半導體製程技術不斷精進，電子晶片藉由製程上的突破，造成晶片的導線數不斷增加，使得電子元件單位面積的發熱量急遽升高，另一方面，由於消費者對電子產品變輕、變薄、變小的渴望，使得各種小型電子產品，因為體積縮減及功能與性能不斷提升，導致熱量不斷增加，故「散熱」已經成為現今所面臨的嚴重問題。而傳統的強制對流散熱方式所能達到之散熱量以不足使下一世代的電子系統使用，因此研究探討利用相變化為主要散熱方式之實驗探討。
本研究為能探討單一熱源於微管道內之相變化的現象，因此以微機電製程技術建構一微型加熱器於微管道內。研究中對於汽泡成核、成長、移動之流體現象採用視流觀察方法來探討，此外研究亦比較不同實驗流量與熱通量參數下時對系統之影響。實驗結果顯示，依造實驗參數不同會產生下列四種流體現象：未沸騰狀態、單一汽泡循環、間斷汽泡產生或多重汽泡散布。實驗中也發現，在間斷氣泡產生狀況下，若汽泡成長速度過快，會瞬間阻斷流量，導致流量不穩定或是流量停止的狀況產生。

The heat flux on electronic devices is significantly increasing in various industrial areas such as automobile and computer. A compact heat exchanger consisting of microchannel is a powerful technique for thermal management in electronic devices. In particular, using boiling heat transfer technique in mini- and microchannels has a great potential for use in portable electronic devices because of its large overall heat transfer coefficient.
The focus of this thesis is to study phenomena of thermal bubbles in microchannel. The thermal bubbles are generated by using a micro heater fabricated inside the microchannel by using MEMS technology. In the experiments, flow visualization technique is used to investigate phenomena of thermal bubbles including bubble nucleation, bubble growth, bubble movement and their related flow patterns under different flow rate and heat flux conditions. Experimental results reveal four different flow patterns including no boiling situation, single bubble formation, intermittent bubble formation and multi-bubble formation. When intermittent bubble phenomenon occurs, it is found that the channel will be filled with thermal bubbles, and the flow rate will stop or become unstable.

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