隨著半導體技術的不斷進步，台灣在IC設計、晶圓代工、IC封裝與測試產業方面已成為全球領先者。然而，面對日益激烈的競爭，產業正朝向高附加價值方向發展。電子產品趨向輕薄小型化，推動IC封裝技術朝向小型化、低成本、高效能和高腳數方向發展。全球封裝技術正從傳統的QFP和BGA，逐漸轉向CSP、WLP、FC，以及最新的CoWoS製程。
在此背景下，電子元件的整體可靠性變得至關重要，特別是IC作為核心組件的角色。錫球在IC與主機板的連接中扮演關鍵角色，其接合強度和特性需嚴格管控。全球環保政策，尤其是無鉛材料的要求，為封裝製程帶來了新的挑戰。本研究聚焦於錫球產品設計的關鍵因素，應用層級分析法（AHP）探討半導體封裝產業中車用電子、記憶體和消費性電子三類客戶的需求。研究目的包括確定設計要素的重要性排序、為製造過程提供指引，以及比較不同客戶群體的需求差異。
研究結果顯示，在不考慮特定族群時，錫球的成份（權重0.600）是最重要的因素，其次是球徑（0.243）、真圓度（0.108）和外觀（0.049）。在不同設計方案中，成份A設計、球徑B設計、真圓度A設計和外觀C設計被評為最佳。當考慮不同產業族群時，研究發現各族群對錫球設計的偏好存在差異。車用電子族群在成份上偏好C設計；球徑B設計；真圓度C設計和外觀A設計，記憶體族群在成份、球徑、真圓度上均偏好A設計和外觀Ｃ設計，消費性電子族群在成份上偏好A設計；球徑、真圓度偏好B設計和外觀C設計。

With the continuous advancement of semiconductor technology, Taiwan has become a global leader in IC design, wafer foundry, IC packaging, and testing industries. However, facing increasingly fierce competition, the industry is moving towards high value-added development. The trend of electronic products becoming lighter, thinner, and smaller is driving IC packaging technology towards miniaturization, low cost, high performance, and high pin count. Global packaging technology is gradually shifting from traditional QFP and BGA to CSP, WLP, FC, and the latest CoWoS process.

In this context, the overall reliability of electronic components has become crucial, especially the role of ICs as core components. Solder balls play a key role in connecting ICs to the motherboard, and their bonding strength and characteristics need to be strictly controlled. Global environmental policies, particularly the requirement for lead-free materials, have brought new challenges to the packaging process. This study focuses on the key factors in solder ball product design, applying the Analytic Hierarchy Process (AHP) to explore the needs of three types of customers in the semiconductor packaging industry: automotive electronics, memory, and consumer electronics. The research aims to determine the importance ranking of design elements, provide guidance for the manufacturing process, and compare the needs of different customer groups.

The results show that, without considering specific groups, the alloy composition of solder balls (weight 0.600) is the most important factor, followed by ball diameter (0.243), roundness (0.108), and appearance (0.049). Among different design options, alloy composition design A, ball diameter design B, roundness design A, and appearance design C were rated as the best. When considering different industry groups, the study found that preferences for solder ball design vary among groups. The automotive electronics group prefers design C for alloy composition, design B for ball diameter, design C for roundness, and design A for appearance. The memory group prefers design A for alloy composition, ball diameter, and roundness, and design C for appearance. The consumer electronics group prefers design A for alloy composition, design B for ball diameter and roundness, and design C for appearance.

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