近來國內眾多半導體廠商紛紛宣布新的投資計劃，欲發展及建造十二吋晶圓廠，預計幾年內約有20多座之十二吋晶圓廠陸續完工。未來幾年我們可預見台灣半導體產業將從過去生產八吋晶圓時代漸漸走向生產十二吋晶圓的時代。回顧過去，我們發現到一個變化，亦即為了擴充在晶圓代工業之優勢以及經濟規模的考量，晶圓廠廠房面積正逐年以不等的倍數擴增。此時就產生了一個問題，隨著工廠面積之擴張，除了增加人員管理之不便，物料搬運距離變長與產品的生產週期可能增加等問題將因應而生，如何規劃一適當廠房佈置，是一個值得深究的議題。本研究以台灣某晶圓廠為案例，目的於探討大型（Large-size）廠房應如何規劃廠房空間，將廠區作一適當佈置，以期提高整座工廠之績效。

　　本研究設計多種廠房佈置方案，且為了使考慮層面更為廣泛與完整，會同時考量多項績效指標，因而發展出一個結合系統模擬與模糊多屬性決策方法的評估模式，來進行各種可行方案的分析與比較，冀望給予半導體公司的佈置執行者在進行廠區規劃時ㄧ個參考之依據。

　The semiconductor manufacturers announced the new investment plans to develop and construct 300mm wafer fabrications successively. It is estimated that more than twenty 300mm wafer fabrications will be complete in a few years. Predictably in the near future, Taiwan semiconductor industries will move from producing 200mm wafer era to 300mm era. Looking at the past, there have a trend namely in order to expand the advantages in the field of foundry service and consider economical scale, consequently there have been tremendous increases in sizes of manufacturing facilities year by year. With the expansion of factory area, it results in long material flow distance and a delayed cycle time than desired. The design of a manufacturing facility with efficient layout will be worth researching. In this paper, a foundry service company is the case that we study to analyze the suitable arrangement of factory layout for large-size wafer fabrication.

　This research intends to develop various alternatives of factory layout and, at the same time, to take multiple performance indexes into account in order to inspire a broader, a more extensive and complete consideration, hence this paper develop a model to evaluate facility layout problem of 300mm wafer fabrication by combining simulation and fuzzy multi-attribute decision making method（FMADM）. It is hoped to provide the executives of the semiconductor companies with some findings and results.

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