目前半導體及TFT-LCD產業在導入虛擬量測(Virtual Metrology, VM) 系統時，首先必須進行資料收集，虛擬量測系統透過收集製程與量測資料來進行建模及預測。現行資料收集之方式通常必須根據不同產品與製程進行相關邏輯與程式之更改與客製化，這對於將虛擬量測系統快速應用於各式產品與製程是個障礙。本論文研發了一個適用於TFT-LCD產業虛擬量測之通用型資料收集器(Generic Data Collection Driver, GDCD)，當虛擬量測系統安裝了GDCD，使用者可透過GDCD的圖形使用者介面，根據系統需求，快速地建立所需的資料收集配置文件(Data Collection Configuration)；當GDCD剖析資料收集配置文件後，便會連結到所指定之資料庫以擷取所需資料。由於GDCD利用XML技術彈性地進行資料收集之各項配置，而且採用可抽換式模組設計( Pluggable Module Design )，因此具備通用性，將可以快速應用於不同產品、製程與機台。

The first step of conducting Virtual Metrology (VM) systems in the semiconductor and TFT-LCD industries is data collection. The VM system collects process data and metrology data to perform modeling and prediction. The current approach of data collection usually needs to modify and customize the associated logic and program according to different products and processes. This is a barrier for fast applying the VM system to diverse products and processes. This thesis develops a generic data collection driver (GDCD) for virtual metrology in the TFT-LCD industry. When a virtual metrology system is equipped with GDCD, the user can fast create the data collection configuration file via GUI (Graphical User Interface) according to system requirements. The GDCD can parse the loaded data collection configuration file and then connect the assigned databases to acquire the desired data. By using the XML technology for flexible data collection configuration and adopting pluggable module design, GDCD is generic and can be fast applied to a variety of products, processes, and equipment.

[1]"System and Method for Automatic Virtual Metrology," Taiwan R.O.C., U.S., China, Japan, and Korea Patents Pending under applications 97118526; 12/207,706; 200810111271.9; 2009-016051; 2008-137624, respectively.
[2]R.-C. Lin, Generic Virtual Metrology Scheme and System, Master Thesis, Institute of Manufacturing Engineering, National Cheng Kung University, 2006.
[3]Y.-C. Chang and F.-T. Cheng, “Application Development of Virtual Metrology in Semiconductor Industry, in Pro. of the 31st Annual Conference of the IEEE Industrial Electronics (IECON 2005), Raleigh, North Carolina, USA, pp. 124-129, November 2005.
[4]F.-T. Cheng, G.-W. Huang, C.-H. Chen, and M.-H. Hung, "A Generic Embedded Device for Retrieving and Transmitting Information of Various Customized Applications," in Proc. 2004 IEEE International Conference on Robotics and Automation, New Orleans, Louisiana, U.S.A., pp. 978-983, April 2004.
[5]F. Arciniegas, XML Developer’s Guide, ISBN 0-07-212648-5, NY: McGraw-Hill, Inc., June 2002.
[6]D. F. D'Souza and A. C. Wills, Objects, Components, and Frameworks with UML: The Catalysis(SM) Approach, Addson-Wesley Professional, 1998.
[7]G. Booch, J. Rumbaugh, and I. Jacobson, The Unified Modeling Language User Guide, ADDISON-WESLEY, April 2000.
[8]Yen-Chang Lin, A Generic Embedded Device for e-Diagnostics Interface A of Semiconductor Industry, Master Thesis, Institute of Manufacturing Engineering, National Cheng Kung University, 2004.
[9]D. Parsons, A. Rashid, A. Speck, and A. Telea, “A “Framework” for Object Oriented Frameworks Design,” Proceedings of the Technology of Object-Oriented Languages and Systems, p.141, June 07-10, 1999.
[10]E. Gamma, R. Helm, R. Johnson, and J. Vlissides, Design Patterns: Elements of Reusable Object-Oriented Software, Addson-Wesley Professional, 1995.
[11]A. Shalloway and J. Trott, Design Patterns Explained: A New Perspective on Object-Oriented Design, Addison-Wesley Professional, 2001
[12]Jia-Mau Jian, System Framework and Application of Virtual Metrology, Master Thesis, Institute of Manufacturing Engineering, National Cheng Kung University, 2007.
[13]MySQL, MySQL AB [Online]. Available: http://www.mysql.com/
[14]Y.-C. Su, M.-H. Hung, F.-T. Cheng, and Y.-T. Chen, “A Processing Quality Prognostics Scheme for Plasma Sputtering in TFT-LCD Manufacturing,” IEEE Transactions on Semiconductor Manufacturing, vol. 19, no. 2, pp. 183-194, May 2006.
[15]Y.-C. Su, M.-H. Hung, F.-T. Cheng, and T.-P. Lee, "Development of a Data Pre-processing Scheme and Pluggable Application Modules for an Intelligent Equipment Prognostics System," in Proc. the 3rd International IEEE Conference on Industrial Informatics – INDIN’05, Perth, Western Australia, August 2005.
[16]F.-T. Cheng, H.-C. Huang, and C.-A. Kao, “Developing a Dual-Phase Virtual Metrology Scheme,” to appear in IEEE Transactions on Semiconductor Manufacturing, November 2007.
[17]H.-C. Yang, F.-T. Cheng, and D. Huang, "Development of a Generic Equipment Manager for Semiconductor Manufacturing," in Proc. 7th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA’99), Barcelona, Catalonia, Spain, pp. 727-732, October 1999.
[18]SEMI, SEMI E125-0703 Provisional Specification for Equipment Self Description (ESD), Semiconductor Equipment and Materials International, July 2003.
[19]SEMI, SEMI E120-0703 Provisional Specification for the Common Equipment Model (CEM), Semiconductor Equipment and Materials International, July 2003.
[20]W.-M. Wu, Research and Implementation of Virtual-Metrology Precision Enhancement, Master Thesis, Institute of Manufacturing Engineering, National Cheng Kung University, 2006..
[21]Y.-C. Su, F.-T. Cheng, M.-H. Hung, and H.-C. Huang, “Intelligent Prognostics System Design and Implementation,” IEEE Transactions on Semiconductor Manufacturing, vol. 19, no. 2, pp. 195-207, May 2006.
[22]F.-T. Cheng, W.-H. Tsai, T.-L. Wang, J. Chang, and Y.-C. Su, "An Advanced e-Manufacturing Model in the Semiconductor Industry," to appear in IEEE Robotics and Automation Society Magazine.
[23]Y.-T. Huang, F.-T. Cheng, and Y.-T. Chen, “Importance of Data Quality in Virtual Metrology,” in Proc. of The 32th Annual Conference of the IEEE Industrial Electronics Society (IECON 2006), Paris, France, pp. 3727-3732, November 2006.
[24]SEMI, Semiconductor Equipment and Material International. [Online]. Available: http://www.semi.org/
[25]R. L. Nord, “Meeting the Product Line Goals for an Embedded Real-Time System,” in International Workshop on Software Architectures for Product Families, LNCS 1951, pp. 19-29, 2000.