由於半導體積體電路的快速發展，使得3C產品日新月異，體積小、功能強、更可靠。
以E.M.C.(epoxy molding compound)塑膠封裝的IC元件是組成3C產品最重要零組件之一。塑膠IC封裝元件於製程中所產生的翹曲，一直是業界急欲改善的問題。
依據實驗及文獻，在後熟化製程(process of post mold cure)，產品的翹曲量會比開模時降低。所以本文利用四種軟體：InPack、Moldex3D、ANSYS、Mathematica，計算產品開模時的翹曲量，以及模擬經過後熟化製程後，其翹曲量的變化。
在模擬後熟化過程中，將E.M.C.視為符合廣義麥斯威爾模型的黏彈性體進行分析。IC封裝製程之後E.M.C.未必完全熟化，故於後熟化製程模擬時，藉著同時考慮溫度轉換因子及熟化度轉換因子來調整W.L.F. shift function中相關參數。
同時模擬兩種因子造成的效應，期望達到模擬值與實驗值更加吻合的目的。

Because of the rapid development about semi-conductor integrated circuits, the products of computers, communication, and consumer electronics evolve day by day with tiny size, great performance, and more reliability.
IC packaging components by E.M.C.(epoxy molding compound) are one of the most essential parts of the 3C products. The process induced warpage of plastic IC packaging components is always the problem that industrial fields urge to solve.
According to experiments and reference documents, in the process of post mold cure, the warpage of the products is less than that of the open mold. Four programs - InPack, Moldex3D, ANSYS, and Mathematica included to operate in the treatise calculate the warpage of open mold, and simulate the one after post mold cure process.
In the process of the post mold cure simulation, suppose E.M.C. as viscoelastic body of the generalized Maxwell model and analyze it. E.M.C. might not cure completely after IC packaging process, so when post mold cure process is simulated, consider both temperature and curing degree shift factors to modify the parameters in W.L.F. shift function.
Meanwhile, the effects caused by two factors are simulated, and then expect to achieve more correspondent simulation and experiment values.

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