現今液晶顯示器產業有時會因為製程上的瑕疵造成液晶顯示器有Mura的缺陷，Mura是指顯示器亮度不均勻，人眼能夠從面板上辨識出顏色差異，可能是一片沒有規則的痕跡，也可能是方方正正很規則的形狀，雖然對使用上不會有太大的影響，但可能會造成產品的價格與美觀程度會有所差異，因此若在製作液晶顯示器製程中的其中一道乾蝕刻製程-反應離子蝕刻RIE(Reactive Ion Etching) 中能夠減少製程上瑕疵將能使Mura的產生減少。

本文用L18(2^1×3^7)直交表做實驗，以此找出蝕刻製程中造成膜厚度不均勻而產生Mura現象之顯著因子為蝕刻時間、RF功率大小、氣體流量，最終選擇最佳參數並執行確認實驗，將異常的參數的干擾縮至最小並讓製程更加優化，經改善後參數MoN Loss Uniformity ratio由33.8%變為12.91%，這代表著MoN的膜厚度更加地均勻，經改善後參數對製程有很大的提升。

Nowadays, liquid crystal displays have Mura defects due to defects in the manufacturing process. Mura refers to the uneven brightness of the display. The human eye can easily recognize the color difference from the panel. It may be an irregular trace or a regular shape. Although it will not have much impact on use, it may cause differences in the price and aesthetics of the product. Therefore, reducing process defects in reactive ion etching will reduce mura.
In this paper, Taguchi method is used to find the best parameters and significant factors affecting characteristics. The L18 orthogonal array is used to find the important factors that affect the quality characteristics. The experimental results show that the significant factors that cause Mura due to uneven thickness during the etching process are etching time, RF power, and gas flow. Finally selecting the best parameters and performing confirmation experiments can minimize the interference of abnormal parameters and optimize the process. After improvement, the MoN Loss Uniformity ratio has changed from 33.8% to 12.91%, which means that the thickness of MoN is more uniform.

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