parameter defined	57
    4-15   Actual bonding parameter defined for each bonder type	57
    4-16   Summary for one-way ANOVA result of Ag plated leadframe	58
    4-17   Summary for one-way ANOVA result of NiPdAu PPF leadframe	58
    4-18   SEM photo of crescent bond profile without heat treatment 
on K&S 1488 bonder	61
    4-19   SEM photo of crescent bond profile with heat treatment 
on K&S 1488 bonder	64
    4-20   SEM photo of crescent bond profile without heat treatment 
on K&S 8028 bonder	70
    4-21   SEM photo of crescent bond profile with heat treatment 
on K&S 8028 bonder	73
    4-22   SEM photo of crescent bond profile without heat treatment 
on ASM AB339 bonder	79
    4-23   SEM photo of crescent bond profile with heat treatment 
on ASM AB339 bonder	82
    4-24   Material analysis result of leadframe between with and without 
heat treatment	86
4-25   Main variable factor and its level	88
    4-26   Noise factor definition	88
    4-27   Comparison result between PCC and ECC capillary	89
    4-28   DOE matrix and result for PCC capillary	90
    4-29   DOE matrix and result for ECC capillary	91
    4-30   Thickness and width of crescent bond for each cell	94
    4-31   Reconfirmation data for different bonder and capillary	97
    4-32   Bonding parameter of K&S 8028 bonder	99
    4-33   Mechanical characteristic of gold wire	99
    4-34   Measurement of mechanical characteristic for gold wire	100
    4-35   One-way ANOVA analysis for different kinds of gold wire	102
    4-36   Thickness range of NiPdAu leadframe	105
4-37   FIB positions of different wire bonder	105
    4-38   Results of metal layer measurement for ASM AB339 bonder	107
    4-39   Results of metal layer measurement for K&S 1488 bonder	107
    4-40   Results of metal layer measurement for K&S 8028 bonder	107


 
LIST OF FIGURES
Figure                                                              Page
    1-1    Leadframe manufacture process for slivers plating and NiPdAu
           pre-plating leadframes	2
    1-2    IC assembly process for Ag plating and NiPdAu pre-plating 
           leadframes	.3
    1-3    Comparison of plating layers structures between Sn finished and
           NiPdAu PPF packages	4
    1-4    Palladium based PPF leadframe structures	5
    1-5    Function of each metal layer	5
1-6    Typical lift crescent bond that the whole heel has been removed from 
           the leadframe surface	8
    1-7    Typical heel break failure with the rim of gold left on the finger 	8
    1-8    Build-up on capillary	9
    1-9    Crescent bond due to inner lead plating peeling photos by SEM	10
    1-10   (a) SEM photo showing a Pd-plating peeling on inner lead and (b) EDS
           result validates the exposed Nickel element	11
    1-11   (a) Optical photos showing the dull appearance of NiPdAu leadframe 
     samples that would generate poor bondability. SEM photos (b), (c), (d) 
           showing bad surface condition. (e) EDS result revealed the presence
           of element Nickel at inner lead surface	11
1-12	(a) affected silver plated leadframe, (b) ESCA result of good bonding, 
(c) ESCA result of poor bonding	13
1-13   ESCA result between (a) good and (b) poor bonding on NiPdAu
	leadframe	14
1-14	   (a) poor and (b) good bonding surface of sliver-plated leadframe 
	by SEM	14
    1-15   Crescent bond on the inner lead of NiPdAu PPF leadframe each 
	direction for 16L TSSOP package	15
    1-16   Bond pull strength on crescent bond for three kinds of leadframe
	manufacturer	16
    1-17   Energy Dispersive Spectrometer (EDS) analysis: (a) element weight
 	and (b) atomic concentration ratio (sputtering energy: 5KV and 15KV)	17
    1-18   SEM photo of surface morphology of (a) S-700Q (b) Q-400F 
           (c) A-100M	17
1-19   Comparison of each metal thickness of NiPdAu PPF leadframes
           from different manufacturers	19
    1-20   The flow chart of this research	20
    2-1    Bond quality at 1100K bond Cu and PPF	22
    2-2    Pull test method	23
    2-3    Comparison of second bond pull strength on various plated leadframes
           (1) Pd/Ni, (2) Au/Pd/Ni, (3) Ag	24
    2-4    Analysis charts and elements conditions on their surface by AES 
	after heating at 300°C for 30 min	24
    3-1    Wire bonding mechanism	26
    3-2    Wire bonding profile including 1st bond, 2nd (crescent bond), wire loop	30
    3-3    Wire bonders used and their ultrasonic energy frequencies	30
    3-4    Capillary features	31
    3-5    Pull test profile	32
    3-6    Pull position close to crescent bond	32
    3-7    Broken position definition	33
