本研究是針對勞委會安全法規「危險性工作場所審查暨檢查辦法」對於半導體廠製程設備機台，在正式運轉生產前之安全評估方法及機台安裝兩個重要時程之安全管理加以探討。有鑑於現有文獻及參考書籍，鮮少對於半導體廠製程設備機台安裝及現行安全法規「危險性工作場所審查暨檢查辦法」是否合乎時宜深入研究。本研究分為兩大部份:(1)現行安全法規「危險性工作場所審查暨檢查辦法」之適法性(2)運用訪談的方式，針對製程設備機台安裝及運轉有實際經驗之工程師，包括半導體廠、機台供應商與廠務承攬商工程師，綜合不同角度之經驗及看法，制定一套完整的製程設備機台安裝安全檢查管理程序。
　　半導體產業具有技術密集、資本密集及高風險的特性。半導體主要製造程序皆在潔淨室內進行，製程中會使用數十種不同具有自燃性、可燃性、毒性、腐蝕與惰性等高危險性質的化學品或氣體。一旦製程單元發生洩漏，將造成工作場所中人員、環境、物料與設備的危害。以往，半導體廠製程設備因為汰舊換新、擴充產能與變換位置等因素裝機，卻在生產壓力下，為縮短影響正常生產時間，未考量整體規劃，這也逐漸增加廠內危害的風險。因此，本研究根據美國斯麥半導體設備和材料國際組織(Semiconductor Equipment and Materials International, SEMI)半導體製程安全評估的方法取代現行方法並結合裝機安全檢核表(Check List)以期望由此改變能使半導體製程機台安全管理更趨完善。

　　The present study investigates on validity of safety regulations and procedures set by the ROC Labor Committee which concern inspection and review methods for hazardous workplaces, especially in semiconductor industry. There have been few literatures reporting on safety evaluation methods and equipment move-in procedures, both of which are crucial steps to be undertaken prior to test run operations.
　　Most of previous studies in semiconductor industry rarely explore the appropriateness of evaluation and inspection methods of hazardous workplaces with regard to semiconductor equipment move-in and existing safety rules. The current study therefore intends to develop new inspection procedures suitable for state-of-the-art IC industry.
　　This study consists of two primary segments:
　　　　1. The validity of existing safety rules for the evaluation and inspection of hazardous workplaces.
　　　　2. Development of a new method based on interviewing semiconductor equipment/tool installers and engineers that are experienced with equipment move-in and test run operations, including semiconductor equipment suppliers and installation subcontractors. The feedback from the personnel involved in different aspects of these operations will facilitate the establishment of the procedures for safety inspections, as well as management of equipment move-in and test run operations.
　　The semiconductor industry is characterized as technology/capital intensive as well as high risk. The primary production processes are conducted in a clean room environment. During the manufacture of wafers, numerous kinds of hazardous chemicals and gases are piped into the cleanroom. These chemicals and gases can be combustible, natural, toxic, corrosive or acidic, and definitely require a special cautious procedure.
　　For many years production lines have been operated around the clock to meet market demands. At the same time there has been a gradual increase in the risk of hazards due to frequent tool replacement and repositioning in order to expand production capacity to meet market demands. It is quite common that equipments/tools are replaced while production lines are still in operation. Such tool move-in procedure requires precise and rapid installation. Any mistake during installation could result in severe damage to the personnel, the environment, materials or equipment.
　　Consequently, the current study intends to further improve tool move-in methods and safety management by replacing existing methods with SEMI (Semiconductor Equipment and Materials International) procedures and use of safety checklists to improve safety during semiconductor tool move-in procedure.

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