    3-8    Procedure of Taguchi’s design	36
    4-1    Flow chart of experiment	41
    4-2    Response profile for 1st time DOE	43
    4-3    Mean predicted plot for 1st time DOE	44
    4-4    Analysis of variance for response mean for 1st time DOE	44
    4-5    Effect test for response mean for 1st time DOE	44
    4-6    SN predicted plot for 1st time DOE	45
    4-7    Analysis of variance for response SN for 1st time DOE	45
    4-8    Effect test for response SN for 1st time DOE	45
    4-9    Response profile without heat treatment for 2nd time DOE	48
    4-10   Response profile with heat treatment for 2nd time DOE	48
    4-11   Mean predicted plot without heat treatment for 2nd time DOE	49
    4-12   Mean predicted plot with heat treatment for 2nd time DOE	49
    4-13   ANOVA for response mean without heat treatment for 2nd time DOE	50
4-14   ANOVA for response mean with heat treatment for 2nd time DOE	50
    4-15   Effect test for response mean without heat treatment for 2nd time DOE	50
    4-16   Effect test for response mean with heat treatment for 2nd time DOE	50
    4-17   SN predicted plot without heat treatment for 2nd time DOE	51
    4-18   SN predicted plot with heat treatment for 2nd time DOE	51
    4-19   Analysis of variance for response SN without heat treatment 
           for 2nd time DOE	51
    4-20   Analysis of variance for response SN with heat treatment
           for 2nd time DOE	51
    4-21   Effect test for response SN without heat treatment for 2nd time DOE	52
    4-22   Effect test for response SN with heat treatment for 2nd time DOE	52
    4-23   Descriptive statistics of reconfirmation run of NiPdAu thickness DOE	53
  4-24   SEM photo of crescent bond profile of NiPdAu PPF leadframes without 
         heat treatment, (a) before pull test and (b) after pull test, 
           for K&S 1488 bonder	54
  4-25   SEM photo of crescent bond profile of NiPdAu PPF leadframes with 
         heat treatment, (a) before pull test and (b) after pull test, 
           for K&S 1488 bonder	54
  4-26   SEM photo of crescent bond profile of NiPdAu PPF leadframes without 
         heat treatment, (a) before pull test and (b) after pull test, 
           for K&S 8028 bonder	54
  4-27   SEM photo of crescent bond profile of NiPdAu PPF leadframes with 
         heat treatment, (a) before pull test and (b) after pull test, 
           for K&S 8028 bonder	55
  4-28   SEM photo of crescent bond profile of NiPdAu PPF leadframes without 
         heat treatment, (a) before pull test and (b) after pull test, 
           for ASM AB339 bonder	55
  4-29   SEM photo of crescent bond profile of NiPdAu PPF leadframes with heat
         treatment, (a) before pull test and (b) after pull test, 
           for ASM AB339 bonder	55
    4-30   Bonding mechanism of crescent bond	56
    4-31   One-way analysis of bonding parameter for Ag plated L/F without heat
           treatment on K&S 1488 bonder	59
  4-32   Broken point distribution for Ag plated L/F without heat treatment 
           on K&S 1488 bonder	60
    4-33   One-way analysis of bonding parameter for NiPdAu PPF L/F 
           without heat treatment on K&S 1488 bonder	60
  4-34   Broken point distribution for NiPdAu PPF L/F without heat 
           treatment on K&S 1488 bonder	61
    4-35   One-way analysis of bonding parameter for Ag plated L/F with heat
           treatment on K&S 1488 bonder	62
  4-36   Broken point distribution for Ag plated L/F with heat treatment 
           on K&S 1488 bonder	62
    4-37   One-way analysis of bonding parameter for NiPdAu PPF L/F 
           with heat treatment on K&S 1488 bonder	63
  4-38   Broken point distribution for NiPdAu PPF L/F with heat 
           treatment on K&S 1488 bonder	63
    4-39   One-way analysis of pull strength, (a), (b) and (c) for Ag plated L/F 
           with and without heat treatment on K&S 1488 bonder	65
    4-40   One-way analysis of pull strength, (a), (b) and (c) for NiPdAu PPF L/F 
           with and without heat treatment on K&S 1488 bonder	66
    4-41   One-way analysis of bonding parameter for Ag plated L/F without heat
           treatment on K&S 8028 bonder	68
  4-42   Broken point distribution for Ag plated L/F without heat treatment 
           on K&S 8028 bonder	69
    4-43   One-way analysis of bonding parameter for NiPdAu PPF L/F without 
           heat treatment on K&S 8028 bonder	69
  4-44   Broken point distribution for NiPdAu PPF L/F without heat treatment 
           on K&S 8028 bonder	70
    4-45   One-way analysis of bonding parameter for Ag plated L/F with heat
           treatment on K&S 8028 bonder	71
  4-46   Broken point distribution for Ag plated L/F with heat treatment 
           on K&S 8028 bonder	72
    4-47   One-way analysis of bonding parameter for NiPdAu PPF L/F with 
           heat treatment on K&S 8028 bonder	72
  4-48   Broken point distribution for NiPdAu PPF L/F with heat treatment 
           on K&S 8028 bonder	73
    4-49   One-way analysis of pull strength, (a), (b) and (c) for Ag plated L/F 
           with and without heat treatment on K&S 8028 bonder	74
    4-50   One-way analysis of pull strength, (a), (b) and (c) for NiPdAu PPF L/F 
           with and without heat treatment on K&S 8028 bonder	75
    4-51   One-way analysis of bonding parameter for Ag plated L/F without heat
           treatment on ASM AB339 bonder	77
  4-52   Broken point distribution for Ag plated L/F without heat treatment 
           on ASM AB339 bonder	78
    4-53   One-way analysis of bonding parameter for NiPdAu PPF L/F without 
           heat treatment on ASM AB339 bonder	78
    4-54   Broken point distribution for NiPdAu PPF L/F without heat treatment
           on ASM AB339 bonder	79
    4-55   One-way analysis of bonding parameter for Ag plated L/F with heat
           treatment on ASM AB339 bonder	80
  4-56   Broken point distribution for Ag plated L/F with heat treatment 
           on ASM AB339 bonder	80
    4-57   One-way analysis of bonding parameter for NiPdAu PPF L/F with heat
           treatment on ASM AB339 bonder	81
  4-58   Broken point distribution for NiPdAu PPF L/F with heat treatment 
           on ASM AB339 bonder	81
    4-59   One-way analysis of pull strength, (a), (b) and (c) for Ag plated L/F with 
           and without heat treatment on ASM AB339 bonder	83
    4-60   One-way analysis of pull strength, (a), (b) and (c) for NiPdAu PPF L/F 
           with and without heat treatment on ASM AB339 bonder	84
    4-61   Flow of the experiment	87
    4-62   Capillary dimension definition	88
    4-63   Main effects plot of means for PCC capillary	90
    4-64   Interaction plot of means for PCC capillary	90
    4-65   Main effects plot of S/N ratio for PCC capillary	91
    4-66   Interaction plot of S/N ratio for PCC capillary	91
    4-67   Main effects plot of means for ECC capillary	92
    4-68   Interaction plot of means for ECC capillary	92
    4-69   Main effects plot of S/N ratio for ECC capillary	92
    4-70   Interaction plot of S/N ratio for ECC capillary	93
    4-71   Measurement dimension defined	93
    4-72   SEM photo of crescent bond on ASM AB339 bonder	94
    4-73   SEM photo of crescent bond on K&S 1488 bonder	95
    4-74   SEM photo of crescent bond on K&S 8028 bonder	95
    4-75   Optimized capillary dimension	96
    4-76   Descriptive statistic of pull strength for PCC capillary 	97
    4-77   Descriptive statistic of pull strength for ECC capillary	98
    4-78   SEM photo of crescent bond for optimized dimension of capillary (a), 
           (b), (c)	98
    4-79   Tensile stress-strain curves tested by Instron 5542 tensile tester 
	machine for wire diameter 25µm	100
    4-80   Comparison of heat affect zone for different kinds of gold wire
	K1>Y1>NT5	101
    4-81   Box plot of bond pull strength for different kinds of gold wire	102
    4-82   Crescent bond profile for NT5 gold wire	103
    4-83   Crescent bond profile for T1 gold wire	103
    4-84   Crescent bond profile for K1 gold wire	104
    4-85   Thickness of Pd-layer	106
    4-86   Thickness of Ni-layer	106
    4-87   SEM photo of the contact interface of sample 339 with magnification: 
           X30000 (a)339-3 (b)339-6 (c)339-9 (d)339-12	107
    4-88   SEM photo of the contact interface of sample 339 with magnification: 
           X50000 (a)339-3 (b)339-6 (c)339-9 (d)339-12	108
    4-89   SEM photo of the contact interface of sample 1488 with magnification: 
           X30000 (a)1488-3 (b)1488-6 (c)1488-9 (d)1488-12	109
    4-90   SEM photo of the contact interface of sample 1488 with magnification: 
           X50000 (a)1488-3 (b)1488-6 (c)1488-9 (d)1488-12	109
    4-91   SEM photo of the contact interface of sample 8028 with magnification: 
           X30000 (a)8028-3 (b)8028-6 (c)8028-9 (d)8028-12	110
    4-92   SEM photo of the contact interface of sample 8028 with magnification: 
           X50000 (a)8028-3 (b)8028-6 (c)8028-9 (d)8028-12	110
    4-93   SEM photo of contact formation with magnification: X15000K	111
    4-94   TEM photo of contact formation	112

                                    

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校內：2007-08-29公開
校外：2007-08-29公開

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